Patent application number | Description | Published |
20130146228 | SEPARATION APPARATUS, SEPARATION SYSTEM, AND SEPARATION METHOD - A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit. | 06-13-2013 |
20130269879 | PEELING DEVICE, PEELING SYSTEM AND PEELING METHOD - A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate. | 10-17-2013 |
20130292062 | SUBSTRATE INVERTING DEVICE, SUBSTRATE INVERTING METHOD, AND PEELING SYSTEM - According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck. | 11-07-2013 |
20130327484 | SEPARATION METHOD, SEPARATION APPARATUS, AND SEPARATION SYSTEM - A method includes: a first step of disposing the superposed substrate at a position where the superposed substrate is not in contact with a first holding unit and a second holding unit in a space between the first holding unit and the second holding unit, and supplying an inert gas into the space; a second step of thereafter relatively moving the first holding unit and the second holding unit in the vertical direction, and holding the processing target substrate by the first holding unit and holding the supporting substrate by the second holding unit; and a third step of thereafter relatively moving the first holding unit and the second holding unit in the horizontal direction while heating the processing target substrate held by the first holding unit and the supporting substrate held by the second holding unit, to separate the processing target substrate and the supporting substrate from each other. | 12-12-2013 |
20140020846 | SEPARATION APPARATUS, SEPARATION SYSTEM, AND SEPARATION METHOD - A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate includes: a first holding unit that includes a heating mechanism heating the processing target substrate and holds the processing target substrate; a second holding unit that includes a heating mechanism heating the supporting substrate and holds the supporting substrate; a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a horizontal direction; and a porous part that is annularly provided along an outer peripheral portion of the first holding unit and formed with a plurality of pores, and supplies an inert gas to the outer peripheral portion of the first holding unit holding the processing target substrate. | 01-23-2014 |
20140076500 | DELAMINATION DEVICE - Provided is a delamination device of delaminating a laminated substrate obtained by bonding a first substrate and a second substrate, the laminated substrate being disposed in an opening of a frame, the opening having a diameter larger than that of the laminated substrate, and the laminated substrate being held by the frame with a non-bonding surface of the first substrate attached to a tape provided in the opening. The delamination device includes: a first holding unit configured to hold the second substrate of the laminated substrate from above; a second holding unit configured to hold the first substrate of the laminated substrate from below through the tape; and a moving mechanism configured to move the first holding unit in a direction away from the second holding unit. | 03-20-2014 |
20140332166 | PEELING DEVICE, PEELING SYSTEM, AND PEELING METHOD - A peeling device separates a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate. The peeling device includes a holding unit configured to hold the superposed substrate, and a plurality of position adjustment units movable forward and backward with respect to a side surface of the superposed substrate held in the holding unit, and the position adjustment unit configured to perform a position adjustment of the superposed substrate by contacting the side surface of the superposed substrate. | 11-13-2014 |
20150343755 | PEELING DEVICE, PEELING SYSTEM AND PEELING METHOD - A peeling device which peels a superposed substrate obtained by bonding a first substrate and a second substrate together, from one end portion of the superposed substrate toward the other end portion thereof, includes a first holding unit configured to hold the first substrate of the superposed substrate, a second holding unit configured to hold the second substrate of the superposed substrate, and a moving unit configured to move the first holding unit away from the second holding unit. The moving unit is configured to move in at least a peeling direction of the superposed substrate. | 12-03-2015 |