Patent application number | Description | Published |
20090133993 | TOP PLATE CONVEYOR DEVICE - A top plate conveyor device, in which vibrations and noises are reduced, and the structure is simple and the production assembly and handling are easy. Top plates | 05-28-2009 |
20090165920 | PRESSURE-SENSITIVE ADHESIVE DOUBLE-COATED SHEET - A pressure-sensitive adhesive double-coated sheet comprising a substrate, a pressure-sensitive adhesive layer (A) formed on one side of the substrate and a pressure-sensitive adhesive layer (B) formed on the other side of the substrate, wherein at least the pressure-sensitive adhesive layer (A) is formed with a pressure-sensitive adhesive comprising a butyl rubber as base material, and after the pressure-sensitive adhesive double-coated sheet is allowed to stand at 60° C. for five days while being placed between a moisture vapor-permeable waterproof sheet attached to the adhesive layer (A) and an aluminum plate attached to the adhesive layer (B), an expansion coefficient of the moisture vapor-permeable waterproof sheet is 0.5% or less. The pressure-sensitive adhesive double-coated sheet can allow the moisture vapor-permeable waterproof sheet to less expand over time when attached between the moisture vapor-permeable waterproof sheet and the adherend in a waterproof airtight structure of a construction. | 07-02-2009 |
20100200048 | SEALING MEMBER FOR SOLAR CELL PANEL AND SOLAR CELL MODULE - Disclosed is a sealing member for solar cell panels, which comprises an elastic layer, an insulating resin film arranged on the elastic layer, and a first water-stopping adhesive layer arranged on the insulating resin film. | 08-12-2010 |
20110088756 | Adhesive seal material for end portion of solar cell panel, sealed structure of end portion of solar cell panel, sealing method, solar cell module, and producing method thereof - An adhesive seal material for an end portion a solar cell panel is an adhesive seal material which is bonded to an end portion of a solar cell panel. The adhesive seal material includes a rubber-based adhesive layer, and a non-adhesive layer partially covering a surface of the rubber-based adhesive layer. | 04-21-2011 |
20120298197 | SEALING MEMBER FOR SOLAR CELL PANEL AND SOLAR CELL MODULE - Disclosed is a sealing member for solar cell panels, which comprises an elastic layer, an insulating resin film arranged on the elastic layer, and a first water-stopping adhesive layer arranged on the insulating resin film. | 11-29-2012 |
Patent application number | Description | Published |
20100148198 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a light emitting device includes: forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate; forming a dielectric film on a second surface side opposite to the first surface of the multilayer body, the dielectric film having a first and second openings on a p-side electrode and an n-side electrode provided on the second surface; forming a seed metal on the dielectric film and an exposed surface of the first and second openings; forming a p-side metal interconnect layer and an n-side metal interconnect layer on the seed metal; separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal, which is provided between the p-side metal interconnect layer and the n-side metal interconnect layer; and forming a resin in a space from which the seed metal is removed. | 06-17-2010 |
20110233585 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, an insulating film, a first interconnection, a second interconnection, a first metal pillar, a second metal pillar, a resin, and a fluorescent layer. The semiconductor layer has a first major surface, a second major surface formed on an opposite side to the first major surface, and a light emitting layer. The first electrode and the second electrode are provided on the second major surface of the semiconductor layer. The fluorescent layer faces to the first major surface of the semiconductor layer and includes a plurality of kinds of fluorescent materials having different peak wavelengths of emission light. | 09-29-2011 |
20110233586 | METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE - According to one embodiment, a light emitting device includes a stacked body, a p-side and n-side electrodes, an insulating film, a p-side extraction electrode, an n-side extraction electrode, a resin layer and a phosphor layer. The stacked body has a first and a second surface opposite to each other and includes a light emitting layer. A p-side and an n-side electrode are provided on the second surface. An insulating film has openings to which the p-side and n-side electrodes are exposed. A p-side extraction electrode includes a p-side seed metal and a p-side metal wiring layer. An n-side extraction electrode includes an n-side seed metal and an n-side metal wiring layer. A resin layer is filled around the p-side and n-side extraction electrodes, and a phosphor layer is provided on a side of the first surface. Emission light from the light emitting layer is emitted through the first surface. | 09-29-2011 |
20110291149 | LIGHT EMITTING DEVICE - According to one embodiment, a light emitting device includes a light emitting chip, an external terminal made of a metal material, and a circuit board. The light emitting chip is mounted on the circuit board via the external terminal. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer. The circuit board includes an interconnection bonded to the first metal pillar and the second metal pillar via the external terminal, and a heat radiation material provided on an opposite side of the interconnection and connected to the interconnection. | 12-01-2011 |
