Patent application number | Description | Published |
20130184406 | RESIN COMPOSITION AND MANUFACTURING PROCESS THEREFOR - A polyamic acid resin composition includes (a) a polyamic acid having structures represented by general formula (1) in an amount of at least 80% of all the repeating units and (b) a solvent. In formula (1), A is a polyamic acid block represented by general formula (2); B is a polyamic acid block represented by general formula (3); and k is a positive integer. In formula (2), Ws are divalent organic groups having two or more carbon atoms, mainly composed of divalent organic groups represented by general formula (4); Xs are tetravalent organic groups having two or more carbon atoms. In formula (3), Ys are divalent organic groups having two or more carbon atoms, exclusive of the groups represented by formula (4); Zs are tetravalent organic groups each having two or more carbon atoms, and are mainly composed of tetravalent organic groups represented by general formula (5) or (6). | 07-18-2013 |
20130260020 | BINDER FOR LITHIUM ION BATTERY ELECTRODE, PASTE FOR LITHIUM ION BATTERY NEGATIVE ELECTRODE, AND METHOD FOR PRODUCING LITHIUM ION BATTERY NEGATIVE ELECTRODE - The present invention is directed to a binder for a lithium ion battery electrode, comprising a polyimide precursor having a tetracarboxylic acid residue and a diamine residue and/or a polyimide, the polyimide precursor having a residue of a tetracarboxylic dianhydride selected from those represented by the following general formulas (1) and (2) as the tetracarboxylic acid residue, and a residue of a diamine selected from those represented by the following general formulas (3) and (4) as the diamine residue, the content of the acid residue being from 0.90 to 0.95 moles based on 1 mole of the diamine residue. | 10-03-2013 |
20130289202 | POLYAMIC ACID RESIN COMPOSITION AND METHOD OF PRODUCING THE SAME - The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A′, C, C′ are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A′, or C, C′. | 10-31-2013 |
20140005318 | EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE USING SAME | 01-02-2014 |
20140191222 | RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME - The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing. | 07-10-2014 |
20150017534 | RESIN COMPOSITION FOR LITHIUM ION CELL POSITIVE ELECTRODE - Disclosed is a resin composition for positive electrodes of lithium ion cells, which imparts strong adhesiveness and electrolyte injectability and shows good discharge and charge characteristics and input-output characteristics with smaller amount of a binder. The resin composition for positive electrodes of lithium ion cells is a resin composition for positive electrodes of lithium ion cells, which comprises a polyimide precursor whose average thermal linear expansion coefficient in the range of 20° C. to 200° C. after being imidized is 3 to 50 ppm, and/or a polyimide whose average thermal linear expansion coefficient in the range of 20° C. to 200° C. is 3 to 50 ppm, and a positive electrode active compound, wherein the positive electrode active compound is one obtained by coating the surface of a composite oxide containing lithium with a lithium ion conductive material. | 01-15-2015 |
20150045502 | POLYAMIDE ACID AND RESIN COMPOSITION CONTAINING SAME - The invention aims to provide polyamic acid that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics and further aims to produce cured coat film with good mechanical characteristics regardless of whether the molar concentration of the acid anhydride group in the acid dianhydride monomer and that of the amino group in the multivalent amine compound or diamine compound are identical to or different from each other. This objective is met by polyamic acid including a structure as represented by chemical formula (1) given below: (In chemical formula (1), δ represents an oxygen or sulfur atom and W represents an electron-withdrawing group, and R | 02-12-2015 |
20150203631 | POLYAMIC ACID RESIN COMPOSITION, POLYIMIDE FILM USING SAME, AND METHOD FOR PRODUCING SAID POLYIMIDE FILM - An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), δ represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R | 07-23-2015 |