Patent application number | Description | Published |
20080268916 | COMMUNICATION DEVICE CHARGED WITH SOLAR ENERGY - A communication device charged by solar energy forms a foldable mobile phone by pivotably connecting a first pivot provided on one end of a host to a display. One end face of the display is provided with a second pivot. A solar plate is pivotably connected to the second pivot of the display to foldably cover on the display. With the above structure, if the electricity of the battery of the mobile phone is insufficient, the user can unfold the solar plate from the display to charge the electrically-connected battery of the mobile phone, thereby to overcome the inconvenience in supplementing the electricity of the battery. | 10-30-2008 |
20090049691 | METHOD FOR EMBEDDING HEAT PIPE INTO HEAT-CONDUCTING SEAT - A method for embedding a heat pipe into a slot of heat-conducting seat is disclosed. The method has the exposed portion of the heat pipe be flat and coplanar with the surface of the heat-conducting seat after the heat pipe is embedded into the slot of the seat. The method utilizes a power press machine with multiple stamping dies to progressively press the heat pipe. | 02-26-2009 |
20090154097 | HEAT-DISSIPATING DEVICE HAVING AIR-GUIDING COVER - A heat-dissipating device having an air-guiding cover includes a heat-dissipating body, an air-guiding cover, a plurality of heat pipes, a fixing base and a fan. The heat-dissipating body is constituted of a plurality of heat-dissipating pieces that are stacked up at intervals. On the heat-dissipating body, venting channels and a plurality of through holes are provided. The air-guiding cover includes a hollow cylinder and an air-guiding blade. The hollow cylinder covers the heat-dissipating body. The air-guiding blade is accommodated in the venting channel. Each of the plurality of heat pipes includes a section to be heated and a heat-releasing section extending from the section to be heated. The heat-releasing section penetrates into the through hole. The bottom of the fixing base is provided with a plurality of grooves for accommodating the sections to be heated of the heat pipes. The fan is provided above the air-guiding cover. Via the above arrangement, the air-guiding cover guides the airflow blown by the fan, thereby enhancing the heat-dissipating effect. | 06-18-2009 |
20090165479 | SOLAR POWERED VENTILATION SYSTEM FOR AUTOMOBILE - A solar powered ventilation system using a blower of an air conditioner in an automobile is disclosed. The blower is driven by a solar generator mounted on a roof of the automobile. A relay is arranged between the solar generator and the blower for switching on/off. The relay is controlled by a controller. A thermosensor is connected to the controller for detecting inside temperature of the automobile. The controller controls the relay to switch on and controls the air conditioner into an external circulation mode when the automobile is choked and the inside temperature exceeds a threshold temperature. | 07-02-2009 |
20090237882 | HEAT SINK AND HEAT DISSIPATION DEVICE HAVING THE SAME - A heat sink includes a heat dissipation fins assembly, a heat spreader, and a heat pipe. The heat dissipation fins assembly includes a plurality of heat dissipation fins. A guide plate extruding from a bottom of each of the heat dissipation fins. The guide plate being connected to an adjacent heat dissipation fins. The heat dissipation fins are connected in series by the guide plate thereby defining a number of air channels. Each heat dissipation fin includes a through hole defined therein and aligned with each other. The heat spreader is disposed under the heat dissipation fins assembly and a through groove is formed in the heat spreader. A heat pipe passes through the through hole and the through groove. The heat sink has improved heat dissipation efficiency. | 09-24-2009 |
20090266522 | METHOD OF FLATTING EVAPORATING SECTION OF HEAT PIPE EMBEDDED IN HEAT DISSIPATION DEVICE AND HEAT DISSIPATION DEVICE WITH HEAT PIPE - A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing. | 10-29-2009 |
20090294104 | VAPOR CHAMBER - A vapor chamber includes a plate and a wick structure. The plate is provided therein with a working fluid, and the plate has a heated end and a condensed end. The wick structure comprises a first wick portion adhered to be opposite to the heated end, a second wick portion overlapping on the first wick portion, and a third wick portion adhered on the rest portion of a chamber. The aperture diameter of the first wick portion is larger than that of the second wick portion, or the aperture density of the first wick portion is smaller than that of the second wick portion. Therefore, the amount of working fluid attached to the second wick portion is smaller than of the first wick portion. As a result, after heated, the working fluid attached to the second wick portion will be vaporized more quickly, thereby increasing the efficiency of heat transfer and improving the heat-dissipating effect. | 12-03-2009 |
