Patent application number | Description | Published |
20080297302 | ON CHIP ZINC OXIDE THIN FILM VARISTOR, FABRICATION METHOD THEREOF AND APPLICATIONS THEREOF - The present invention discloses an on chip zinc oxide thin film varistor, a fabrication method thereof and applications thereof. In the present invention, a zinc oxide-containing film is directly formed on a substrate with a sputtering method, and then the zinc oxide-containing film is processed with a post-annealing treatment to raise the resistance thereof. Thus, an on chip zinc oxide thin film varistor having a superior performance is attained. The fabrication process of the present invention is easy to control and has a high reliability. Further, the fabrication process of the present invention can fully integrate with the semiconductor processes, which benefits the surge protection of semiconductor components. | 12-04-2008 |
20090046407 | CASCADE ELECTROMAGNETIC PULSE PROTECTION CIRCUIT - The present invention discloses a cascade EMP protection circuit, which comprises an LEMP protection circuit and a fast-response protection circuit, wherein a capacitive reactance varactor element is cascaded to the path of signal transmission. Thereby, the present invention can protect electronic devices against LEMP or EMP released by an electronic weapon (NEMP, HEMP, or PEMP). | 02-19-2009 |
20090237848 | ELECTRO-MAGNETIC PULSE PROTECTION CIRCUIT WITH A COUNTER - An EMP protection circuit with a counter has a surge protection circuit capable of suppressing EMP, and also use an extra counting circuit for sensing light emission or variation of magnetic force of the surge protection circuit to count the action times of the surge protection circuit, thereby warning that the surge protection circuit has reached its time-limit of use and has to be replaced. In this way, various kinds of electronic products can be more perfectly protected to avoid higher loss. | 09-24-2009 |
20090310273 | ELECTROMAGNETIC PULSE PROTECTION CIRCUIT HAVING WAVE FILTERING CAPABILITY - An electromagnetic pulse protection circuit having wave filtering functions, composed of an LEMP protection circuit and a fast response protection circuit, and a filter is series-connected on a signal transmission route, and is utilized to provide impedance in effectively preventing electromagnetic pulses caused by lightning (LEMP) or other electronic weapon (NEMP, HEMP, PEMP) interferences. In addition, it is capable of suppressing electromagnetic pulses at specific frequencies, thus, raising the capability of electronic elements in resisting against electromagnetic pulses. Furthermore, said filter is made of high-temperature-super-conduction (HTSC) material, so that when said HTSC material of said filter is subject to a sudden infusion or invasion of said electromagnetic pulses, it is switched to a high impedance state in a very short period of time in effectively restricting currents passing through said filter, hereby avoiding the damages of a communication system. | 12-17-2009 |
20100230722 | HIGH ELECTRON MOBILITY FIELD EFFECT TRANSISTOR (HEMT) DEVICE - A High Electron Mobility Transistor (HEMT) device, which is formed by connecting a plurality of low power flip-chip type High Electron Mobility Transistor (HEMT) elements in parallel, or connected them in parallel and in series in combination into a tree-shaped structure, and then connecting said structure to an input terminal and an output terminal. Distances between each of the flip-chip type HEMT elements, from each element to said input terminal, and from each element to said output terminal are designed to be equal, such that powers consumed by each of the flip-chip type HEMT elements are equal, currents flowing through are evenly distributed, and heat generated is liable to be dissipated. A spike leakage protection layer, such as zinc-oxide (ZnO) amorphous layer or poly-crystal layer, is further included, hereby further enhancing the efficiency of said flip-chip type HEMT element and prolonging its service life. | 09-16-2010 |
20110056530 | HIGH CONCENTRATED PHOTOVOLTAIC (HCPV) SOLAR CELL MODULE - A high concentrated photovoltaic (HCPV) solar cell module, comprising: a set of Fresnel lenses, a Group III-V semiconductor solar cell, and a substrate used to carry said Group III-V semiconductor solar cell. Wherein, said substrate is made of material of good heat dissipation, for assisting heat dissipation. Said set of Fresnel lenses includes a plurality of stacked-up Fresnel lenses, thus concentrating sunlights to said Group III-V semiconductor solar cell with a significantly higher concentration ratio. As such, in addition to the advantages of small volume, light weight, and cost saving, it is devoid of the problem of a conventional single piece Fresnel lens of insufficient light concentration capability. Therefore, said Group III-V semiconductor solar cell is capable of receiving much more sunlights per unit area, and achieving high photoelectric conversion efficiency; meanwhile, reducing number and area required by said Group III-V semiconductor solar cell, thus achieving reduction of production cost. | 03-10-2011 |
Patent application number | Description | Published |
20090068496 | LED STRUCTURE - The present invention discloses an improved LED structure and comprises: a circuit brace, a bowl member; a light chip; a welding line; a packing mask; and a photocatalystic agent. The volume of an LED is smaller so as to be convenient for installment. Compared the present invention to a light tube with same power, the present invention can be added several LEDs in order to increase the curve surface area to contact air, so that the functions of disinfection, deodorization, and mildewproof can be effectively achieved. | 03-12-2009 |
