Patent application number | Description | Published |
20100190798 | PHARMACEUTICAL COMPOSITION COMPRISING RACEMIC AMINOPTERIN - There is disclosed a pharmaceutical composition comprising racemic aminopterin or pharmaceutically acceptable salts thereof. There is further disclosed a method to treat a disorder in a patient comprising administering a therapeutically effective amount of racemic aminopterin or pharmaceutically acceptable salts of racemic aminopterin. More particularly, there is disclosed a method for treating disorders modulated by at least dihydrofolate reductase activity, such as cancers and inflammatory disorders, wherein the method comprises administering to a patient in need thereof a therapeutically effective amount of racemic aminopterin or a pharmaceutically acceptable salt thereof. | 07-29-2010 |
20100210593 | Pyridine- and Pyrimidinecarboxamides as CXCR2 Modulators - There is disclosed pyridine- and pyrimidinecarboxamide compounds useful as pharmaceutical agents, synthesis processes, and pharmaceutical compositions which include pyridine- and pyrimidinecarboxamides compounds. More specifically, there is disclosed a genus of CXCR2 inhibitor compounds that are useful for treating a variety of inflammatory and neoplastic disorders. | 08-19-2010 |
20120046243 | Aminopyridine- and Aminopyrimidinecarboxamides as CXCR2 Modulators - There is disclosed aminopyridine-and aminopyrimidinecarboxamide compounds useful as pharmaceutical agents, synthesis processes, and pharmaceutical compositions which include aminopyridine- and aminopyrimidinecarboxamides compounds. More specifically, there is disclosed a genus of CXCR2 inhibitor compounds that are useful for treating a variety of inflammatory and neoplastic disorders. | 02-23-2012 |
20140206647 | PYRIMIDINECARBOXAMIDES AS CXCR2 MODULATORS - There is disclosed pyridine- and pyrimidinecarboxamide compounds useful as pharmaceutical agents, synthesis processes, and pharmaceutical compositions which include pyridine- and pyrimidinecarboxamides compounds. More specifically, there is disclosed a genus of CXCR2 inhibitor compounds that are useful for treating a variety of inflammatory and neoplastic disorders. | 07-24-2014 |
20140256678 | Aminopyrimidinecarboxamides as CXCR2 Modulators - There are disclosed aminopyrimidinecarboxamide compounds useful as pharmaceutical agents, synthesis processes, and pharmaceutical compositions which include aminopyrimidinecarboxamides compounds. More specifically, there is disclosed a genus of CXCR2 inhibitor compounds that are useful for treating a variety of inflammatory and neoplastic disorders. | 09-11-2014 |
20150038461 | THIOPYRIMIDINECARBOXAMIDES AS CXCR1/2 MODULATORS - There is disclosed a pyrimidinecarboxamide compound useful as a pharmaceutical agent, synthetic processes, and pharmaceutical compositions which include the pyrimidinecarboxamide compound. More specifically, there is disclosed a CXCR1/2 inhibitor useful for treating a variety of inflammatory and neoplastic disorders. | 02-05-2015 |
20150147341 | THIOPYRIMIDINECARBOXAMIDES AS CXCR1/2 MODULATORS - There is disclosed is a method of treating a pulmonary disease using a pyrimidinecarboxamide compound, and a pharmaceutical composition suitable for inhalation comprising the pyrimidinecarboxamide compound. | 05-28-2015 |
Patent application number | Description | Published |
20140202740 | Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate - In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed. | 07-24-2014 |
20140215782 | MULTILAYER WIRING SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME - A plurality of openings are formed in a resin insulation layer on a top surface side of a wiring laminate portion, and a plurality of openings are formed in a resin insulation layer on a bottom surface side thereof. A plurality of connection terminals are disposed to correspond to the openings. Peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the top surface side, and peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the bottom surface side. Each of the second-main-surface-side connection terminals has a concave portion at the center of the terminal outer surface, and the deepest portion of the concave portion is located on the interior side in relation to the peripheral portion of the terminal outer surface. | 08-07-2014 |
20150027758 | MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREFOR - To provide a multilayer wiring substrate which can reliably prevent removal of a via conductor and which exhibits excellent connection reliability. A multilayer wiring substrate | 01-29-2015 |