20090310307 | INTEGRATED HEAT-DISSIPATING DEVICE FOR PORTABLE ELECTRONIC PRODUCT - An integrated heat-dissipating device for a portable electronic product includes a heat-conducting base, a heat-dissipating plate, a first heat-dissipating module and a second heat-dissipating module. The heat-dissipating plate is adhered onto the heat-conducting base. The coefficient of heat conductivity of the heat-dissipating plate is larger than that of the heat-conducting base. The first heat-dissipating module includes a first heat pipe. One section of the first heat pipe is connected to the heat-conducting base, and the other section thereof extends in a direction away from the heat-conducting base. The second heat-dissipating module includes a second heat pipe, an adapting block and a third heat pipe. One section of the second heat pipe is connected to the heat-conducting base, and the other section thereof is connected to the adapting block. One section of the third heat pipe is connected to the adapting block, and the other section thereof extends in a direction away from the adapting block. With a multiple-directional heat-dissipating path, a great amount of heat generated by a heat-generating source can be dissipated to the outside quickly. | 12-17-2009 |
20100002424 | LED LAMP TUBE WITH HEAT DISTRIBUTED UNIFORMLY - A LED lamp tube which includes a hollow transparent tube, a LED lamp assembly disposed in the transparent tube, two conductive caps provided on both ends of the transparent tube respectively, and a circuit control unit. The circuit control unit includes a plurality of separated sub-portions. The respective sub-portions of the circuit control unit are distributed uniformly on the circuit board of the LED lamp assembly. Via the uniform arrangement of respective sub-portions of the circuit control unit, the heat within the LED lamp tube can be distributed uniformly, thereby lowering the temperature and facilitating the heat dissipation. | 01-07-2010 |
20100002439 | LED LAMP TUBE HEAT DISSIPATING STRUCTURE - A light emitting diode (LED) lamp tube heat dissipating structure is capable of dissipating heat in a tube quickly to improve the heat dissipating efficiency. A circuit board with a light radiating surface and a heat dissipating surface is contained in the tube, and the light radiating surface of the circuit board is electrically connected to LED lamps. Two conductive bushings are sheathed onto both ends of the tube and electrically connected with the circuit board, and at least one heat dissipating hole is disposed separately on both distal surfaces of the tube that covers the heat dissipating surface of the circuit board, such that external air is entered into the tube from the heat dissipating hole on a distal surface of the tube and dispersed from the heat dissipating hole on another distal surface of the tube for dissipating the heat in the tube. | 01-07-2010 |
20100051236 | PROCESS AND ASSEMBLY FOR FLUSH CONNECTING EVAPORATOR SECTIONS OF JUXTAPOSED HEAT PIPES TO A FIXING BASE - A process for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base and forming a plane includes the steps of: providing a fixing base with its bottom surface having an accommodating trough; providing at least two heat pipes each having an evaporator section and a condenser section; disposing the evaporator sections of the heat pipes in the accommodating trough; and machining the evaporator sections of the juxtaposed heat pipes, thereby forming a plane on the evaporator sections of the heat pipe. Via the above process, the evaporator sections of the heat pipes can be juxtaposed in and flush connected to the fixing base, thereby increasing the contact area between the evaporator sections of the heat pipes and a heat-generating element. It further provides an assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base and forming a plane. | 03-04-2010 |
20100066230 | HEAT DISSIPATING STRUCTURE OF LED CIRCUIT BOARD AND LED LAMP TUBE COMPRISED THEREOF - A heat dissipating structure of an LED circuit board and a device applied in an LED tube which comprises an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered a coating layer including Nanoparticles and a bonding agent. Accommodating the LED circuit board covering the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board by the coating layer having the characters of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, for the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to accelerate dissipating the heat. | 03-18-2010 |
20100083500 | LEVELING METHOD FOR BURYING EVAPORATING SECTION OF HEAT PIPE INTO THERMALLY CONDUCTIVE SEAT - A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die. | 04-08-2010 |
