Patent application number | Description | Published |
20100281964 | DEVICE AND METHOD FOR ASSESSING THE MACHINABILITY OF LAMINATES - A device and method for assessing the machinability, particularly the drillability, of epoxy resin laminates by reproducible indentation and analysis of the delamination area of a laminate sample thus provoked. | 11-11-2010 |
20110009527 | THERMOSETTING COMPOSITIONS COMPRISING SILICONE POLYETHERS, THEIR MANUFACTURE, AND USES - Thermosetting compositions comprising a) at least a first thermosetting resin, b) at least one silicone polyether, and c) at least one filler or fibrous reinforcement, methods of making such thermosetting compositions, and thermoset products made from the compositions. | 01-13-2011 |
20110257299 | METAL STABILIZERS FOR EPOXY RESINS - A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed. | 10-20-2011 |
20110263754 | METALLIC COMPOUNDS IN NON-BROMINATED FLAME RETARDANT EPOXY RESINS - A composition comprising a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof, and wherein said composition contains a non-halogen flame retardant is disclosed. | 10-27-2011 |
20110319515 | DIVINYLARENE DIOXIDE RESIN COMPOSITIONS - A curable divinylarene dioxide resin composition including (a) at least one divinylarene dioxide, (b) at least one cationic photoinitiator, and (c) optionally, at least one pigment material; a process for making the curable divinylarene dioxide resin composition; and a cured divinylarene dioxide resin composition made therefrom. The cured product made from the above curable divinylarene dioxide resin composition offers improved properties and are useful for various applications including ink formulations. | 12-29-2011 |
20110319523 | THERMOSETTABLE COMPOSITION CONTAINING A COMBINATION OF AN AMPHIPHILIC BLOCK COPOLYMER AND A POLYOL AND A THERMOSET PRODUCT THEREFROM - A thermosettable composition including (a) at least an amphophilic block copolymer, (b) at least a polyol, (c) at least an epoxy resin containing an average at least 2 oxirane rings per molecule, (d) at least an anhydride hardener containing an average at least 1 anhydride ring per molecule, and (e) at least a catalyst; and a thermoset product prepared from said thermosettable composition. | 12-29-2011 |
20120041170 | REACTIVE INORGANIC CLUSTERS - Storage-stable reactive inorganic clusters and a process for preparing such storage-stable reactive inorganic clusters (e.g., silica structures) having, for example, reactive amino groups. The storage-stable reactive inorganic clusters may be used as a curing agent for thermosetting resin compositions such as epoxy resins. | 02-16-2012 |
20120046391 | ANISOTROPIC COMPOSITE - A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent. | 02-23-2012 |
20120136092 | THERMOSETTABLE RESIN COMPOSITIONS - A reactive thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one curing agent, and (c) optionally, at least one catalyst; wherein the curing agent (b) comprises a reactive inorganic cluster; and wherein the clusters are storage-stable inorganic clusters with reactive functional groups, such as amino groups; a process for preparing a thermoset product from the thermosettable composition. A composition of the reactive clusters as a curing agent and a thermosetting resin may be used to prepare thermoset products with improved thermo-mechanical behavior. | 05-31-2012 |
20120196955 | ANISOTROPIC COMPOSITE - A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent. | 08-02-2012 |
20120283356 | THERMOSETTABLE RESIN COMPOSITIONS - A reactive thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one curing agent, and (c) optionally, at least one catalyst; wherein the curing agent (b) comprises a reactive inorganic cluster; and wherein the clusters are storage-stable inorganic clusters with reactive functional groups, such as amino groups; a process for preparing a thermoset product from the thermosettable composition. A composition of the reactive clusters as a curing agent and a thermosetting resin may be used to prepare thermoset products with improved thermo-mechanical behavior. | 11-08-2012 |
20130090407 | CURABLE RESIN COMPOSITIONS - A photocationically-curable composition including (a) at least one divinylarene dioxide, (b) at least one cationic photoinitiator, and (c) at least one cyclic ester compound; a process for making the curable composition; and a cured product made therefrom. The cured product made from the above curable composition offers improved properties and are useful for various applications including ink formulations. | 04-11-2013 |
20130178558 | THERMOSET DAMPENER MATERIAL - Thermoset compositions useful for dampening vibrations at elevated temperatures are disclosed. The thermoset compositions may have a glass transition temperature of 150° C. or greater, a tan δ peak of 0.2 or greater, and a tan δ peak width measured at half-height larger than about 40° C., as measured by dynamic thermo-mechanical analysis (DMTA) at a frequency of 1 Hz. The thermoset compositions may be used to dampen vibrations at temperatures in excess of 100° C. | 07-11-2013 |
20140186536 | CURABLE RESIN COMPOSITIONS - A curable epoxy resin composition including (a) at least one epoxy resin; and (b) at least one hardener; wherein the curable epoxy resin composition has at least two exotherm peaks representing at least two distinct chemical reactions and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable epoxy resin composition of being B-staged. | 07-03-2014 |
20140212582 | CURABLE RESIN COMPOSITIONS - A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged. | 07-31-2014 |
20140316068 | BIMODAL TOUGHENING AGENTS FOR THERMOSETTABLE EPOXY RESIN COMPOSITIONS - A bimodal toughening agent comprising a) a first preformed coreshell toughening agent and b) a second preformed coreshell toughening agent wherein the second preformed coreshell toughening agent has a particle size of at least two times larger than that of the first preformed coreshell toughening agent, and the use of the bimodal toughening agent in a thermosettable epoxy resin composition, is disclosed. | 10-23-2014 |