20110297980 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor light emitting device includes a light emitting chip and a fluorescent material layer. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The fluorescent material layer is provided on the first major surface and has a larger planer size than the light emitting chip. | 12-08-2011 |
20110297994 | SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a semiconductor light emitting device includes a plurality of semiconductor layers, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer, and is mounted in a bent state on a curved surface. The plurality of semiconductor layers includes a first main surface, a second main surface opposite to the first main surface, and a light emitting layer, the plurality of semiconductor layers being separated from one another. A material is provided between the plurality of the semiconductor layers separated from one another. The member has a higher flexibility than the semiconductor layers being. | 12-08-2011 |
20120097972 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a light emitting device includes forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate. A dielectric film on a second surface side opposite to the first surface of the multilayer body is formed having first and second openings on a p-side electrode and an n-side electrode. A seed metal on the dielectric film and an exposed surface of the first and second openings form a p-side metal interconnect layer and an n-side metal interconnect layer separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal. A resin is formed in a space from which the seed metal is removed. | 04-26-2012 |
20150017750 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor light emitting device includes a light emitting chip and a fluorescent material layer. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The fluorescent material layer is provided on the first major surface and has a larger planer size than the light emitting chip. | 01-15-2015 |
20160027982 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a light emitting device includes forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate. A dielectric film on a second surface side opposite to the first surface of the multilayer body is formed having first and second openings on a p-side electrode and an n-side electrode. A seed metal on the dielectric film and an exposed surface of the first and second openings form a p-side metal interconnect layer and an n-side metal interconnect layer separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal. A resin is formed in a space from which the seed metal is removed. | 01-28-2016 |
Patent application number | Description | Published |
20090121799 | PIEZOELECTRIC OSCILLATOR - A piezoelectric oscillator includes: a piezoelectric resonator; an oscillation circuit including a variable resistance circuit and a transistor for oscillation; a constant current circuit, the constant current circuit including a first current mirror circuit, and a current control circuit having an output terminal and controlling a current flowing in the first current circuit so as to enable an output current of the constant current circuit to be adjusted, the output terminal of the first current mirror circuit being coupled to at least one of a collector and a base of the transistor for oscillation with the variable resistance circuit; and a control circuit coupled to the current control circuit and the variable resistance circuit, the control circuit controlling the current control circuit and a resistance value of the variable resistance circuit. | 05-14-2009 |
20100127787 | VOLTAGE CONTROL TYPE TEMPERATURE COMPENSATION PIEZOELECTRIC OSCILLATOR - A voltage control type temperature compensation piezoelectric oscillator, includes: a voltage control type oscillation circuit; an automatic frequency control (AFC) circuit outputting a control voltage for controlling an oscillation frequency of the voltage control type oscillation circuit based on an external control voltage; a temperature compensation voltage generating circuit generating a temperature compensation voltage; and a gain variable circuit varying a gain of the temperature compensation voltage. In the oscillator, the gain variable circuit is controlled by the control voltage outputted from the AFC circuit, and the oscillation frequency of the voltage control type oscillation circuit is controlled by an output voltage of the gain variable circuit. | 05-27-2010 |
20150365050 | OSCILLATION CIRCUIT, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - An oscillation circuit includes a circuit for oscillation and a signal adjustment circuit connected to the circuit for oscillation. An input voltage based on a direct-current voltage, a voltage value of which can be changed, is input to the circuit for oscillation and the signal adjustment circuit. The circuit for oscillation causes a vibration piece to oscillate and outputs a first oscillation signal. A frequency of the first oscillation signal is adjusted according to the voltage value output from the signal adjustment circuit. | 12-17-2015 |
