Patent application number | Description | Published |
20110266404 | Wall mounting bath accessory assembly - A wall mounting bath accessory assembly contains a fixing member to be locked to a wall including a groove defined therein so that between the groove and the wall is defined a movable space and an upper locking portion disposed on a top end thereof; a sliding member limited to move between an upper dead center and a lower dead center of the movable space and including an upper abutting portion disposed on a top end thereof and a lower locking portion extending from a bottom end thereof; a retaining member located on an outer side of the fixing member and including an upper fastening portion extending from a top end of thereof, and a lower fastening portion extending from a bottom end thereof; a base including a receiving chamber to receive the retaining member, the fixing member, and the sliding member. | 11-03-2011 |
20120137427 | Fixing structure of a faucet and an operating method thereof - A fixing structure of a faucet fixed on a support plate with an opening and contains the faucet including a housing having a mouth and a through aperture; the faucet also including an inlet pipe unit; a locking member being operated to move between an engaging position and a disengaging position along the through aperture; a positioning device including a fitting seat having a bottom face, a channel defined therein to receive the inlet pipe unit of the faucet, at least one slot disposed along an outer surface thereof to slide the locking member located at the engaging position, the slot including at least one tooth and at least one retaining recess such that the locking member passes through the tooth to be retained in the retaining recess and is limited by the tooth to move so that the mouth is fixed to the fitting seat. | 06-07-2012 |
20120168583 | Wall mounting bath accessory assembly - A wall mounting bath accessory assembly contains a fixing member including an inner wall, an outer wall, and two side walls; the inner wall including at least one recess and a retaining fence; on a connecting corner of each side wall and the outer wall being fixed a first resilient lock block, and the first resilient lock block including a first arcuate projection; a base formed in a cover shape and including a groove in which an opening is formed so that the fixing member is received in the groove via the opening, the groove including two first positioning ribs, and each first positioning rib including a first engaging slot; the groove also including two second positioning ribs, and each second positioning rib including a second engaging slot formed on a top end thereof proximate to the opening. | 07-05-2012 |
20120273703 | Hands-free Faucet - A hands-free faucet contains a body fixed on a non-electrical conducting basin and including a spray head and a receiving groove; a manual control valve installed in the receiving groove and including a holder and a manual handle; the holder being made of an insulating material and including a first, a second channels, and an outlet channel; a tube assembly including a first tube, a second tube, and a third tube; a first extension, a second extension, and a third extension of the first tube, the second tube, and the third tube are made of insulating materials respectively; the third tube including an exposed section, and the exposed section including a solenoid valve; a proximity sensor module including a capacitive sensor and a controller; a power supply served to supply power toward the proximity sensor module. | 11-01-2012 |
20120291191 | Press touch pop-up stopper - A press touch pop-up stopper is used in a basin and contains a pipe set fixed in an opening of a bottom end of the basin and including a hole disposed therein and having an outlet fixed on a top end of the hole; a stopper assembly received in the pipe set and including a plug, after the plug is pressed, it bounces automatically to turn on the outlet so as to flow water, after the plug is pressed again, it closing the outlet to stop flowing the water; a vertical connecting structure defined between the pipe set and the stopper assembly so that when the stopper assembly is pulled upward, it disengages from the pipe set, and when the stopper assembly is pressed downward to be received in the pipe set, it is connected with the pipe set. | 11-22-2012 |
20130067657 | Automatic faucet - An automatic faucet contains a body including a spout; a spray head mounted on the spout to be pulled outward or retracted inward; an optical detecting device fixed on the spout to detect a hand of a user and to transmit a digital signal; wherein between a transmitting direction of an infrared ray and a water flowing direction of the spray head is formed an angle, and the angle is between 150 to 190 degrees; a controlling device to receive the digital signal of the optical detecting device and to control the water to flow out of the spray head. | 03-21-2013 |
20130180601 | Fixing Structure of a Pull-Out Faucet - A fixing structure of a pull-out faucet is mounted on a platform with a fixing hole and contains a pull-out faucet including a housing, a pull-out spray head, a mixing valve, and a pipe line set; the pipe line set including a plurality of fixedly static pipe lines and a movably dynamic pipe line; a positioning device including a seat and a clamping set; the seat being fixed under the platform by the clamping set and being fixed in the fixing hole to fit with the housing, the seat including a passage set for inserting the pipe line set; wherein the passage set has a first passage for inserting the static pipe lines and a second passage for inserting the dynamic pipe line, and the first passage is spaced apart from the second passage so that the dynamic pipe line is limited in the second passage to move smoothly. | 07-18-2013 |