20100108120 | MULTI-STAGE FOLDING PORTABLE SOLAR CHARGING APPARATUS - A multi-stage folding portable solar charging apparatus includes first, second and third photoelectric conversion modules. The second photoelectric conversion module is pivotally connected to a side of the first photoelectric conversion module and folded/unfolded with respect to an upper surface of the first photoelectric conversion module, and the third photoelectric conversion module is pivotally connected to another side of the first photoelectric conversion module and can be folded/unfolded with respect to a lower surface of the first photoelectric conversion module, such that the photoelectric conversion modules are electrically connected with each other. A connector is fixed and electrically connected to one of the photoelectric conversion modules. The second and third photoelectric conversion modules are unfolded from the stacked first photoelectric conversion module to increase an electric power generation area of charging apparatus when unfolded to enhance the electric power generation, and reduce the volume of the charging apparatus when folded. | 05-06-2010 |
20100109599 | PORTABLE SOLAR CHARGING APPARATUS - A portable solar charging apparatus includes a retaining base, a snoot, a photoelectric conversion module, a power connector and a joint mechanism. The snoot is mounted onto the retaining base, and a containing space is formed between the retaining base and the snoot. The photoelectric conversion module is contained in the containing space and mounted onto the retaining base. The photoelectric conversion module includes an accumulator and a solar chip electrically connected to the accumulator. The solar chip is installed corresponding to the snoot. The power connector is connected to the retaining base and electrically coupled to the accumulator. The joint mechanism is connected to the retaining base and disposed outside the containing space. The invention allows a portable electronic product to be charged and used anytime and improves the overall photoelectric conversion efficiency. | 05-06-2010 |
20100122799 | METHOD FOR COMBINING HEAT PIPES WITH A FIXING BASE AND STRUCTURE OF THE SAME - In a method for juxtaposing and combining a plurality of heat pipes with a fixing base, first, a fixing base having an accommodating trough is provided. The accommodating trough is provided therein with at least one recess. Further, a plurality of heat pipes is provided. Adhesive medium is coated on the contacting surface between the heat pipe and the accommodating trough. The plurality of heat pipes is pressed into the accommodating trough. Finally, the heat pipes juxtaposed in the accommodating trough are pressed coplanarly the surface of the fixing base while a portion of the adhesive medium is received in the recess. | 05-20-2010 |
20100127657 | PORTABLE SOLAR CELL CHARGING DEVICE - A solar cell charging device includes a base shown as a shell shape, a light-converging lens arranged at a top face of the base, a solar collector correspondingly located under the light-converging lens and a photoelectric converting unit. A plurality of charging troughs arranged on the base are recessed inwardly from circumferential faces thereof. The photoelectric converting unit is connected between each charging trough and the solar collector, converting the light energy absorbed by the solar collector into electric energy provided to be input into each charging trough, after the light-converging lens focuses the solar energy onto the solar collector. | 05-27-2010 |
20100165630 | HEAT DISSIPATING STRUCTURE OF LED LAMP CUP MADE OF POROUS MATERIAL - A heat dissipating structure of a lightweight lamp cup | 07-01-2010 |
20100181047 | FINS-TYPE HEAT SINK AND METHOD FOR ASSEMBLING THE SAME - In a heat sink and a method for assembling the same, the heat sink includes a base, a heat pipe, fins, a presser and caps. The presser is provided with through-holes. The periphery of the through-hole is provided with an annular neck, so that the distal end of the heat pipe can penetrate the through-hole. The periphery of each annular neck is provided with notches on the presser. Each cap covers on the annular neck, and it extends downwards to form protruding flaps. The flap penetrates the notch and is folded outwards to abut the bottom surface of the presser. According to the assembling method, via the presser and the caps, the fins can be assembled with the heat pipe tightly. | 07-22-2010 |
20100226138 | LED ROAD LAMP HOLDER STRUCTURE - A road lamp holder structure includes a lamp guard ( | 09-09-2010 |
20100265708 | HEAT-DISSIPATING ASSEMBLY OF LED LAMP HOLDER - A LED lamp holder includes a lamp cover and a heat-dissipating device provided in the lamp cover. An accommodating inlet is provided on the lamp cover. A LED unit is provided below the lamp cover. A cover plate covers the accommodating inlet. The heat-dissipating device includes a heat-absorbing plate, a heat-dissipating plate and a heat pipe connected between the heat-absorbing plate and the heat-dissipating plate. The heat-absorbing plate is brought into contact with the LED unit, while the heat-dissipating plate is brought into contact with the cover plate. The cover plate is penetrated by a plurality of screw elements. Each of the screw elements is screwed to the heat-absorbing plate. The length of each screw element exactly makes the heat-absorbing plate to abut and contact the LED unit. | 10-21-2010 |
