Patent application number | Description | Published |
20110281070 | STRUCTURES WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS - Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes. | 11-17-2011 |
20120132930 | DEVICE COMPONENTS WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS - Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes. | 05-31-2012 |
20130000952 | TRANSPARENT CONDUCTORS INCORPORATING ADDITIVES AND RELATED MANUFACTURING METHODS - A transparent conductor includes a film of a conductive ceramic. Additives are at least partially incorporated into the film. The additives are at least one of electrically conductive and semiconducting, and at least one of the additives has an aspect ratio of at least 3. | 01-03-2013 |
20130056244 | PATTERNED TRANSPARENT CONDUCTORS AND RELATED MANUFACTURING METHODS - A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions. | 03-07-2013 |
20130277625 | TRANSPARENT CONDUCTORS INCORPORATING ADDITIVES AND RELATED MANUFACTURING METHODS - A transparent conductor includes a film of a conductive ceramic and conductive additives at least partially incorporated into the film and localized within a region of the film. A thickness of the region is less than an overall thickness of the film, and at least one of the conductive additives has an aspect ratio of at least 3. The transparent conductor has a sheet resistance that is less than an intrinsic sheet resistance of the film. | 10-24-2013 |
20130334075 | AGGLOMERATE REDUCTION IN A NANOWIRE SUSPENSION STORED IN A CONTAINER - Methods and articles of manufacture for storage and shipping of nanowires are disclosed. One disclosed method includes: (a) providing a nanowire suspension including nanowires suspended in a liquid; and (b) disposing the nanowire suspension in a container for storage and shipping, where the container is configured to inhibit agglomeration of nanowires from the nanowire suspension. | 12-19-2013 |
20140231281 | AGGLOMERATE REDUCTION IN A NANOWIRE SUSPENSION STORED IN A CONTAINER - Methods and articles of manufacture for storage and shipping of nanowires are disclosed. One disclosed method includes: (a) providing a nanowire suspension including nanowires suspended in a liquid; and (b) disposing the nanowire suspension in a container for storage and shipping, where the container is configured to inhibit agglomeration of nanowires from the nanowire suspension. | 08-21-2014 |
20140231282 | AGGLOMERATE REDUCTION IN A NANOWIRE SUSPENSION STORED IN A CONTAINER - Methods and articles of manufacture for storage and shipping of nanowires are disclosed. One disclosed method includes: (a) providing a nanowire suspension including nanowires suspended in a liquid; and (b) disposing the nanowire suspension in a container for storage and shipping, where the container is configured to inhibit agglomeration of nanowires from the nanowire suspension. | 08-21-2014 |
20140284083 | PATTERNED TRANSPARENT CONDUCTORS AND RELATED MANUFACTURING METHODS - A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions. | 09-25-2014 |
20140299359 | STRUCTURES WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS - Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes. | 10-09-2014 |
20150014022 | Device Components With Surface-Embedded Additives And Related Manufacturing Methods - Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes. | 01-15-2015 |