Patent application number | Description | Published |
20090297294 | QUICK FASTENING NUT - A quick fastening nut includes a first ring member and a second ring member. The first ring member has a bore at a center thereof and fastening portions around the bore. Each of the fastening portions has a threaded section at an inner side thereof. The second ring member has a bore at a center thereof and a plurality of stop portions, each of which has a stop face on a distal end thereof. The fastening portions of the first ring member is inserted into the bore of the second ring member that the second ring member may be moved along the fastening portions of the first ring member, and the second ring member will bend the fastening portions inwards when the second ring member is moved toward distal ends of the fastening portions. | 12-03-2009 |
20100032943 | QUICK INSTALLED JOINT ASSEMBLY - A quick installed joint assembly includes a fitting body, a sleeve, and an inlet pipe. One end of the chamber of the body communicates with a water supply pipeline, and the other end communicates with an accommodation part and passing through the fitting body. The sleeve is disposed within the accommodation part and has stopper portions. Each stopper portion has a wedge-like portion and a hook portion is extending outwardly from the wedge-like portion. The body has plural openings corresponding to each stopper portion, so that one end of the inlet pipe can pass through the sleeve and be inserted within the chamber. The inlet pipe corresponding to the bottom edge of the stopper portion has a large diameter portion for leaning against on the stopper portion, so the hook portion can be hooked on the openings and the inside wall of the accommodation part can support the wedge-like portion. | 02-11-2010 |
20100050337 | POP-UP DRAIN STOPPER LINKAGE ASSEMBLY - A pop-up drain stopper linkage assembly includes a lift rod, a connecting bar, a pivot rod and a drain stopper. The bottom end of the lift rod forms an engagement part. The upper end of the connecting bar has an engagement groove for the engagement part of the lift rod being engaged and fixed, and the connecting bar has a plurality of holes spaced apart a distance away from the engagement groove. The second end of the pivot rod connects to the drain stopper and a section adjacent the first end has a plurality of fixed portions for tying in with the hole of the connecting bar, and each of the fixed portions and any one of the holes are capable of being passing through and positioning with each other. Thereby, the pop-up drain stopper linkage assembly can be quickly and conveniently assembled with reliable linking effect. | 03-04-2010 |
Patent application number | Description | Published |
20090039488 | Semiconductor package and method for fabricating the same - A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier is greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant. | 02-12-2009 |
20110156227 | SEMICONDUCTOR PACKAGE STRUCTURE - A semiconductor package structure includes: a dielectric layer; a metal layer disposed on the dielectric layer and having a die pad and traces, the traces each including a trace body, a bond pad extending to the periphery of the die pad, and an opposite trace end; metal pillars penetrating the dielectric layer with one ends thereof connecting to the die pad and the trace ends while the other ends thereof protruding from the dielectric layer; a semiconductor chip mounted on the die pad and electrically connected to the bond pads through bonding wires; and an encapsulant covering the semiconductor chip, the bonding wires, the metal layer, and the dielectric layer. The invention is characterized by disposing traces with bond pads close to the die pad to shorten bonding wires and forming metal pillars protruding from the dielectric layer to avoid solder bridging encountered in prior techniques. | 06-30-2011 |
20110156252 | SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND FABRICATION METHOD THEREOF - A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability. | 06-30-2011 |
20110157851 | PACKAGE STRUCTURE - A package structure includes a base body having a first encapsulant and a wiring layer embedded in and exposed from the first encapsulant. The wiring layer has a plurality of conductive traces and a plurality of first electrical contact pads. The first encapsulant has openings for exposing the first electrical contact pads, a chip electrically connected to the wiring layer, and a second encapsulant formed on the base body for covering the chip and the wiring layer, thereby providing an even surface for preventing the encapsulant from cracking when the chip is mounted. | 06-30-2011 |
20110159643 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE - A fabrication method of a semiconductor package structure includes: patterning a metal plate having first and second surfaces; forming a dielectric layer on the metal plate; forming a metal layer on the first surface and the dielectric layer; forming metal pads on the second surface, the metal layer having a die pad and traces each having a bond pad; mounting a semiconductor chip on the die pad, followed by connecting electrically the semiconductor chip to the bond pads through bonding wires; forming an encapsulant to cover the semiconductor chip and the metal layer; removing portions of the metal plate not covered by the metal pads so as to form metal pillars; and performing a singulation process. The fabrication method is characterized by disposing traces with bond pads close to the die pad to shorten the bonding wires and forming metal pillars protruding from the dielectric layer to avoid solder bridging. | 06-30-2011 |
