Kwang Keun
Kwang Keun Kim, Suwon-Si KR
Patent application number | Description | Published |
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20090013988 | Convection heating unit and heating cooker having the same - A heating cooker including a cooker body having a cooking chamber and a convection heating unit. The convection heating unit includes a convection heater to generate heat, a convection fan to forcibly move the heat generated from the convection heater into the cooking chamber, a convection motor to drive the convection fan, and a convection housing to receive the convection heater and the convection fan. The convection heater and the convection fan are linearly arranged within the convection housing, to allow air introduced into the convection housing to move from the convection fan to the convection heater. This configuration is effective to restrict the transfer of heat from the convection heater to the convection motor. | 01-15-2009 |
Kwang Keun Kim, Yongin-Si KR
Patent application number | Description | Published |
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20130160410 | AIR FILTER MOUNTING/DEMOUNTING APPARATUS FOR OVER-THE-RANGE MICROWAVE OVEN - An air filter mounting/demounting apparatus for a microwave oven having easy mounting and demounting of the air filter is provided. The apparatus includes a base plate having an inlet port through which air is admitted to serve as a hood, an air filter installed at a position corresponding to the inlet port and configured to filter foreign substances being admitted through the inlet port, an air filter bracket coupled to the base plate, an air filter holder at which the air filter is assembled coupled to the air filter bracket to enable a sliding movement along the guide rail, a latch unit configured to be coupled to the base plate to maintain and release engagement of the air filter holder aged, and a spring installed at an inside the latch unit to deliver an elastic force to the air filter holder. | 06-27-2013 |
Kwang Keun Lee, Wonju KR
Patent application number | Description | Published |
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20110248408 | Package substrate and fabricating method thereof - There are provided a package substrate and a method fabricating thereof. The package substrate includes: a wafer having a cavity formed in an upper surface thereof, the cavity including a chip mounting region; a first wiring layer and a second wiring layer formed to be spaced apart from the first wiring layer, which are formed to be extended in the cavity; a chip positioned in the chip mounting region to be connected to the first wiring layer and the second wiring layer; a through-hole penetrating through the wafer and a via filled in the through-hole; and at least one electronic device connected to the via. Accordingly, a package substrate capable of having a passive device having a predetermined capacity embedded therein, while reducing a pattern size and increasing a component mounting density, and a method fabricating thereof may be provided. | 10-13-2011 |
20140051212 | METHOD OF FABRICATING A PACKAGE SUBSTRATE - A method of fabricating a package substrate, includes forming a cavity in at least one region of an upper surface of a wafer, the cavity including a chip mounting region, forming a through-hole penetrating through the wafer and a via filling the through-hole, forming a first wiring layer and a second wiring layer spaced apart from the first wiring layer, which are extended into the cavity, and mounting a chip in the cavity to be connected to the first wiring layer and the second wiring layer. | 02-20-2014 |