20100282444 | HEAT-DISSIPATING FIN ASSEMBLY WITH HEAT-CONDUCTING STRUCTURE - The present invention relates to a heat-dissipating fin capable of increasing surface turbulence, which includes a first heat-dissipating fin and a second heat-dissipating fin. A first surface of the first heat-dissipating fin is provided with a plurality of first protrusions arranged at intervals. The second heat-dissipating fin has a second surface toward the first surface. The second surface is also provided with a plurality of second protrusions arranged at intervals. The second protrusions are arranged to correspond to the first protrusions. The second heat-dissipating fin is overlapped with the first heat-dissipating fin. With the arrangement of the first protrusions and the second protrusions, the heat-dissipating area of the first heat-dissipating fin and the second heat-dissipating fin can be increased so as to increase the surface turbulence. Thus, the heat-exchange efficiency can be enhanced. | 11-11-2010 |
20100288454 | ADJUSTABLE PROP STAND OF WINDOW CURTAIN - An adjusting structure of adjustable window curtain prop stand includes two prop plates and an adjusting structure arranged between the two prop plates. The adjusting structure further includes a lead screw, two displacing elements, two positioning elements and a plurality of connecting elements. The lead screw has two external threads respectively with different directions of spiral and available for being engaged with the two displacing elements thereon. The two positioning elements are respectively secured to inner side faces of the two prop plates to be located at an upper and a lower positions between the two displacing elements, where each connecting element is separately and actively connected between the two displacing elements and the two displacing elements, such that a linkage mechanism is formed by taking the two displacing elements as a gliding pair. | 11-18-2010 |
20100294462 | HEAT SINK AND HEAT-DISSIPATING FINS OF THE SAME - A heat sink and heat-dissipating fins have wave-shaped folds. The heat sink includes a plurality of heat-dissipating fins that are radially connected together to form a ring. The inside of the heat-dissipating fins is formed with an accommodating space for allowing a heat-generating element to be disposed therein. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape. Via the wave-shaped folds, the user can grip the heat-dissipating fins easily. Further, the rigidness and strength of the fold can be increased. | 11-25-2010 |
20100314078 | COOLER WITH GROUND HEATED PLANE AND GRINDING METHOD AND APPARATUS THEREOF - A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element. | 12-16-2010 |
20110024087 | HEAT-DISSIPATING FINS, LARGE-AREA HEAT SINK HAVING SUCH HEAT-DISSIPATING FINS AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved. | 02-03-2011 |
20110024088 | HEAT-DISSIPATING FIN CAPABLE OF INCREASING HEAT-DISSIPATING AREA, HEAT SINK HAVING SUCH HEAT-DISSIPATING FINS, AND METHOD FOR MANUFACTURING THE SAME - A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate. The lower plate is provided with a through-hole. The upper plate extends from the lower plate and is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The present invention further provides a heat sink having such heat-dissipating fins, which includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink. | 02-03-2011 |
20110024089 | HEAT SINK HAVING HEAT-DISSIPATING FINS OF LARGE AREA AND METHOD FOR MANUFACTURING THE SAME - A heat-dissipating fin of a large area is made of a metallic sheet and has a fin body. An outer edge of one side of the fin body extends to form a sheet-like expanding portion. The expanding portion is bent and overlapped on the fin body to obtain the heat-dissipating fin. A heat sink includes a plurality of heat-dissipating fins and a heat-conducting element, which is formed by means of penetrating the respective heat-dissipating fins with a condensing section of the heat-conducting element. | 02-03-2011 |
20110038147 | ASSEMBLY STRUCTURE FOR LED LAMP - An assembly structure for a LED lamp includes a cover plate, a LED module, fasteners and a mask. An inner surface of the cover plate is provided with a fixing portion. Both sides of the cover plate are formed with a slot respectively. The LED module has a substrate and a plurality of LED mounted on the substrate. The substrate is provided with an insertion hole. One end of the fastener is detachably connected into the insertion hole of the substrate and the other end thereof is fixed to the fixing portion. The mask is made of transparent materials and has an accommodating space for allowing the LED module to be disposed therein. Both sides of the mask defining the accommodating space are formed with a locking flange for inserting into the slot of the cover plate. With the above arrangement, the operator can assemble or detach the LED lamp quickly. | 02-17-2011 |
