Patent application number | Description | Published |
20120229225 | PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS - A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included. | 09-13-2012 |
20130257555 | PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS - A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included. | 10-03-2013 |
20130300447 | MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, INSPECTION METHOD FOR ELECTRONIC COMPONENT, SHEET SUBSTRATE, ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS - A manufacturing method for an electronic component includes arranging, across boundaries of a first substrate region, wires for electrically connecting a piezoelectric resonator element arranged in the first substrate region and a lid arranged in a second substrate regions to a sheet substrate, performing, after arranging the piezoelectric resonator element and the lid in the substrate regions, input and output of a signal to and from the piezoelectric resonator element via the lid connected to the wires, and dividing the sheet substrate in each of the boundaries. | 11-14-2013 |
20130307560 | SHEET SUBSTRATE, ELECTRONIC PART, ELECTRONIC APPARATUS, METHOD FOR TESTING ELECTRONIC PARTS, AND METHOD FOR MANUFACTURING ELECTRONIC PARTS - A sheet substrate includes a plurality of substrate regions arranged in a matrix, an integrated circuit disposed in each of the substrate regions, and a first implementation electrode and a second implementation electrode disposed in each of the substrate regions and electrically connected to the integrated circuit. The sheet substrate according to an embodiment of the invention further includes first terminals to each of which the first implementation electrodes arranged in a row of part of the substrate regions are connected in parallel to each other and second terminals to each of which the second implementation electrodes arranged in a column of part of the substrate regions and can activate an arbitrary one of the integrated circuits that is specified by selected ones of the first terminals and the second terminals. | 11-21-2013 |
20130308286 | METHOD FOR MANUFACTURING ELECTRONIC PART, METHOD FOR TESTING ELECTRONIC PART, SHEET SUBSTRATE, ELECTRONIC PART, AND ELECTRONIC APPARATUS - A manufacturing method according to an embodiment of the invention includes a first step of providing a sheet substrate having a piezoelectric resonator element and an integrated circuit disposed on a mounting surface of each substrate region, having implementation electrodes that are electrically connected to the integrated circuit disposed the side facing away from the mounting surface, and disposing wiring lines on the sheet substrate, the wiring liens electrically connecting the piezoelectric resonator element disposed in a first substrate region to the implementation electrode in a second substrate region in the vicinity of the piezoelectric resonator element, a second step of inputting and outputting a signal to and from the piezoelectric resonator element in the first substrate region via the implementation electrodes connected to the wiring lines, and a third step of dividing the sheet substrate along the substrate regions to cut the wiring lines. | 11-21-2013 |
20140102217 | SENSOR, ELECTRONIC APPARATUS, ROBOT, AND MOBILE OBJECT - A sensor includes a flexible wafer substrate and an oscillator provided on a principal surface of the wafer substrate, and the oscillator deforms when an external force is applied to the wafer substrate. | 04-17-2014 |
20140125420 | PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS - A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included. | 05-08-2014 |
20140239773 | PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS - A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included. | 08-28-2014 |