Patent application number | Description | Published |
20130206462 | ANISOTROPIC CONDUCTIVE FILM DISPERSED WITH CONDUCTIVE PARTICLES, AND APPARATUS AND METHOD FOR PRODUCING SAME - An anisotropic conductive film includes a substrate layer, an insulated layer and a number of conductive particles dispersed in the insulated layer. The insulated layer includes a lower layer attached on a side surface of the substrate layer and a nano-structured layer having a number of nano-scaled micro-structures on the lower layer. The conductive particles are dispersed in the nano-structured layer and insulated and spaced from each other by the micro-structures. | 08-15-2013 |
20130314028 | WIRELESS CHARGING SYSTEM - A wireless charging system includes a power supply device transmitting electrical energy, a terminal device for charging, a laser charging transmitting module, and a laser charging receiving module. The laser charging transmitting module is electrically connected with the power supply device for receiving electrical energy transmitted by the power supply device and transforming electrical energy into light energy. The laser charging receiving module is electrically connected with the terminal device for charging, for receiving light energy transformed by the laser charging transmitting module, transforming light energy into electrical energy, and transmitting electrical energy to the terminal device for charging to charge up the terminal device for charging. | 11-28-2013 |
20130315608 | BIDIRECTIONAL AND DOUBLE-FREQUENCY OPTICAL TRANSMISSION MODULE AND TRANSMISSION ASSEMBLY - An optical transmission assembly includes a base plate, an optical signal emitting member, an efferent optical fiber, an optical coupler, an afferent optical fiber, and an optical signal receiving member. The optical signal emitting member is mounted on or besides the base plate. The optical signal isolator is mounted on the base plate, and alignes with the optical signal emitting member. The efferent optical fiber is mounted on the base plate. The optical coupler is located besides the base plate, coupling with the optical signal isolator via the efferent optical fiber. The afferent optical fiber is mounted on the base plate. The optical signal receiving member is mounted on or besides the base plate, coupling with the optical coupler via the afferent optical fiber. The present disclosure further includes a bidirectional and double-frequency optical transmission module having the optical transmission assembly. | 11-28-2013 |
20130322829 | OPTICAL-ELECTRICAL TRANSMISSION ASSEMBLY AND OPTICAL TRANSMISSION MODULE USING THE SAME - An optical transmission module includes two optical-electrical transmission assemblies and at least two optical waveguides including two fixing ends. Each optical-electrical transmission assembly includes a CMOS board, an integrated IC driver chip mounted on the CMOS board, an light emitting element array, and at least one photodetector element. The integrated IC driver chip includes an output end and an input end. The light emitting element array is positioned on the CMOS board, and is electrically connected with the output end. The at least one photodetector element is positioned on the CMOS board, and is electrically connected with the input end. One fixing end of each optical waveguide is positioned on one CMOS board and is optically coupled with the light emitting element array. The other fixing end of each optical waveguide is positioned on another CMOS board and is optically coupled with the photodetector element. | 12-05-2013 |
20140064741 | OPTICAL COMMUNICATION DEVICE - An optical communication device includes a substrate, a photoelectric element for emitting/receiving optical signals, a driver chip for driving the photoelectric, and a light waveguide for transmitting optical signals. The substrate defines a through fixing hole. The photoelectric element and the driver chip are electrically connected to the substrate. The photoelectric element includes a base portion and an optical portion formed on the base portion. The optical portion includes an optical surface serving as a light emergent/incident surface, the optical surface faces toward the substrate, and the optical portion is aligned with the fixing hole. An end of the light waveguide is inserted and fixed into the fixing hole and is optically aligned with the optical portion. | 03-06-2014 |
20140160092 | DIGITAL PEN AND DIGITAL WRITING APPARATUS - A digital pen includes a housing, a refill, a camera module, a controller, a memory, and an information transmission module. The housing includes an end. The refill is received in the housing and includes a tip capable of extending out of the end for writing on a writing medium. The camera module includes a lens, an image sensor and a processor. The image sensor captures images of the tips on the writing medium through the lens. The processor analyzes the images to obtain positions of the tips on the writing medium and to obtain a track of the tip. The controller is connected to the refill and the camera module, and controls the camera module to capture the images when the refill is pressed. The memory stores the track of the tip. The information transmission module transmits the track of the tip to a user terminal. | 06-12-2014 |
20140177998 | OPTICAL COMMUNICATION DEVICE WITH PHOTOELECTRIC ELEMENT AND DRIVER CHIP - An optical communication device includes a substrate, a photoelectric element, a driver chip, a light waveguide unit, and a lens element. The substrate defines a receiving groove and a number of positioning holes around the receiving groove. The photoelectric element and the driver are electrically positioned on the substrate. The photoelectric element is configured for emitting/receiving optical signals, and the driver chip is configured for driving the photoelectric element to emit/receive optical signals. The light waveguide unit is configured for transmitting optical signals. The lens element includes a number of positioning portions corresponding to the positioning holes. The lens element is received in the receiving groove, and the positioning portions are received in the positioning holes. | 06-26-2014 |
