Patent application number | Description | Published |
20090032234 | APPARATUS FOR TRANSFERRING HEAT IN A FIN OF A HEAT SINK - An apparatus for dissipating heat through a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins projecting from a first side of the heat dissipating member. Additionally, the apparatus includes a thermal material within at least one fin of the plurality of fins, the thermal material having a thermal conductivity greater than the thermal conductivity of the at least one fin in a direction normal to the first side of the heat dissipating member. Finally, a thermal spreader thermally coupled to the heat dissipating member, the thermal spreader configured to spread heat across the plurality of fins of the heat dissipating member is included. | 02-05-2009 |
20090034204 | APPARATUS FOR TRANSFERRING HEAT FROM A HEAT SPREADER - An apparatus for transferring heat from a heat spreader is provided. The apparatus includes a heat dissipating member and a heat spreading member adjacent the heat dissipating member, the heat spreading member configured to spread heat laterally across the heat dissipating member, the heat spreading member defining a heat conduction plane. The apparatus also includes a base adjacent to the heat spreading member, wherein the heat spreading member is between the base and the heat dissipating member, and at least one thermal via within the heat conduction plane, the thermal via thermally coupled to the heat spreading member, the at least one thermal via thermally coupled to the heat dissipating member and the base through surface-to-surface contact. | 02-05-2009 |
20090122502 | DRIVE MODULARITY - A modular industrial drive system includes a base that receives one or more control modules as a face template. The control modules provide a set of functionalities to the drive system, and the face template serves as a user interface to the drive system. The drive system can include a power module and a control module which define desired functionalities for the system. | 05-14-2009 |
20090289158 | POLE MOUNTING OUTRIGGERS - An outrigger is provided. The outrigger includes an arm including a receiving portion, an arm-strapping yoke pivotally coupled to the receiving portion of the arm, and at least one securing pin received in the arm-strapping yoke. The arm-strapping yoke has at least one engaging edge. The at least one securing pin is configured to force the at least one engaging edge of the arm-strapping yoke into a surface of a structure when a banding strap received in the arm-strapping yoke is tightened around the structure and the at least one securing pin. | 11-26-2009 |
20090307983 | L-SHAPED DOOR WITH THREE-SURFACE SEAL FOR ENDPLATES - A water-resistant and electromagnetic interference shielded enclosure configured to enclose a plurality of electronic components is provided. The enclosure comprises a base having a channel, a first L-shaped door rotatably attached to a first side edge of the base, a second L-shaped door rotatably attached to a second side edge of the base, a door-to-door seal abutted to a flange on the first L-shaped door, and a compressible base-seal inserted into the channel. The compressible base-seal and the door-to-door seal form a three-surface seal when the first L-shaped door and the second L-shaped door are closed. | 12-17-2009 |
20090307984 | L-SHAPED DOORS WITH TRAPEZOIDAL SEAL - A water-resistant and electromagnetic interference shielded enclosure configured to enclose at least one electronic module is provided. The water-resistant and electromagnetic interference shielded enclosure includes a base having a channel, a first L-shaped door rotatably attached to a first edge of the base, a second L-shaped door rotatably attached to a second edge of the base, a flange seal attached to a first flange on the first L-shaped door, and a compressible base-seal inserted into the channel. The compressible base-seal and the flange seal form an enclosure seal when the first L-shaped door and the second L-shaped door are closed. | 12-17-2009 |
20090308572 | APPARATUS FOR ACCEPTING A SELF-DRILLING SCREW - An apparatus for accepting a self-drilling screw is provided. The apparatus comprises a base structure having at least one channel. The at least one channel has a first side, a second side, and a bottom, forming a generally āuā shaped cross section, wherein the first side and the second side are a distance apart such that threads of a self-drilling screw engage with both the first side and the second side when the screw is inserted into the channel. | 12-17-2009 |
20090308631 | SYSTEMS AND METHODS FOR CABLE MANAGEMENT - A method for cable management in an electronics enclosure is disclosed. The method involves extruding at least one length of material that forms a cable guide having a plurality of partitions defined by one or more cable dividers and two end clip flanges, where the end clip flanges each have at least one snap guide and at least one locking clip channel. The method further involves sizing at least one cable guide assembly from the length of material, based on a predetermined length for the cable guide assembly, and preparing one or more ends of the at least one cable guide assembly. | 12-17-2009 |
