Patent application number | Description | Published |
20090205954 | APPARATUS FOR TREATING A SUBSTRATE - This invention relates to an apparatus ( | 08-20-2009 |
20110079508 | METHOD FOR COATING A SUBSTRATE AND COATER - A method is provided for coating substrates with at least one cathode assembly having a rotatable target, the rotatable target being provided with at least one magnet assembly positioned there within. The method includes providing a potential difference between the substrate and the rotatable target that is varied over time during coating. Further, the method may include positioning the magnet assembly with respect to the rotatable target so that the magnet assembly is asymmetrically aligned with respect to a plane perpendicularly extending from the substrate to the axis of the rotatable target for a predetermined first time interval. The magnet assembly is then moved to a second position that is also asymmetrically aligned. Further, a coater for coating substrates is provided including a cathode assembly with a rotatable curved target and two magnet assemblies positioned within the rotatable curved target. | 04-07-2011 |
20120012455 | Apparatus and Method for Detecting a State of a Deposition Apparatus - Apparatuses for deposition of one or more layers. In one aspect, an apparatus for deposition of one or more layers includes an anode; a cathode; a vacuum chamber including the anode and the cathode; a sensor configured to detect an electric potential between a section of the at least one anode and a section of the chamber. Furthermore, methods to monitor a device for deposition of one or more layers are also described. | 01-19-2012 |
20120080309 | SYSTEMS AND METHODS FOR FORMING A LAYER OF SPUTTERED MATERIAL - The present disclosure describes a method of coating a substrate, the method including forming a layer of sputtered material on the substrate. Forming the layer of sputtered material may include: sputtering material from at least one target over the substrate; varying the relative position between the at least one target and the substrate to a first position (I), which first position is maintained for a predetermined first time interval; and varying the relative position between the at least one target and the substrate to a second position (II), which second position is maintained for a predetermined second time interval. The present disclosure further describes a system for coating a substrate. | 04-05-2012 |
20120273343 | METHOD FOR COATING A SUBSTRATE AND COATER - A method is provided for coating a substrate ( | 11-01-2012 |
20130284590 | SYSTEMS AND METHODS FOR FORMING A LAYER OF SPUTTERED MATERIAL - The present disclosure describes a method of coating a substrate, the method including forming a layer of sputtered material on the substrate. Forming the layer of sputtered material may include: sputtering material from at least one rotatable target over the substrate; varying the relative position between the at least one target and the substrate. In addition, the present disclosure describes varying the distance between a target and a substrate during the sputter process. The present disclosure further describes a system for coating a substrate. | 10-31-2013 |
20140332369 | MULTIDIRECTIONAL RACETRACK ROTARY CATHODE FOR PVD ARRAY APPLICATIONS - A cathode assembly for a sputter deposition apparatus and a method for coating a substrate is provided. The cathode assembly has a coating side for coating on a substrate. Further, the cathode assembly includes a rotary target assembly adapted for rotating a target material around a rotary axis; at least a first magnet having an inner magnet pole and at least one outer magnet poles and being adapted for generating one or more plasma regions. The cathode assembly has a first angular coordinate for a magnet pole, the magnet pole being provided for the coating side, and a second angular coordinate for a further magnet pole, the magnet pole being provided for the coating side; wherein the first angular coordinate and the second angular coordinate define an angle a larger than about 20 degrees and smaller than about 160 degrees. | 11-13-2014 |
20150214018 | METHOD FOR COATING A SUBSTRATE AND COATER - A method for coating a substrate by means of a cathode arrangement including at least two rotatable cathodes is disclosed. The method includes rotating at least one of the at least two rotatable cathodes in a first direction, and, at the same time, rotating at least one of the at least two rotatable cathodes in a second direction. The first direction is opposite to the second direction. Furthermore, a controller for controlling a coating process is disclosed. Furthermore, a coater for coating a substrate is disclosed. The coater includes a cathode arrangement with at least two rotatable cathodes and a controller as disclosed herein. | 07-30-2015 |