Patent application number | Description | Published |
20090154010 | Magnetic disk and magnetic disk unit - Embodiments of the present invention provide a magnetic disk having a lubricating layer formed on the surface thereof, which meets all the requirements for adhesiveness, adequate flowability, and strong binding power. In a particular embodiment, a magnetic disk has a magnetic layer, a protective layer, and a lubricating layer which are formed on a non-magnetic substrate, which is characterized in that said lubricating layer is comprised of a lubricant containing a first ingredient and a second ingredient, said first ingredient as the main constituent being a first perfluoropolyether compound represented by the formula (1) below, which has a weight-average molecular weight of 500 to 6000 and a dispersity smaller than 1.3, and said second ingredient being a second perfluoropolyether compound which has a weight-average molecular weight of 500 to 6000 and has 6 to 10 hydroxyl groups (on average) in one molecule, | 06-18-2009 |
20090168248 | Head slider and disk drive device - Embodiments of the present invention help to adjust the recess depth of a head element portion of a head slider. In an embodiment of the present invention, in a test step in manufacturing an HDD, the HDD examines the recess depth of a head element portion and decreases and adjusts the recess depth if the recess depth of the head element portion does not satisfy the predetermined condition. The HDD moves an actuator to a ramp of a retract position and supplies power to a heater in a head slider. If the heater power is large, the head element portion undergoes plastic deformation. The plastic deformation of the head element portion decreases the recess depth of the head element portion. | 07-02-2009 |
20100128383 | DISK DRIVE AND METHOD FOR CONTROLLING CLEARANCE IN THE DISK DRIVE - A disk drive. The disk drive includes a disk configured to store data, a slider configured to fly in proximity to the disk, and a magnetic-recording head on the slider configured to access the disk. The disk drive also includes a moving mechanism configured to support and to move the head-slider, an adjustment portion configured to adjust clearance between the magnetic-recording head and the disk, and a controller configured to control the adjustment portion to control the clearance. The controller is configured to perform clearance control in a first mode in an operation selected from the group consisting of reading user data and writing user data according to a change in fly height of the slider after a load operation, and subsequently is configured to perform clearance control in a second mode in an operation selected from the group consisting of reading user data and writing user data. | 05-27-2010 |
Patent application number | Description | Published |
20110121909 | TEMPERATURE COMPENSATION METHOD FOR PIEZOELECTRIC OSCILLATOR, AND PIEZOELECTRIC OSCILLATOR - A temperature compensation method for a piezoelectric oscillator including a piezoelectric vibrator having a frequency temperature characteristic with a hysteresis characteristic, and an oscillation circuit which oscillates the piezoelectric vibrator and outputs an oscillation signal, wherein, to a temperature compensation circuit which can calculate a quantity of temperature compensation using frequency temperature information indicating a temperature characteristic of an oscillation frequency of the piezoelectric vibrator and temperature information of the piezoelectric vibrator at the time of oscillation of the oscillation signal, the oscillation signal and the frequency temperature information are outputted, includes: calculating, as the frequency temperature information, an intermediate value between elevated-temperature frequency temperature information of the piezoelectric vibrator that is generated in the case where ambient temperature of the piezoelectric vibrator is elevated, and lowered-temperature frequency temperature information of the piezoelectric vibrator that is generated in the case where the ambient temperature is lowered. | 05-26-2011 |
20110210796 | OSCILLATION CIRCUIT AND FREQUENCY-CORRECTING OSCILLATION CIRCUIT - An oscillation circuit includes: an oscillator that includes a vibrator and outputs an oscillation signal; an F/V converter that converts the oscillation signal into a voltage corresponding to a frequency of the oscillation signal; and a memory circuit that stores frequency correcting information for correcting the frequency of the oscillation signal. | 09-01-2011 |
20130257550 | CIRCUIT DEVICE, OSCILLATION DEVICE, AND ELECTRONIC APPARATUS - A circuit device includes a current supply circuit adapted to supply an oscillation current, an oscillation circuit having an oscillation transistor for a resonator, and adapted to drive the resonator using the oscillation transistor based on an oscillation current from the current supply circuit, and a control section adapted to control the current supply circuit. If the oscillation circuit is set to an overdrive mode, the oscillation circuit drives the resonator with a higher drive power than the drive power in a normal mode. | 10-03-2013 |