20090308655 | COMBINATION EXTRUDED AND CAST METAL OUTDOOR ELECTRONICS ENCLOSURE - A method for forming an electronics enclosure is disclosed. The method comprises extruding a backplane having a first extruded length, the backplane comprising slots on opposing sides of the backplane, wherein the slots extend along the first extruded length. The method further comprises extruding at least one door panel at the first extruded length, wherein the backplane and the door panel each have extruded hinge features for pivotally coupling the door panel to the backplane, and coupling at least two cast metal plates to opposing ends of the backplane, where each of the cast metal plates comprise a gland that aligns with the slots of the backplane to create a continuous channel for inserting a seal. | 12-17-2009 |
20090309467 | ANGLED DOORS WITH CONTINUOUS SEAL - In one embodiment, an electronics enclosure is provided. The electronics enclosure comprises a base operable to secure one or more electronic components in place. The base comprises a back wall to which the electronic components are secured; a first end plate extending from a first end of the back wall; and a second end plate extending from a second end of the back wall. The electronics enclosure further comprises a first side wall coupled to a first side of the base and operable to rotate between an open position and a closed position; a second side wall coupled to a second side of the base and operable to rotate between an open position and a closed position; and wherein each of the first and second side walls comprise a first section and a second section which form an angle such that, when in the closed position, the first and second side walls interconnect with each other and together abut the exposed perimeter of the first end plate, the second end plate and the back wall to enclose the one or more electronic components. | 12-17-2009 |
20090310301 | SYSTEMS AND METHODS FOR VENTURI FAN-ASSISTED COOLING - Systems and methods for Venturi fan-assisted cooling of electrical equipment are provided. In one embodiment, a cooling unit for an enclosure housing electronics is provided. The cooling unit comprises: a fan shroud having at least one electrical fan; and a Venturi chamber having a first inlet for receiving a heated airflow from a heatsink, a second inlet for receiving an airflow from a surrounding environment, and an outlet coupled to the fan shroud, the fan drawing air from the Venturi chamber via the outlet when the fan is on. The Venturi chamber comprises a wall for directing the airflow air from the surrounding environment in from the second inlet and across the heated airflow from the heatsink in a manner to as to draw the heated airflow through the heatsink using a Venturi effect, when the fan is on. | 12-17-2009 |
20090310309 | SYSTEMS AND METHODS FOR THERMAL MANAGEMENT - A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclosure, providing a first conductive path from the at least one low-power electronic component to a first heatsink, providing a second conductive path from the at least one high-power electronic component to a second heatsink, dissipating heat generated by the at least one low-power thermally sensitive electronic component and dissipating heat generated by the at least one high-power thermally tolerant electronic component to an environment external to the electrical enclosure by channeling the heat generated by the at least one low-power thermally sensitive electronic component and the at least one high-power thermally tolerant electronic component along the first and second conductive path, respectively. The first and second conductive paths are independent from each other. | 12-17-2009 |
20090310312 | APPARATUS FOR MOUNTING A MODULE AND ENABLING HEAT CONDUCTION FROM THE MODULE TO THE MOUNTING SURFACE - An electronics enclosure is provided. The electronics enclosure includes a heat dissipating body comprising: a heat conducting surface, a first flange adjacent to the heat conducting surface, and a first part of a latch mechanism adjacent to the heat conducting surface. The first part of the latch mechanism is adjacent an edge of the heat conducting surface opposite to the first flange, such that a portion of the heat conducting surface is between the first flange and the first part of the latch mechanism. The electronics enclosure also includes a plurality of electronic modules configured to mount to the heat dissipating body. Each of the plurality of electronic modules comprises: a plurality of electronic components, a heat conducting side configured to contact the heat conducting surface of the heat dissipating body, a second flange adjacent the heat conducting side, the second flange configured to couple with the first flange, and a second part of the latch mechanism adjacent the heat conducting side, the second part of the latch mechanism configured to couple with the first part of the latch mechanism. The second flange and the second part of the latch mechanism are on opposite edges of the heat conducting side. | 12-17-2009 |
