Patent application number | Description | Published |
20110171368 | DIE FOR FLAT WIRE COATING AND MANUFACTURING METHOD OF ENAMELED FLAT WIRE - A solid coating die for applying an insulation varnish around a flat wire conductor includes a die body and a die hole formed through the die body, the conductor to be inserted into the die hole. The die hole includes: an entry portion having a cross section monotonically decreasing along a conductor insertion direction; and a coating portion including at least a sub-portion having a constant cross section. The cross section of the coating portion is a rectangle having four straight sides and four rounded corners. Each inner surface of the straight side of the coating portion has an inwardly projecting protrusion, a top contour of each protrusion being a circular arc, an elongated circular arc, an elliptical arc or a combination of these arcs, the maximum curvature of the top contour of each protrusion being larger than the maximum curvature of inner surface of the rounded corners. | 07-14-2011 |
20120097420 | Audio/video cable - An audio/video cable includes a plurality of parallel arranged insulated wires or twisted pair insulated wires each including a copper conductor and an insulation layer formed on a periphery thereof. The copper conductor includes a soft dilute copper alloy material containing pure copper, an additive element and an inevitable impurity as a balance. The soft dilute copper alloy material includes a recrystallized structure having a grain size distribution such that crystal grains in a surface layer are smaller than internal crystal grains. The surface layer includes a crystal structure such that an average crystal grain size from a surface of the surface layer up to a depth of 50 μm toward inside of the soft dilute copper alloy material is not more than 20 μm. | 04-26-2012 |
20120100390 | Weldment and method of manufacturing the same - A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100° C. and not more than 1320° C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material. The dilute copper alloy material includes the pure copper, more than 2 mass ppm of oxygen, and the additive element, | 04-26-2012 |
20120164315 | COATING DIE AND MANUFACTURING METHOD OF ENAMELED WIRE USING SAME - There is provided a coating die for applying an insulation varnish around a wire conductor, comprising: a die body; and a die hole formed through the die body, the die hole including: an entry portion having an opening size monotonically decreasing along a conductor insertion direction; and a coating portion comprising a sub-portion having a constant opening size, in which: on an inner surface of the coating portion are provided at least four protrusions equally spaced in a circumferential direction of the inner surface, the protrusions projecting toward a center axis of the die hole; and each of the protrusions includes a portion with a height gradually increasing along the conductor insertion direction from a boundary between the entry portion and the coating portion. There can be formed an enameled wire having a thin and uniform insulation coating by using the invented coating die. | 06-28-2012 |
20130300022 | MANUFACTURING METHOD OF ENAMELED FLAT WIRE USING DIE FOR FLAT WIRE COATING - A manufacturing method uses a solid coating die for applying an insulation varnish around a flat wire conductor. The die includes a die body and a die hole formed through the die body, into which the conductor is inserted. The die hole includes an entry portion having a cross section monotonically decreasing along a conductor insertion direction, and a coating portion including at least a sub-portion having a constant cross section. The cross section of the coating portion is a rectangle having four straight sides and four rounded corners. Each inner surface of each straight side has an inwardly projecting protrusion, a top contour of each protrusion being a circular arc, an elongated circular arc, an elliptical arc or a combination of these arcs, the maximum curvature of the top contour of each protrusion being larger than the maximum curvature of inner surface of the rounded corners. | 11-14-2013 |
20140202731 | ENAMELED FLAT WIRE - There is provided an enameled flat wire, in which a flat wire conductor having a rectangular cross section composed of four flat surfaces and four rounded corners has an enamel coating with a predetermined thickness for electrical insulation. In the enameled flat wire, a difference in a thickness of the enamel coating on the flat surfaces between a maximum thickness and a minimum thickness is equal to or less than 25% of the predetermined thickness. | 07-24-2014 |
20140302342 | COPPER WIRE AND METHOD OF MANUFACTURING THE SAME - A copper wire includes a copper wire rod including 5 to 55 mass ppm of Ti, 3 to 12 mass ppm of sulfur, and 2 to 30 mass ppm of oxygen with the balance copper and inevitable impurities, a first crystal including a [111] crystal orientation and at least one twin crystal therein, and a second crystal that includes one or more crystals adjacent to the first crystal, a [111] crystal orientation with a different rotation angle on an atomic plane from the first crystal, and at least one twin crystal therein. | 10-09-2014 |
20140318827 | Audio/Video Cable - An audio/video cable includes an insulated layer including a copper conductor for transmitting audio/video signals and an insulation layer formed on a periphery thereof. The copper conductor includes a soft dilute copper alloy material containing pure copper, Ti as an additive element and an inevitable impurity as a balance. The soft dilute copper alloy material includes a recrystallized structure having a grain size distribution such that crystal grains in a surface layer are smaller than internal crystal grains. The soft dilute copper alloy material includes not less than 2 and not more than 12 mass ppm of sulfur, more than 2 mass ppm but not more than 30 mass ppm of oxygen, and not less than 4 and not more than 55 mass ppm of Ti. | 10-30-2014 |