20140091865 | OSCILLATION CIRCUIT, ELECTRONIC APPARATUS, AND MOVING OBJECT - An oscillation circuit is connected to a resonator element (crystal resonator) and oscillates a resonator element to output an oscillation signal. The oscillation circuit includes an amplification element (inverter), and a set of variable capacitive elements having at least two variable capacitive elements, which are connected to an oscillation loop from an output to an input of the amplification element and the capacitance values thereof are controlled with potential differences between reference voltages and a variable control voltage. In each variable capacitive element of a set of variable capacitive elements, the common control voltage is applied to one terminal, and the reference voltage which differs between the variable capacitive elements is input to the other terminal. | 04-03-2014 |
20140091868 | OSCILLATION CIRCUIT, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, VIBRATING DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT - An oscillation circuit includes a first variable capacitance part which includes a first variable capacitance element whose capacitance is controlled on the basis of a potential difference between a first control voltage and a first reference voltage, and is connected to the oscillation circuit, a second variable capacitance part which includes a second variable capacitance element whose capacitance is controlled on the basis of a potential difference between a first control voltage and a second reference voltage, and is connected to the oscillation circuit. If composite capacitance in the first variable capacitance part excluding the first variable capacitance element is first composite capacitance, composite capacitance in the second variable capacitance part excluding the second variable capacitance element is second composite capacitance, and if the second composite capacitance is greater than the first composite capacitance, the second variable capacitance element having capacitance greater than the first variable capacitance element is used. | 04-03-2014 |
20150116043 | OSCILLATION CIRCUIT, OSCILLATOR, METHOD OF MANUFACTURING OSCILLATOR, ELECTRONIC DEVICE, AND MOVING OBJECT - An oscillation circuit includes a terminal XO which is connected to one end of a resonator, a terminal XI which is connected to the other end of the resonator, an oscillation unit which is electrically connected to the terminal XO and the terminal XI, a control voltage generation circuit, and a switch. The oscillation unit includes a variable capacitive element having one end which is connected to the terminal XO or the terminal XI. The switch controls electrical connection between the other end of the variable capacitive element and an output terminal of the control voltage generation circuit. | 04-30-2015 |
20150116044 | OSCILLATION CIRCUIT, OSCILLATOR, MANUFACTURING METHOD OF OSCILLATOR, ELECTRONIC DEVICE, AND MOVING OBJECT - An oscillation circuit includes: an oscillation unit which includes a first terminal and a second terminal connected to a resonator, a third terminal, a fourth terminal to which at least one of a power supply potential and a signal for inspecting the resonator is applied, a first switching unit which switches modes of electrical connection between the first terminal and the third terminal, and a second switching unit which switches modes of electrical connection between the second terminal and the fourth terminal. | 04-30-2015 |
20150116045 | OSCILLATION CIRCUIT, OSCILLATOR, METHOD OF MANUFACTURING OSCILLATOR, ELECTRONIC DEVICE, AND MOVING OBJECT - An oscillation circuit includes a terminal XO, a terminal XI, an oscillation unit, and a voltage generation circuit that generates a first voltage and a second voltage. The oscillation unit includes a variable capacitive element connected to the terminal XO or the terminal XI. In a first mode, a signal having a first amplitude is applied between the terminal XO and the terminal XI, and a first voltage is applied to the other end of the variable capacitive element. In a second mode, a signal having a second amplitude larger than an amplitude of the signal having the first amplitude is applied between the terminal XO and the terminal XI, a second voltage is applied to the other end of the variable capacitive element, and a voltage applied to the both ends of the variable capacitive element is lower than the maximum rated voltage of the variable capacitive element. | 04-30-2015 |
20150116048 | OSCILLATION CIRCUIT, OSCILLATOR, MANUFACTURING METHOD OF OSCILLATOR, ELECTRONIC DEVICE, AND MOVING OBJECT - An oscillation circuit includes: an oscillation unit which includes a first terminal and a second terminal connected to a vibrator; a third terminal to which a ground potential is supplied; a fourth terminal which is electrically connected to the second terminal, and to which at least one of an AC voltage for driving the vibrator and a voltage for operating the oscillation unit is applied; and a first switching unit which switches modes of electrical connection between the first terminal and the third terminal. | 04-30-2015 |
20150123514 | ELECTRONIC DEVICE, CIRCUIT SUBSTRATE FOR ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT - An electronic device includes a first conductive pattern and a second conductive pattern that are disposed on a main surface of an insulating substrate, a first electrode pattern that is electrically connected to the first conductive pattern, and a vibrator element that is disposed on the main surface, and the area of a first section in which the first conductive pattern overlaps the first electrode pattern is greater than the area in which the other conductive pattern overlaps the first electrode pattern in a plan view. | 05-07-2015 |