20110048677 | HEAT-CONDUCTING ASSEMBLY FOR HEAT PIPES OF DIFFERENT DIAMETERS AND HEAT SINK HAVING THE SAME - In a heat-conducting assembly for heat pipes of different diameters and a heat sink having such assembly, the heat-conducting assembly includes a heat-conducting base, a set of first heat pipes and a set of second heat pipes. A heat-conducting surface of the heat-conducting base is provided with a plurality of accommodating troughs. The diameter of the set of second heat pipes is smaller than that of the set of first heat pipes. The first heat pipe and the second heat pipe of different diameters are disposed in the accommodating troughs respectively. The heat pipes penetrate a plurality of fins to form the heat sink. With this arrangement, the ratio of heat pipes arranged on the heat-conducting surface can be increased and the heat-conducting efficiency thereof can be improved. | 03-03-2011 |
20110056657 | FIXING ASSEMBLY FOR HEAT-ABSORBING SURFACES OF JUXTAPOSED HEAT PIPES AND HEAT SINK HAVING THE SAME - A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink. | 03-10-2011 |
20110056658 | HEAT PIPE ASSEMBLY AND HEAT DISSIPATION DEVICE HAVING THE SAME - A heat pipe assembly includes a number of heat pipes and a fixing seat. Each of the heat pipes includes an evaporating section and at least a condensing section. A bottom of the evaporating section of each of the heat pipes is flat and has a flat heat absorbing surface. The evaporating sections of each of the heat pipes are parallel to and adjoin with each other, whereby the flat heat absorbing surfaces of the evaporating sections of the heat pipes being coplanar and adjoining with each other. A top surface of the evaporating section of each of the heat pipes has a top edge. The fixing seat has an integral structure and combines with the top edge of the evaporating section of each of the heat pipes, whereby the heat absorbing surfaces of the evaporating sections of the heat pipes are coplanar and adjoin with each other. | 03-10-2011 |
20110067846 | Heat Conducting Structure With Coplanar Heated Portion Manufacturing Method Thereof And Heat Sink Therewith - A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold ( | 03-24-2011 |
20110114293 | MANUFACTURING METHOD, FINISHED PRODUCT AND FIXTURE OF COPLANAR EVAPORATORS OF MULTIPLE HEAT PIPES - In a manufacturing method, finished product and fixture of coplanar evaporators of multiple heat pipes, the method is first to provide a plurality of heat pipes, each of which has an evaporator formed a heated face thereon; then, the evaporators are moved closely to one another in a manner, such that their heated faces are disposed onto a flat face; next, the evaporators are limited from multiple directions; afterward, pressing the evaporators toward the flat face makes their heated faces flush therewith; finally, injecting a bonding media into the gaps among the heat faces of the evaporators bonds the heat faces together to form a fixedly coplanar configuration. | 05-19-2011 |
20110197596 | Heat-Dissipating Device For Supplying Cold Airflow - A heat-dissipating device ( | 08-18-2011 |
20110197598 | Heat-Dissipating Device For Supplying Cold Airflow - A heat-dissipating device ( | 08-18-2011 |
20110203295 | COOLING RACK STRUCTURE OF THERMOELECTRIC COOLING TYPE - A cooling rack structure includes a cooling plate ( | 08-25-2011 |
20110279968 | HEAT SINK HAVING AUTO SWITCHING FUNCTION, HEAT SINK SYSTEM AND HEAT SINKING METHOD FOR THE SAME - A heat sink having auto switching function, a heat sink system and a heat sinking method are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device. | 11-17-2011 |
20110281520 | WIRELESS HEAT SINK, WIRELESS HEAT SINK SYSTEM AND WIRELESS HEAT SINKING METHOD FOR THE SAME - A wireless heat sink, a wireless heat sink system and a wireless heat sinking method are disclosed. The wireless heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device. | 11-17-2011 |
20110309734 | LED LAMP AND A HEAT SINK THEREOF HAVING A WOUND HEAT PIPE - The present invention relates to a LED lamp and a heat sink thereof having a wound heat pipe. The LED lamp includes the heat sink, a LED module and a lamp base electrically connected to the LED module. The heat sink includes a heat-conducting base, a heat-dissipating fin set and a wound heat pipe. The heat-dissipating fin set includes a plurality of heat-dissipating fins arranged at the outer periphery of the heat-conducting base. The heat-dissipating fins form an accommodating space. The wound heat pipe includes an evaporating section brought into thermal contact with the heat-conducting base and a condensing section brought into thermal contact with the heat-dissipating fins. The LED module abuts against the heat-conducting base and the evaporating section. By this structure, the heat-conducting path is shortened, the heat-conducting speed is accelerated, and the heat is rapidly and uniformly distributed to the heat-dissipating fins to improve the heat-dissipating efficiency. | 12-22-2011 |