20090310326 | CAM SHAPED HINGES - A hinge comprises a first member having a protrusion, wherein the protrusion has a cam profile shape; and a second member having a cavity operable to receive the protrusion, wherein a cam profile shape of the cavity corresponds to the cam profile shape of the protrusion such that, when the protrusion is in a first position, a gap is present between the second member and the protrusion and, when the protrusion is in a second position, substantially no gap is present between the second member and the protrusion. | 12-17-2009 |
20090311463 | SOLAR SHIELDS - Systems and methods for proving solar shields are provided. In one embodiment, a solar shield system comprises at least one solar shield having a first set of snap-fit features positioned on the first solar shield to engage with attachment channels of an enclosure; at least one solar shield cover having a flexible hinge integrated therein, the at least one solar shield cover further comprises a second set of snap-fit features for coupling the at least one solar shield cover with the at least one solar shield; and a plurality of fastening devices for securing the at least one solar shield and the at least one solar shield cover to the attachment channels of the enclosure. | 12-17-2009 |
20090311969 | COMMUNICATION MODULES - A communication module is provided. The module includes at least one transceiver, a filter, a power amplifier, an enclosure, an internal interface and an external interface. The power amplifier is in communication with the at least one transceiver and filter. Moreover, the at least one transceiver, filter and power amplifier are tuned and calibrated to work with each other. The enclosure is configured to physically retain the at least one transceiver, filter and power amplifier. The internal interface is configured to interface connections between the at least one transceiver and the power amplifier and the external interface configured to provided external connections to the module. In addition, the external interface is coupled to the internal interface. | 12-17-2009 |
20090311974 | SUSPENSION METHOD FOR COMPLIANT THERMAL CONTACT OF ELECTRONICS MODULES - A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis. | 12-17-2009 |
20110245976 | SYSTEMS AND METHODS FOR RETRACTABLE FAN COOLING OF ELECTRONIC ENCLOSURES - Systems and methods for a retractable fan cooling system for an electronics enclosure are provided. In one embodiment, a system comprises at least one cooling fan coupled to an electronics enclosure having a heat sink; and a fan positioning mechanism coupled to the at least one cooling fan. When a temperature inside the electronics enclosure is less than a first temperature, the positioning mechanism places the at least one cooling fan into a retracted position that does not inhibit a natural convective air flow across the heat sink. When the temperature inside the enclosure is greater than a second temperature, the positioning mechanism places the at least one cooling fan into an engaged position that produces a forced air flow across the heat sink. | 10-06-2011 |
20110300815 | INTEGRAL LATCH MECHANISMS FOR MOUNTING ELECTRONICS MODULES - In one embodiment, a locking mechanism comprises: a lever-arm-component coupled to a first side of an module and a second side of the module that opposes the first side; the lever-arm-component rotates about a first axis; first and second latching-arm-components including latching-hooks, the first latching-arm-component coupled to the lever-arm-component on the first side and rotating about a second axis that run parallel to and offset from the first axis; the second latching-arm-component coupled to the lever-arm-component on the second side and rotating about the second axis; and a secondary fastener. The first and second axes are oriented in an over-center configuration such that when the lever-arm-component is rotated about the first axis from a first to second position, the second axis will pass through a locking axis and the latching-hooks apply a force against a mechanism of the enclosure that presses the module against a heat sink of the enclosure. | 12-08-2011 |
20120158160 | DRIVE MODULARITY - A modular industrial drive system includes a base that receives one or more control modules as a face template. The control modules provide a set of functionalities to the drive system, and the face template serves as a user interface to the drive system. The drive system can include a power module and a control module which define desired functionalities for the system. | 06-21-2012 |
20120206881 | SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR TELECOMMUNICATIONS ENCLOSURES USING HEAT PIPES - Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe. | 08-16-2012 |
20130301223 | SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR TELECOMMUNICATIONS ENCLOSURES USING HEAT PIPES - Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe. | 11-14-2013 |