20130161802 | SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND FABRICATION METHOD THEREOF - A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability. | 06-27-2013 |
20130200508 | SEMICONDUCTOR PACKAGE STRUCTURE - A semiconductor package structure includes: a dielectric layer; a metal layer disposed on the dielectric layer and having a die pad and traces, the traces each including a trace body, a bond pad extending to the periphery of the die pad, and an opposite trace end; metal pillars penetrating the dielectric layer with one ends thereof connecting to the die pad and the trace ends while the other ends thereof protruding from the dielectric layer; a semiconductor chip mounted on the die pad and electrically connected to the bond pads through bonding wires; and an encapsulant covering the semiconductor chip, the bonding wires, the metal layer, and the dielectric layer. The invention is characterized by disposing traces with bond pads close to the die pad to shorten bonding wires and forming metal pillars protruding from the dielectric layer to avoid solder bridging encountered in prior techniques. | 08-08-2013 |
20140080264 | METHOD FOR FABRICATING LEADFRAME-BASED SEMICONDUCTOR PACKAGE - A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier s greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant. | 03-20-2014 |
20140206146 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES - A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability. | 07-24-2014 |
20150091150 | PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A method for fabricating a POP structure is disclosed. First, a first package is provided, which has: a dielectric layer; a stacked circuit layer embedded in the dielectric layer and exposed from upper and lower surfaces of the dielectric layer; a plurality of conductive posts and a semiconductor chip disposed on the upper surface of the dielectric layer and electrically connected to the stacked circuit layer; and an encapsulant formed on upper surface of the dielectric layer for encapsulating the semiconductor chip and the conductive posts and having a plurality of openings for exposing top ends of the conductive posts. Then, a second package is disposed on the encapsulant and electrically connected to the conductive posts. The formation of the conductive posts facilitates to reduce the depth of the openings of the encapsulant, thereby reducing the fabrication time and increasing the production efficiency and yield. | 04-02-2015 |
Patent application number | Description | Published |
20120308066 | COMBINED MICRO-ELECTRO-MECHANICAL SYSTEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME - A combined MicroElectroMechanical Systems (MEMS) microphone includes a first substrate, a second substrate, a vibrating diaphragm, a backplate, and an accommodating slot. The first substrate has a first chamber, the vibrating diaphragm is disposed on the first chamber, the second substrate has a second chamber, one side of the backplate is disposed on the second chamber, and the other side of the backplate is disposed on the vibrating diaphragm, so that the second substrate is combined with the first substrate. In addition, the backplate has multiple sound holes, and the accommodating slot is disposed between the first substrate and the second substrate to form a space between the vibrating diaphragm and the backplate. | 12-06-2012 |
20140117537 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - Disclosed is a semiconductor package including an encapsulant having a top surface and a bottom surface opposite to the top surface; a semiconductor chip embedded in the encapsulant having an active surface, an inactive surface opposite to the active surface, and lateral surfaces interconnecting the active surface and the inactive surface, wherein the active surface protrudes from the bottom surface of the encapsulant and the semiconductor chip further has a plurality of electrode pads disposed on the active surface; a positioning member layer formed on a portion of the bottom surface of the encapsulant, covering the lateral surfaces of the semiconductor chip that protrude therefrom, and exposing the active surface; and a build-up trace structure disposed on the active surface of the semiconductor chip and the positioning member layer formed on the bottom surface of the encapsulant. The present invention also provides a method of fabricating a semiconductor package. | 05-01-2014 |
Patent application number | Description | Published |
20090265159 | SPEECH RECOGNITION METHOD FOR BOTH ENGLISH AND CHINESE - The present invention can recognize both English and Chinese at the same time. The most important skill is that the features of all English words (without samples) are entirely extracted from the features of Chinese syllables. The invention normalizes the signal waveforms of variable lengths for English words (Chinese syllables) such that the same words (syllables) can have the same features at the same time position. Hence the Bayesian classifier can recognize both the fast and slow utterance of sentences. The invention can improve the feature such that the speech recognition of the unknown English (Chinese) is guaranteed to be correct. Furthermore, since the invention can create the features of English words from the features of Chinese syllables, it can also create the features of other languages from the features of Chinese syllables and hence it can also recognize other languages, such as German, French, Japanese, Korean, Russian, etc. | 10-22-2009 |
