Patent application number | Description | Published |
20080307637 | Inspection sensor mounts - In non-limiting, exemplary embodiments a mount assembly is provided for mounting an inspection sensor to a surface of a workpiece. The mount assembly includes a mount having an attachment portion and an engagement portion. The attachment portion is arranged to attach the mount to the surface of the workpiece. The engagement portion is arranged to engage the inspection sensor with the mount. Exemplary mount assemblies may be arranged to mount pulse echo ultrasonic testing transducers, focused ultrasonic testing transducers, through transmission ultrasonic testing transducers, eddy current inspection sensors, or any type of inspection sensor as desired. | 12-18-2008 |
20090317587 | REINFORCED STIFFENERS AND METHOD FOR MAKING THE SAME - A composite stiffener is fabricated using preforms of laminated, unidirectional composite tape. The stiffener includes a void that is reinforced by a filler wrapped with a structural adhesive. The surfaces of the preforms surrounding the void include a layer of composite fabric which is bonded to the filler by the adhesive, thereby increasing the toughness of stiffeners around the void and improving pull-off strength of the stiffener. | 12-24-2009 |
20130309443 | Reinforced Stiffeners and Method for Making the Same - A composite stiffener is fabricated using preforms of laminated, unidirectional composite tape. The stiffener includes a void that is reinforced by a filler wrapped with a structural adhesive. The surfaces of the preforms surrounding the void include a layer of composite fabric which is bonded to the filler by the adhesive, thereby increasing the toughness of stiffeners around the void and improving pull-off strength of the stiffener. | 11-21-2013 |
Patent application number | Description | Published |
20130081790 | LIQUID SUBMERSION COOLED ELECTRONIC SYSTEM - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. | 04-04-2013 |
20130081791 | LIQUID SUBMERSION COOLED DATA STORAGE OR MEMORY SYSTEM - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. | 04-04-2013 |
20130081792 | LIQUID SUBMERSION COOLED POWER SUPPLY SYSTEM - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. | 04-04-2013 |
20130083479 | RACK MOUNTED LIQUID SUBMERSION COOLED ELECTRONIC SYSTEM - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. | 04-04-2013 |
20130094146 | LIQUID SUBMERSION COOLED NETWORK ELECTRONICS - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. | 04-18-2013 |
20140085821 | METHOD AND APPARATUS TO MANAGE COOLANT PRESSURE AND FLOW FOR AN ARRAY OF LIQUID SUBMERGED ELECTRONIC DEVICES - A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array. | 03-27-2014 |