20140254980 | OPTICAL COMMUNICATION DEVICE - An optical communication device includes a circuit board, a light-emitting element, a light-receiving element, and a planar light guide circuit. The circuit board includes an upper mounting surface. The upper mounting surface defines a groove. The groove includes a first inclined surface and a second inclined surface. The first and the second inclined surfaces are slanted relative to a bottom surface of the groove and connected between the upper mounting surface and the bottom surface. A reflection layer is coated on the first and second inclined surfaces. The light-emitting element includes a light emergent surface, and the light-receiving element includes a light incident surface. The light-emitting element and the light-receiving element are mounted on the upper mounting surface. The planar light guide circuit is received in the groove. Two ends of the planar light guide circuit face reflection layers of the first inclined surface and the second inclined surface, respectively. | 09-11-2014 |
20140255043 | OPTICAL COMMUNICATION DEVICE WITH PLANAR OPTICAL WAVEGUIDE - An optical communication device includes a planar optical waveguide, a first substrate, a light emitting element, and a light receiving element. The planar optical waveguide includes a top surface and a light guide portion. The light guide portion includes a first sloped surface and a second sloped surface. The first substrate includes a mounting surface. The first substrate is supported on the top surface. An end of the first substrate defines a first receiving hole. The other end of the first substrate defines a second receiving hole. The light emitting element is received in the first receiving hole and faces the first sloped surface at about a 45 degree angle. The light receiving element is received in the second receiving hole and faces the second sloped surface at about a 45 degree angle. | 09-11-2014 |
20140308000 | OPTICAL CONNECTOR - An optical connector includes a circuit board. The circuit board includes a substrate and a circuit unit. A photoelectric element and a driver chip are located on the substrate. The photoelectric element includes a conductive pin and a metallic layer. The conductive pin is formed on a surface of the photoelectric element away from the circuit board, and the metallic layer is formed on another surface of the photoelectric element facing the circuit board. The conductive pin and the metallic layer serve as terminals of the photoelectric element. The driver chip is electrically connected to the photoelectric element by the circuit unit. | 10-16-2014 |
20140308012 | OPTICAL COMMUNICATION DEVICE - An optical communication device includes a substrate, a first optical-electric element, a second optical-electric element, a planar optical waveguide and a fixing device. Both the first and the second optical-electric elements are positioned on the substrate. The first optical-electric element includes a light emitting surface. The second optical-electric element includes a light receiving surface. The planar optical waveguide includes a first reflecting surface and a second reflecting surface. The fixing device includes a fixing pole and a fixing ring. The fixing pole defines a through hole. The planar optical waveguide runs through the through hole and is coiled by the fixing ring. The fixing ring is fixed on the fixing pole. The planar optical waveguide is positioned above the first and the second optical-electric elements, with the first reflecting surface aligning with the light emitting surface, and the second reflecting surface aligning with the light receiving surface. | 10-16-2014 |
20140312211 | OPTICAL COMMUNICATION APPARATUS - An optical communication apparatus includes a PCB, a photoelectric unit for emitting or receiving light carrying optical signals, a calculation and control unit, and a light waveguide for transmitting optical signals. The calculation and control unit controls the photoelectric unit, processes electrical signals, calculates based on the electrical signals, and controls the photoelectric unit to emit or receive light. The light waveguide is positioned on a surface of the PCB. The calculation and control unit includes a lapping plate lapping on the surface of the PCB. The lapping plate defines an opening exposing a portion of the light waveguide. The photoelectrical unit is positioned on the lapping plate covering the opening and is optically aligned with the light waveguide through the opening. | 10-23-2014 |
20140314369 | OPTICAL CONNECTOR HAVING REDUCED SIZE - An optical waveguide includes a printed circuit board, a waveguide, a light emitter, a light receiver, a transparent driver, and a transparent processor. The driver and the processor are received in and mounted to the printed circuit board through a flip-flop method. The light emitter and the light receiver are mounted to the driver and the processor, respectively, through the flip-flop method. The planar waveguide is attached to a side of the printed circuit board opposite to the light emitter and the light receiver. The driver drives the light emitter to emit light according to input signals. This light is directed onto the light receiver through the driver, the planar waveguide, and the processor. The light receiver converts the light into electrical signals. The processor processes the electrical signals to obtain the input signals. | 10-23-2014 |
20140314373 | OPTICAL COMMUNICATION APPARATUS - An optical communication apparatus includes a PCB, a photoelectric element, a driver chip, and a light waveguide. The PCB defines a groove in a surface thereof. The groove includes a bottom surface and a side surface connected to the bottom surface. The PCB includes a reflecting layer coated on the side surface. The photoelectric element includes an optical portion for emitting/receiving light carrying optical signals. An optical signal emitting/receiving direction of the photoelectric element is substantially perpendicular to the surface of the PCB. The side surface passes through a projection area of the optical portion along a direction substantially perpendicular to the surface of the PCB. An end of the light waveguide is positioned on the bottom surface of the groove and is out of the projection area of the optical portion. The reflecting layer couples optical signals between the photoelectric element and the light waveguide. | 10-23-2014 |