20110035216 | SPEECH RECOGNITION METHOD FOR ALL LANGUAGES WITHOUT USING SAMPLES - The invention can recognize any several languages at the same time without using samples. The important skill is that features of known words in any language are extracted from unknown words or continuous voices. These unknown words represented by matrices are spread in the 144-dimensional space. The feature of a known word of any language represented by a matrix is simulated by the surrounding unknown words. | 02-10-2011 |
20120116764 | Speech recognition method on sentences in all languages - A speech recognition method on all sentences in all languages is provided. A sentence can be a word, name or sentence. All sentences are represented by E×P=12×12 matrices of linear predict coding cepstra (LPCC) 1000 different voices are transformed into 1000 matrices of LPCC to represent 1000 databases. E×P matrices of known sentences after deletion of time intervals between two words are put into their closest databases. To classify an unknown sentence, use the distance to find its F closest databases and then from known sentences in its F databases, find a known sentence to be the unknown one. The invention needs no samples and can find a sentence in one second using Visual Basic. Any person without training can immediately and freely communicate with computer in any language. It can recognize up to 7200 English words, 500 sentences of any language and 500 Chinese words. | 05-10-2012 |
Patent application number | Description | Published |
20090265159 | SPEECH RECOGNITION METHOD FOR BOTH ENGLISH AND CHINESE - The present invention can recognize both English and Chinese at the same time. The most important skill is that the features of all English words (without samples) are entirely extracted from the features of Chinese syllables. The invention normalizes the signal waveforms of variable lengths for English words (Chinese syllables) such that the same words (syllables) can have the same features at the same time position. Hence the Bayesian classifier can recognize both the fast and slow utterance of sentences. The invention can improve the feature such that the speech recognition of the unknown English (Chinese) is guaranteed to be correct. Furthermore, since the invention can create the features of English words from the features of Chinese syllables, it can also create the features of other languages from the features of Chinese syllables and hence it can also recognize other languages, such as German, French, Japanese, Korean, Russian, etc. | 10-22-2009 |
20110035216 | SPEECH RECOGNITION METHOD FOR ALL LANGUAGES WITHOUT USING SAMPLES - The invention can recognize any several languages at the same time without using samples. The important skill is that features of known words in any language are extracted from unknown words or continuous voices. These unknown words represented by matrices are spread in the 144-dimensional space. The feature of a known word of any language represented by a matrix is simulated by the surrounding unknown words. | 02-10-2011 |
20120116764 | Speech recognition method on sentences in all languages - A speech recognition method on all sentences in all languages is provided. A sentence can be a word, name or sentence. All sentences are represented by E×P=12×12 matrices of linear predict coding cepstra (LPCC) 1000 different voices are transformed into 1000 matrices of LPCC to represent 1000 databases. E×P matrices of known sentences after deletion of time intervals between two words are put into their closest databases. To classify an unknown sentence, use the distance to find its F closest databases and then from known sentences in its F databases, find a known sentence to be the unknown one. The invention needs no samples and can find a sentence in one second using Visual Basic. Any person without training can immediately and freely communicate with computer in any language. It can recognize up to 7200 English words, 500 sentences of any language and 500 Chinese words. | 05-10-2012 |
Patent application number | Description | Published |
20090265159 | SPEECH RECOGNITION METHOD FOR BOTH ENGLISH AND CHINESE - The present invention can recognize both English and Chinese at the same time. The most important skill is that the features of all English words (without samples) are entirely extracted from the features of Chinese syllables. The invention normalizes the signal waveforms of variable lengths for English words (Chinese syllables) such that the same words (syllables) can have the same features at the same time position. Hence the Bayesian classifier can recognize both the fast and slow utterance of sentences. The invention can improve the feature such that the speech recognition of the unknown English (Chinese) is guaranteed to be correct. Furthermore, since the invention can create the features of English words from the features of Chinese syllables, it can also create the features of other languages from the features of Chinese syllables and hence it can also recognize other languages, such as German, French, Japanese, Korean, Russian, etc. | 10-22-2009 |
20110035216 | SPEECH RECOGNITION METHOD FOR ALL LANGUAGES WITHOUT USING SAMPLES - The invention can recognize any several languages at the same time without using samples. The important skill is that features of known words in any language are extracted from unknown words or continuous voices. These unknown words represented by matrices are spread in the 144-dimensional space. The feature of a known word of any language represented by a matrix is simulated by the surrounding unknown words. | 02-10-2011 |