20150123740 | SEMICONDUCTOR CIRCUIT DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT - A semiconductor circuit device includes: a semiconductor substrate; and a first circuit block including an analog circuit as a component, a second circuit block including a digital circuit as a component, a connection pad, and a connection wire electrically connecting the connection pad with the first circuit block, all of which are arranged on the semiconductor substrate. The connection wire is provided so as not to overlap the second circuit block in a plan view. | 05-07-2015 |
20150130547 | MANUFACTURING METHOD OF OSCILLATOR, MANUFACTURING METHOD OF CIRCUIT DEVICE AND THE CIRCUIT DEVICE - A manufacturing method of an oscillator is a manufacturing method of an oscillator which includes a vibrator and a semiconductor circuit device including an oscillation part connected to the vibrator and a control part to switch an operation mode between a normal mode in which the oscillation part performs an oscillation operation and an inspection mode in which characteristics of the vibrator are inspected, and the manufacturing method includes preparing the semiconductor circuit device in which the operation mode is set to the inspection mode, connecting the semiconductor circuit device and the vibrator electrically, and inspecting the characteristics of the vibrator which is in a state electrically connected to the semiconductor circuit device. | 05-14-2015 |
Patent application number | Description | Published |
20120045353 | INVERTER-INTEGRATED ELECTRIC COMPRESSOR - Provided is an inverter-integrated electric compressor in which the layout of a wiring path connected to an IPM is optimized, the wiring path is simplified, and the noise interference due to disturbance is suppressed, thereby improving the controllability. In an inverter-integrated electric compressor in which an inverter box is provided on the outer periphery of a housing accommodating a compressor and a motor, the inverter box integrally accommodating an inverter device, the inverter device includes an IPM constituting an inverter circuit, and UVW output terminals arranged on one side of the IPM are disposed, in the inverter box, so as to face a glass-sealed terminal that applies power from the inverter device to the motor. | 02-23-2012 |
20120234030 | AIR CONDITIONING APPARATUS - Provided is an air conditioning apparatus that is capable of suppressing increases in volume and cost of the apparatus and performing more suitable overheating protection. An electric compressor is an inverter-integrated electric compressor integrally including a compressor, an electric motor that drives the compressor, and an inverter including a temperature sensor that detects the temperature in the vicinity of a semiconductor switching device, wherein a controller estimates a discharge temperature of the compressor on the basis of a correlation of respective pressure loading characteristics for the detected temperature of the inverter, for the rotational speed of the compressor, and for the motive force of the compressor in a refrigerating cycle. | 09-20-2012 |
20120282123 | ELECTRIC COMPRESSOR AND ASSEMBLY METHOD THEREOF - A main-bearing outer diameter of an electric motor is made smaller than a rotor outer diameter without causing a drop in production efficiency, and the ease of performing a shrink-fitting step is also enhanced by making it possible to mount a rotor to a main shaft in an early stage. A bearing journal portion ( | 11-08-2012 |
20130294951 | ELECTRIC COMPRESSOR AND ASSEMBLY METHOD THEREFOR - An electric compressor includes a compression unit that compresses a refrigerant; an electric motor that is coupled with the compression unit via a main shaft; a housing that accommodates the compression unit and the electric motor; an end-side bearing holding part that is provided near an axial end of the housing closer to the electric motor; and a rolling bearing that has an outer ring press-fitted into the end-side bearing holding part and an inner ring into which an end of the rotating shaft is press-fitted, and that supports the main shaft, in which an opening into which an assembly jig for supporting the rolling bearing when the main shaft is press-fitted into the inner ring can be inserted and removed is provided in an end surface of the housing near the end-side bearing holding part. | 11-07-2013 |
20150319839 | DEVICE HAVING HEAT SINK - An electric compressor includes a motor, a scroll compression mechanism, a housing, a circuit unit, a circuit housing housing the circuit unit and integrated with the housing. The electric compressor includes a heat sink provided on a circuit unit side of a partition wall so as to project to be brought into contact with a semiconductor element of a power substrate, facing the partition wall that erects along a vertical direction to separate the inside of the housing from the circuit housing. The heat sink has a lower surface and an upper surface formed into a cylindrical shape so that width of an upper end portion and a lower end portion of the heat sink gradually decreases to reach a tip portion. | 11-05-2015 |