Patent application number | Description | Published |
20140061798 | MICROELECTRONIC DEVICE WITH ISOLATION TRENCHES EXTENDING UNDER AN ACTIVE AREA - A microelectronic device including:
| 03-06-2014 |
20140231916 | Transistor with coupled gate and ground plane - An integrated circuit includes a silicon substrate, a ground plane above the substrate, a buried insulator layer above the ground plane, a silicon layer above the buried insulator layer and separated from the ground plane by the buried insulator layer, and an FDSOI transistor. The transistor has a channel adapted for being formed in the silicon layer, a source and drain in and/or on the silicon layer, and a gate covering an upper face of the channel and having a lateral portion covering a lateral face of the channel and above the ground plane. A distance between the lateral portion and the ground plane is not more than three nanometers and at least five times less than a thickness of the buried insulator layer between the ground plane and the silicon layer. The ground plane is separated from the gate by the buried insulator layer. | 08-21-2014 |
20140302661 | CONTACT ISOLATION SCHEME FOR THIN BURIED OXIDE SUBSTRATE DEVICES - A method of forming a semiconductor-on-insulator (SOI) device includes defining a shallow trench isolation (STI) structure in an SOI substrate, the SOI substrate including a bulk layer, a buried insulator (BOX) layer over the bulk layer, and an SOI layer over the BOX layer; forming a doped region in a portion of the bulk layer corresponding to a lower location of the STI structure, the doped region extending laterally into the bulk layer beneath the BOX layer; selectively etching the doped region of the bulk layer with respect to undoped regions of the bulk layer such that the lower location of the STI structure undercuts the BOX layer; and filling the STI structure with an insulator fill material. | 10-09-2014 |
20140312461 | DEFECTIVE P-N JUNCTION FOR BACKGATED FULLY DEPLETED SILICON ON INSULATOR MOSFET - Methods for semiconductor fabrication include forming a well in a semiconductor substrate. A pocket is formed within the well, the pocket having an opposite doping polarity as the well to provide a p-n junction between the well and the pocket. Defects are created at the p-n junction such that a leakage resistance of the p-n junction is decreased. | 10-23-2014 |
20150044841 | METHOD FOR FORMING DOPED AREAS UNDER TRANSISTOR SPACERS - Method for fabricating a transistor comprising the steps consisting of:
| 02-12-2015 |
20150056734 | METHOD FOR SEPARATION BETWEEN AN ACTIVE ZONE OF A SUBSTRATE AND ITS BACK FACE OR A PORTION OF ITS BACK FACE - A Method for making a separation between an active zone of a substrate located on its front face from a given portion of the substrate located on its back face, wherein trenches and cavities wider than the trenches are formed to extend said trenches, such that at least one given cavity formed to extend a given trench is adjacent to another cavity, and when the cavities have been filled with a given material, they form a separation zone between said active zone and a given portion of the substrate that will be removed later. | 02-26-2015 |
20150179453 | DEFECTIVE P-N JUNCTION FOR BACKGATED FULLY DEPLETED SILICON ON INSULATOR MOSFET - Methods for semiconductor fabrication include forming a well in a semiconductor substrate. A pocket is formed within the well, the pocket having an opposite doping polarity as the well to provide a p-n junction between the well and the pocket. Defects are created at the p-n junction such that a leakage resistance of the p-n junction is decreased. | 06-25-2015 |
20150294903 | METHOD FOR FABRICATING MICROELECTRONIC DEVICES WITH ISOLATION TRENCHES PARTIALLY FORMED UNDER ACTIVE REGIONS - A method of producing a microelectronic device in a substrate comprising a first semiconductor layer, a dielectric layer and a second semiconductor layer, comprising the following steps: etching a trench through the first semiconductor layer, the dielectric layer and a part of the thickness of the second semiconductor layer, thus defining, in the first semiconductor layer, one active region of the microelectronic device, ionic implantation in one or more side walls of the trench, at the level of the second semiconductor layer, modifying the crystallographic properties and/or the chemical properties of the implanted semiconductor, etching of the implanted semiconductor such that at least a part of the trench extends under a part of the active region, —filling of the trench with a dielectric material, forming an isolation trench surrounding the active region and comprising portions extending under a part of the active region. | 10-15-2015 |
20150294904 | METHOD FOR FABRICATING MICROELECTRONIC DEVICES WITH ISOLATION TRENCHES PARTIALLY FORMED UNDER ACTIVE REGIONS - A method of producing a microelectronic device in a substrate including a first semiconductor layer, a first dielectric layer, and a second semiconductor layer, including: etching a trench through the first semiconductor layer, the first dielectric layer, and a part of the second semiconductor layer, defining one active region, and such that, at the level of the second semiconductor layer, a part of the trench extends under a part of the active region; deposition of one second dielectric layer in the trench; etching the second dielectric layer such that remaining portions of the second dielectric layer forms portions of dielectric material extending under a part of the active region; deposition of a third dielectric layer in the trench such that the trench is filled with the dielectric materials of the second and third dielectric layers and forms an isolation trench. | 10-15-2015 |