20120116764 | Speech recognition method on sentences in all languages - A speech recognition method on all sentences in all languages is provided. A sentence can be a word, name or sentence. All sentences are represented by E×P=12×12 matrices of linear predict coding cepstra (LPCC) 1000 different voices are transformed into 1000 matrices of LPCC to represent 1000 databases. E×P matrices of known sentences after deletion of time intervals between two words are put into their closest databases. To classify an unknown sentence, use the distance to find its F closest databases and then from known sentences in its F databases, find a known sentence to be the unknown one. The invention needs no samples and can find a sentence in one second using Visual Basic. Any person without training can immediately and freely communicate with computer in any language. It can recognize up to 7200 English words, 500 sentences of any language and 500 Chinese words. | 05-10-2012 |
Patent application number | Description | Published |
20090265159 | SPEECH RECOGNITION METHOD FOR BOTH ENGLISH AND CHINESE - The present invention can recognize both English and Chinese at the same time. The most important skill is that the features of all English words (without samples) are entirely extracted from the features of Chinese syllables. The invention normalizes the signal waveforms of variable lengths for English words (Chinese syllables) such that the same words (syllables) can have the same features at the same time position. Hence the Bayesian classifier can recognize both the fast and slow utterance of sentences. The invention can improve the feature such that the speech recognition of the unknown English (Chinese) is guaranteed to be correct. Furthermore, since the invention can create the features of English words from the features of Chinese syllables, it can also create the features of other languages from the features of Chinese syllables and hence it can also recognize other languages, such as German, French, Japanese, Korean, Russian, etc. | 10-22-2009 |
20110035216 | SPEECH RECOGNITION METHOD FOR ALL LANGUAGES WITHOUT USING SAMPLES - The invention can recognize any several languages at the same time without using samples. The important skill is that features of known words in any language are extracted from unknown words or continuous voices. These unknown words represented by matrices are spread in the 144-dimensional space. The feature of a known word of any language represented by a matrix is simulated by the surrounding unknown words. | 02-10-2011 |
20120116764 | Speech recognition method on sentences in all languages - A speech recognition method on all sentences in all languages is provided. A sentence can be a word, name or sentence. All sentences are represented by E×P=12×12 matrices of linear predict coding cepstra (LPCC) 1000 different voices are transformed into 1000 matrices of LPCC to represent 1000 databases. E×P matrices of known sentences after deletion of time intervals between two words are put into their closest databases. To classify an unknown sentence, use the distance to find its F closest databases and then from known sentences in its F databases, find a known sentence to be the unknown one. The invention needs no samples and can find a sentence in one second using Visual Basic. Any person without training can immediately and freely communicate with computer in any language. It can recognize up to 7200 English words, 500 sentences of any language and 500 Chinese words. | 05-10-2012 |
Patent application number | Description | Published |
20110259937 | FASTENER DRIVING TOOL - A fastener driving tool includes a flywheel rotated by a drive unit and having a wheel rim formed with teeth, an impact member having a mating toothed unit movable with a carrier frame to engage the teeth so as to be swept thereby to an end-stroke position to enable a striking rod to drive a fastener into a targeted workpiece, and an actuating unit configured to actuate the carrier frame to move from an upper position to a lower position in response to a triggering action of a trigger so as to move the mating toothed unit from an disengaging position to an engaging position. | 10-27-2011 |
20120067934 | NAILING GUN - A nailing gun includes a swing arm having a first end pivoted to a frame, and a second end movable between a first position proximate to a flywheel to drive a hammer rod to hit a nail, and a second position distal from the flywheel. A spring plate has a spring end portion resiliently supporting the second end of the swing arm. The stop member limits the spring end portion and the second end of the swing arm from moving relative to the frame. When a safety member is subjected to an external pressure, the stop member permits the second end of the swing arm to move together with the spring end portion to the first position. The spring end portion can stably retain the second end of the swing arm at the second position in case of no external pressure. | 03-22-2012 |
20140367441 | COMBUSTION-TYPE POWER TOOL - In a combustion-type power tool, when a safety unit is pressed against a workpiece to cause a valve sleeve to close a combustion chamber, a power region of a lever is actuated to permit a weight region of the lever to displace a holding member holding a fuel canister from a normal position to a pressed position. When the holding member is in the pressed position, a valve stem of the fuel canister is forced into pressing engagement with an intake port of a fuel canister actuation unit to permit delivery of a measured dose of fuel to the combustion chamber through the intake port. | 12-18-2014 |