20150313018 | WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR - A wiring substrate includes an insulation substrate, a through hole, an upper-surface-side land conductor, a lower-surface-side land conductor, and a through hole conductor. The insulation substrate includes a first insulation layer, a second insulation layer, and a glass fiber layer provided between the first and second insulation layers. The through hole has a diameter which decreases from the upper surface of the insulation substrate toward the interior thereof, which becomes smallest at the glass fiber layer, and which increases from the glass fiber layer toward the lower surface of the insulation substrate. The upper-surface-side land conductor and the lower-surface-side land conductor respectively cover the upper-surface-side and lower-surface-side openings of the through hole. The through hole conductor is formed in the through hole. The upper-surface-side opening of the through hole has a diameter larger than that of the lower-surface-side opening of the through hole, and the upper-surface-side land conductor has a diameter larger than that of the lower-surface-side land conductor. | 10-29-2015 |
20150327362 | MULTILAYER WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR - To improve the degree of freedom of design of a multilayer wiring substrate incorporating therein an electronic component. A multilayer wiring substrate includes a first layered structure including conductor layers and insulation layers including therein via conductors each having a diameter which decreases from the upper surface of the insulation layer toward the lower surface thereof; an electronic component embedded in the first layered structure; and a second layered structure stacked on the first layered structure, and including conductor layers, and an insulation layer including therein a via conductor having a diameter which decreases from the upper surface of the insulation layer toward the lower surface thereof. | 11-12-2015 |
Patent application number | Description | Published |
20100331494 | PROCESS AND APPARATUS FOR PURIFYING SOLID SALT COMPOSITIONS - Methods and apparatus for the recovery and purification of solid salt compositions from an organic liquid containing epoxy resin and at least one of epihalohydrin and solvent to obtain purified salt and/or brine compositions that may be useful in industrial processes. | 12-30-2010 |
20110028744 | PROCESS FOR MANUFACTURING LIQUID EPOXY RESINS - A process for the production of liquid epoxy resins, including: contacting a polyhydric phenol and an epihalohydrin in the presence of an ionic catalyst to form a halohydrin intermediate reaction product; concurrently: reacting a portion of the halohydrin intermediate reaction product with an alkali hydroxide to form a solid salt suspended in a liquid mixture including a dehydrohalogenated product and unreacted halohydrin intermediate, wherein the alkali hydroxide is used at less than a stoichiometric amount; and removing water and epihalohydrin as a vapor from the reacting mixture; separating the solid salt from the liquid mixture; reacting at least a portion of the unreacted halohydrin intermediate with an alkali hydroxide in the presence of water to form an organic mixture including an epoxy resin and unreacted epihalohydrin and an aqueous solution including a salt; separating the aqueous mixture from the organic mixture; and separating the unreacted epihalohydrin from the liquid epoxy resin. | 02-03-2011 |
20110263881 | METHOD OF SEPARATING SOLID SALT FROM EPOXY RESIN SOLUTIONS - Use a centrifuge, especially a peeler centrifuge, that has a coarse salt particle layer deposited on its screen to effect recovery of an epoxy resin, especially a liquid epoxy resin, from a product slurry, which epoxy resin has a lower residual salt content than an epoxy resin recovered without use of the coarse salt particle layer. | 10-27-2011 |
Patent application number | Description | Published |
20140296386 | THERMOPLASTIC POLYESTER RESIN COMPOSITION AND MOLDED ARTICLE THEREOF - A thermoplastic polyester resin composition having: 100 parts by weight total of a resin composition, wherein the resin composition has 75 to 99 wt % of (A) a polybutylene terephthalate resin, and 1.0 to 25 wt % of (B) a polyester elastomer resin and/or an olefin elastomer; and 0.01 to 5 parts by weight of (C) a sorbitan fatty acid ester. The thermoplastic polyester resin composition is useful for making electric/electronic device parts, automobile parts and machine parts, as well as connectors. | 10-02-2014 |
20140296403 | THERMOPLASTIC POLYESTER RESIN COMPOSITION - A colorless thermoplastic polyester resin composition that can form a molded article with good appearance is provided. More specifically, a thermoplastic polyester resin composition is provided, which has (A) polybutylene terephthalate resin, (B) polyethylene terephthlatae resin, (C) nigrosine dye, and (D) glass fibers. The blending amounts are (A) in the range of 55-86 wt. % and (B) in the range of 14-45 wt. % based on 100 wt. % of a total of (A) and (B). Further, (C) is in the range of 0.1-1.5 parts by weight based on 100 parts of a total of (A) and (B). Preferably, the carboxy terminal groups of (A) is at 25 (eq/t), the intrinsic viscosity of (A) is in the range of 0.60-0.90, and the melting point of (C) is less than 300° C. | 10-02-2014 |