20100200891 | LED STRUCTURE - The present invention discloses an improved LED structure and comprises: a LED chip; a wire; a packing mask; and a photocatalytic agent. The volume of an LED is smaller so as to be convenient for installation. Compared to a conventional LED with same power, the present invention increases the total contact surface area that contacts air, so that the functions of disinfection, deodorization, and mildewproofing can be effectively achieved. | 08-12-2010 |
20110242719 | CASCADE ELECTROMAGNETIC PULSE PROTECTION CIRCUIT FOR HIGH FREQUENCY APPLICATION - The present invention discloses a cascade EMP protection circuit, which comprises an LEMP protection circuit and a fast-response protection circuit, wherein a symmetric capacitive varactor element is cascaded to the path of signal transmission. Thereby, the present invention can protect electronic devices against LEMP or EMP released by an electronic weapon (NEMP, HEMP, or PEMP). | 10-06-2011 |
20120153407 | LIGHT-ASSISTED BIOCHEMICAL SENSOR - A light-assisted biochemical sensor based on a light addressable potentiometric sensor is disclosed. The light-assisted biochemical sensor comprises a semiconductor substrate and a sensing layer, which are used to detect the specific ion concentration or the biological substance concentration of a detected solution. Lighting elements fabricated directly on the back surface of the semiconductor substrate directly illuminate the light to the semiconductor substrate, so as to enhance the photoconduction property of the semiconductor substrate. And then, the hysteresis and the sensing sensitivity of the light-assisted biochemical sensor are respectively reduced and improved. In addition, due to its characteristics of integration, the light-assisted biochemical sensor not only reduces the fabrication cost but also has portable properties and real-time detectable properties. As a result, its detection range and the application range are wider. | 06-21-2012 |
20120236569 | LIGHT-EMITTING-DIODE (LED) LIGHT BULB - An LED light bulb, mainly comprising: an LED module, provided with a first connection portion; a circuit driving module, provided with a second connection portion, said first connection portion is connected to said second connection portion; and a lamp hood covered over said LED module. As such, said LED module or said circuit driving module can be replaced readily when they are found broken down, without the need to discard entire set of LED light bulb, hereby eliminating unnecessary waste, in achieving both cost effectiveness and environment protection. | 09-20-2012 |
20120264236 | FLUORESCENT POWDER APPLYING DEVICE AND METHOD CAPABLE OF DETECTING INSTANTLY COLOR TEMPERATURE OF WHITE LIGHT IN A MANUFACTURING PROCESS - A fluorescence powder spraying device capable of detecting instantly color temperature of white light in a manufacturing process, comprising: a spraying region, provided with a movable nozzle and an LED component-to-be-sprayed; a measuring region, provided with a light source and a light detector; and a monitor plate, which can be moved in said spraying region and said measuring region. Said monitor plate undergoes at least a fluorescence powder spraying process with said LED components-to-be-sprayed in said spraying region, to form at least a fluorescence powder layer, and in said measuring region, use said light source to agitate said fluorescence powder layer on said monitor plate, and use said light detector to measure color temperature of white light, to detect speedily color temperature of said fluorescence powder layer, hereby raising. yield of LED component reaching the target color temperature. | 10-18-2012 |
20120286064 | CONNECTION-PIPE SEDIMENT PREVENTION DEVICE AND METHOD - A connection-pipe sediment prevention device and method. In said connection-pipe sediment prevention device, at least a pressuring element is disposed at an opening of a pipe body of said connection-pipe, and a controller controls reciprocal movements of said pressuring elements, to make suspension liquid to flow in said connection-pipe and not to produce sediment. A nozzle is provided at bottom of said connection-pipe, to spray out said suspension liquid. Said connection-pipe sediment prevention method utilizes same means to make powder distribute evenly in said suspension liquid, so that said suspension liquid is sprayed out evenly from said nozzle. A connection-pipe principle is used, such that said suspension liquid having insoluble powder will not produce sediment, in achieving uniform spray. In addition, it is not required to put in large amount of powder and liquid at one time, thus saving production cost. | 11-15-2012 |
20120313119 | THREE DIMENSIONAL LIGHT-EMITTING-DIODE (LED) STACK AND METHOD OF MANUFACTURING THE SAME - A three dimensional (3-D) light-emitting-diode (LED) stack and method of manufacturing the same, comprising: a substrate; at least a first LED, stacked on said substrate; and at least a second LED, stacked on said first LED, such that energy gap of said first LED is smaller than energy gap of said second LED. In said stack mentioned above, a material of larger energy gap capable of emitting light of shorter wavelength can be penetrated by lights emitted by another material of smaller energy gap capable emitting lights of longer wavelength, such that lights are mixed together and then emitted, and said materials are put into a three dimensional stack arrangement, to form a brand new light emitting device of mixed light, so as to emit lights as required. | 12-13-2012 |
