Patent application number | Description | Published |
20090212307 | Light-emitting diode chip comprising a contact structure - In a luminescence diode chip having a radiation exit area ( | 08-27-2009 |
20110218287 | Coatings for electronic circuits - Printed circuit boards are coated with nanoparticulate inorganic oxides. The coatings have increased partial discharge resistance. | 09-08-2011 |
20130285100 | Method for Producing a Conversion Lamina and Conversion Lamina - A method for producing at least one conversion lamina for a radiation-emitting semiconductor component is specified. A base material including a conversion substance contained therein is applied to a substrate by means of a double-layered stencil. Furthermore, a conversion lamina for a radiation-emitting semiconductor component includes a base material and a conversion substance embedded therein. The thickness of the conversion lamina is in a range of between 60 μm and 170 μm inclusive. | 10-31-2013 |
20150333235 | Optoelectronic Semiconductor Component and Method for Producing an Optoelectronic Semiconductor Component - The invention relates to an optoelectronic semiconductor element that emits mixed-color radiation when in operation. The optoelectronic semiconductor component comprises an optoelectronic semiconductor chip, a conversion element that has a curvature, and a spacer element that is arranged between the optoelectronic semiconductor chip and conversion element. The spacer has a curved surface that faces the conversion element, with the conversion element being in direct contact with the curved surface. | 11-19-2015 |
20160056346 | METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT - A method of producing an optoelectronic component includes providing a substrate with an optoelectronic semiconductor chip arranged on a surface of the substrate; providing a mask having a lower layer and an upper layer, wherein the lower layer has a lower opening and the upper layer has an upper opening, which openings jointly form a continuous mask opening, and the lower opening has a larger area than the upper opening; arranging the mask above the surface of the substrate such that the lower layer faces the surface of the substrate and the mask opening is arranged above the optoelectronic semiconductor chip; spraying a layer onto the optoelectronic semiconductor chip through the mask opening; and removing the mask. | 02-25-2016 |
20160079488 | WAVELENGTH-CONVERTING ELEMENT, OPTOELECTRONIC COMPONENT AND PRINTING STENCIL - A wavelength-converting element having the shape of a small flat plate having a basic shape with an outer contour, wherein the wavelength-converting element includes a cut-out compared to the basic shape which is defined by a boundary edge, and at a conjunction of the boundary edge and the outer contour, an angle of less than 90° is enclosed. | 03-17-2016 |
20160079489 | METHOD FOR PRODUCING A PLURALITY OF RADIATION-EMITTING SEMICONDUCTOR CHIPS - A method is provided for producing a plurality of radiation-emitting semiconductor chips, having the following steps: | 03-17-2016 |
20160133802 | METHOD OF PRODUCING A CONVERSION ELEMENT - A method of producing a conversion element includes providing a substrate having a surface; forming a first mask structure above the surface, wherein the first mask structure has first webs and first openings arranged between the first webs and the first openings form cavities in which the surface of the substrate is accessible; arranging a second mask structure above the first mask structure, wherein the second mask structure has second webs and second openings arranged between the second webs, the first webs are at least partly covered by the second webs, and the cavities remain at least partly accessible through the second openings; spraying a material into the cavities through the second openings; removing the second mask structure; and removing the first mask structure. | 05-12-2016 |