20140314404 | OPTICAL COMMUNICATION APPARATUS - An optical communication apparatus includes an emitting device and a receiving device. The emitting device includes optical signal emitters, a first driver chip, a first lens member, a first control chip, and a first wireless transmitting and receiving unit. The receiving device includes optical signal receivers, a second driver chip, a second lens member, a second control chip, and a second wireless transmitting and receiving unit. The optical signal emitter emits light carrying optical signals. The first wireless transmitting and receiving unit wirelessly transmits intensity information of the light to the receiving device. The second wireless transmitting and receiving unit receives the intensity information. The second driver chip drives the optical signal receivers to receive the light. The second control chip calculates an intensity of the received light, compares the calculated intensity to the intensity information, and determines whether a transmitting efficiency of the optical communication apparatus is satisfied. | 10-23-2014 |
20140339662 | OPTICAL COMMUNICATION DEVICE - An optical communication device includes a planar optical waveguide, a substrate and an optical-electric element. The planar optical waveguide includes a first side surface and a light guide portion formed in the planar optical waveguide. The substrate includes a first sidewall and a second sidewall facing away from the first sidewall. The first sidewall is substantially parallel with the second sidewall. The substrate defines a light guide hole running through both the first sidewall and the second sidewall. The first sidewall is connected to the first side surface, with the light guide hole aligning with the light guide portion. The optical-electric element includes an optical surface. The optical-electric element is assembled to the second sidewall, with the optical surface aligning with the light guide hole and the light guide portion. | 11-20-2014 |
20140341502 | OPTICAL COMMUNICATION DEVICE - An optical communication device includes a planar optical waveguide, a circuit board, a light emitting element, and a light receiving element. The circuit board includes a mounting surface. Both the light emitting element and the light receiving element are supported on the mounting surface. The planar optical waveguide is buried in the circuit board. The planar optical waveguide includes a first sloped surface and a second sloped surface respectively on two opposite ends of the planar optical waveguide. The mounting surface defines a first light guide hole aligning with the first sloped surface and a second light guide hole aligning with the second sloped surface. The light emitting element is aligned with the first sloped surface through the first light guide hole. The light receiving element is aligned with the second sloped surface through the second light guide hole. | 11-20-2014 |
20140341590 | OPTICAL COMMUNICATION DEVICE - An optical communication device includes a printed circuit board (PCB), a light emitting element, a light receiving element, and a light waveguide. The PCB includes a substrate. The substrate includes a first end surface and a second end surface opposite to the first end surface. The light emitting element is electrically connected to the first end surface. The light receiving element is electrically connected to the second end surface. The light waveguide includes a light incident end and a light emergent end. The light waveguide is embedded in the substrate. The light incident end is exposed to the first end surface and optically aligned with the light emitting element along a transmitting direction of the light waveguide. The light emergent end is exposed to the second end surface and optically aligned with the light receiving element along the transmitting direction of the light waveguide. | 11-20-2014 |
20150014555 | OPTICAL COMMUNICATION DEVICE - An optical communication device includes a light emitting element including a light emitting surface, a first substrate coating the light emitting element, a light receiving element including a light receiving surface, a second substrate coating the light receiving element, a planar optical waveguide, a first reflecting element including a first sloped surface, and a second reflecting element including a second sloped surface. The first substrate includes a first supporting surface. The first supporting surface defines a first light guiding hole spatially corresponding to the light emitting surface. The second substrate includes a second supporting surface. The second supporting surface defines a second light guiding hole spatially corresponding to the light receiving surface. The planar optical waveguide is positioned on the first supporting surface and the second supporting surface. The first reflecting element and the second reflecting element are respectively positioned on two opposite ends of the planar optical waveguide. | 01-15-2015 |
20150016776 | OPTICAL COMMUNICATION DEVICE - An optical communication device includes a connector, a first substrate, a first driving chip, a light emitting element, a second driving chip, a light receiving element, a coupling lens assembly, and an optical waveguide. The first substrate is supported on the connector and electrically connected to the connector. The first substrate includes a bottom surface and a supporting surface facing away from the bottom surface. Both the light emitting element and the light receiving element are received in the first substrate. The first driving chip is supported on the supporting surface, and electrically connected to the first substrate and the light emitting element. The second driving is supported on the supporting surface, and electrically connected to the first substrate and the light receiving element. The coupling lens assembly is detachably connected to the first and second driving chips. The optical waveguide is detachably connected to the coupling lens assembly. | 01-15-2015 |