20130233373 | Concentrated Photovoltaic (CPV) Cell Module - A concentrated photovoltaic (CPV) cell module, comprising: a shell; a Fresnel lens set, provided on top of said shell; a first solar cell, provided on bottom of said shell and opposite to said Fresnel lens set; and at least a second solar cell, provided on surrounding wall and/or bottom of said shell, so that area originally not capable of generating power is able to generate power, to raise power generating capacity per unit area of said concentrated photovoltaic (CPV) cell module. | 09-12-2013 |
20130234105 | Bond type flip-chip light-emitting structure and method of manufacturing the same - A bond type flip-chip light-emitting structure and method of manufacturing the same. Firstly, form a positive electrode and a negative electrode on an epitaxy layer. Next, deposit an insulation layer on parts of the positive electrode and negative electrode, to expose respectively a positive electrode via hole and a negative electrode via hole. Then, form a bonded metal layer on the insulation layer, the positive electrode via hole, and the negative electrode via hole, so that the positive electrode and the negative electrode are on a same plane by means of the bonded metal layer. Finally, on a substrate, bond the first metal layer and the second metal layer onto the corresponding first bonded metal unit and the second bonded metal unit of the bonded metal layer, to form into shape, thus realizing a bond type flip-chip light-emitting structure. | 09-12-2013 |
20140184064 | GAS DISCHARGE TUBES - An novelly designed gas discharge tube (GDT) comprising at least two electrodes and at least one hollow insulating ring fastened to at least one of the electrodes, wherein the hollow insulating ring has an inductive property or a variable resistance property, thereby the new gas discharge tube can provide another possibility of a circuit design. | 07-03-2014 |
Patent application number | Description | Published |
20080227246 | Method of sulfuration treatment for a strained InAlAs/InGaAs metamorphic high electron mobility transistor - This invention relates to a method of sulfuration treatment for InAlAs/InGaAs metamorphic high electron mobility transistor (MHEMT), and the sulfuration treatment is applied to the InAlAs/InGaAs MHEMT for a passivation treatment for Gate, in order to increase initial voltage, lower the surface states and decrease surface leakage current, which makes the MHEMT work in a range of high current density and high input power. | 09-18-2008 |
20080276989 | METHOD OF HYBRID STACKED FLIP CHIP FOR A SOLAR CELL - A method of hybrid stacked Flip Chip for a solar cell onto which semiconductor layers of different materials are stacked in the Flip-Chip technology to solve the problem of lattices mismatch between the layers for further increase of the efficiency of solar cell. | 11-13-2008 |
20090108278 | Manufacturing Method of an Antistatic Flip Chip Substrate Connected to Several Chips - The present invention provides the manufacturing method and device of an antistatic flip chip substrate that can be connected to several chips; this device could protect LED semiconductors against electrostatic discharge damage, and also save cost and space for the assembly of LED semiconductors. | 04-30-2009 |
20090315077 | MULTI-LAYER STRUCTURE WITH A TRANSPARENT GATE - A multi-layer structure with a transparent gate includes a MHEMT device structure comprising a GaAs substrate, a Schottky layer and a cap layer formed on the Schottky layer; a transparent gate formed on the Schottky layer being an indium tin oxide, ITO; and a drain and a source formed on the cap layer. Moreover, the MHEMT device structure includes a graded buffer, a buffer layer, a first spacer layer, a channel layer, and a second spacer layer formed between the GaAs substrate and the Schottky layer in a stacked fashion. The multi-layer structure is a transparent gate HEMT employing indium tin oxide which can make HEMT more sensitive to the light wave. | 12-24-2009 |
Patent application number | Description | Published |
20140024169 | Method of Hybrid Stacked Flip Chip for a Solar Cell - A method of hybrid stacked Flip chip for a solar cell onto which semiconductor layers of different materials are stacked in the Flip chip technology to solve the problem of lattices mismatch between the layers for further increase of the efficiency of solar cell. | 01-23-2014 |
20140093995 | Method of Hybrid Stacked Chip for a Solar Cell - A method of hybrid stacked Chip for a solar cell onto which semiconductor layers of different materials is provided by stacking tunnel layer and bumps in order to solve the problem of lattices mismatch between the layers for further increasing of the efficiency of solar cell. Electric charges (i.e., current) generated by respective solar cells can be outputted by means of contacts. Further total power P is defined by a summation of powers of respective solar cells, i.e., V1I1+V2I2+ . . . VnIn. This is a great increase in comparison with the power of conventional solar cells connected in series. | 04-03-2014 |
20140256307 | Combination Device with a Long Distance Remote Cell Phone, Having Functional Control Items and Being Mix-operated by Voice and Touch, and a Receiving Switching Controller - A combination device with a long distance remote cell phone, having functional control items and being mix-operated by voice and touch, and a receiving switching controller, comprising a parental control cell phone, having functional control items and being mix-operated by voice and touch and a receiving switching controller, is provided. The receiving switching controller receives messages and compares phone numbers or web addresses of a white list to allow follow-up tasks or communications, which comprise corresponding decoding, activating video communication, multi-functional code storage, and corresponding output by driving circuit and relay. | 09-11-2014 |