Patent application number | Description | Published |
20090085431 | PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME - Devices are disclosed that include a piezoelectric vibrating piece; a glass base and lid form a package enclosing the piezoelectric vibrating piece. The piece has first and second electrodes. The base has first and second opposing surfaces. The base mounts the piezoelectric vibrating piece, and the lid seals the piezoelectric vibrating piece in the package. The base includes first and second metal wires, extending therethrough, whose ends are denuded to the first and second surfaces and connected to the first and second electrodes, respectively. In disclosed methods for making the packaged devices, such as piezoelectric oscillators, multiple packaged devices are made simultaneously by stacking and simultaneously bonding respective wafers on which glass bases, piezoelectric vibrating pieces, and lids have been formed. | 04-02-2009 |
20090096329 | PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME - Piezoelectric devices and associated fabrication methods are disclosed. An exemplary piezoelectric device includes a piezoelectric vibrating piece having first and second electrodes and first and second surfaces, a glass base having first and second surfaces, and a lid. These three parts also form the device package. The first surface of the piezoelectric vibrating piece is mounted to the base, and the lid is mounted to the second surface of the piezoelectric vibrating piece to seal the package. The glass base includes first and second metal wires having ends that protrude from the surfaces of the base. The side surfaces of the protruding wire ends are connected to the first and the second electrodes, respectively. Manufacture is performed using whole wafers that are processed, sandwiched, bonded, and then cut to produce individual devices. | 04-16-2009 |
20090174286 | METHODS FOR ADJUSTING FREQUENCY OF PIEZOELECTRIC VIBRATING PIECES, PIEZOELECTRIC DEVICES, AND TUNING-FORK TYPE PIEZOELECTRIC OSCILLATORS - A piezoelectric frame includes a tuning-fork type piezoelectric vibrating piece having excitation electrodes on each of at least two vibrating arms extending in a first direction from one end of a base portion thereof. Respective supporting arms extend in a first direction from respective external edges of the vibrating arms. An outer frame portion surrounds the tuning-fork type piezoelectric vibrating piece. The connecting portions have designated widths and connect the respective supporting arms to the outer frame portion. During manufacture, the designated widths are trimmed (e.g., by a pulsed laser) until the desired vibration frequency is obtained. | 07-09-2009 |
20100123369 | Piezoelectric devices and methods for manufacturing same - Piezoelectric devices and method for making them are disclosed. An exemplary piezoelectric device has a package base defining a cavity on a first surface thereof. An opposing second surface of the package base has at least one through-hole, a mounting electrode on which a piezoelectric vibrating piece is attached, and a respective sealing electrode sealing each through-hole. At least one external electrode is on the second surface, and a lid is bonded to the package base to enclose the piezoelectric vibrating piece. The mounting electrode, sealing electrodes, and external electrodes are formed integrally. | 05-20-2010 |
20100192342 | PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME - Piezoelectric devices and associated fabrication methods are disclosed. An exemplary piezoelectric device includes a piezoelectric vibrating piece having first and second electrodes and first and second surfaces, a glass base having first and second surfaces, and a lid. These three parts also form the device package. The first surface of the piezoelectric vibrating piece is mounted to the base, and the lid is mounted to the second surface of the piezoelectric vibrating piece to seal the package. The glass base includes first and second metal wires having ends that protrude from the surfaces of the base. The side surfaces of the protruding wire ends are connected to the first and the second electrodes, respectively. Manufacture is performed using whole wafers that are processed, sandwiched, bonded, and then cut to produce individual devices. | 08-05-2010 |
20110019296 | Optical filter - An object of the invention is to provide an optical filter that prevents an optical thin film formed on an optical plate from being partially removed, and prevents micro-cracks occurring in an outer peripheral edge section of a principle surface of the optical plate, and that has a high yield rate. An optical filter is provided with an optical plate which has a chamfered section formed on an outer peripheral edge section of one principle surface of the optical plate, and has isotropy with respect to wet-etching, and the chamfered section is of an arc shape which is cross-sectionally concave in an inward direction of the optical plate, and is formed by means of wet-etching. A crossing angle between the one principle surface and a concave surface where the chamfered section is formed, and a crossing angle between the concave surface and a side surface of the optical plate 3 where the chamfered section is formed, namely, crossing angles θG and θH are respectively 100° or greater and less than 180° . | 01-27-2011 |
20120023720 | PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING SAME - Devices are disclosed that include a piezoelectric vibrating piece; a glass base and lid form a package enclosing the piezoelectric vibrating piece. The piece has first and second electrodes. The base has first and second opposing surfaces. The base mounts the piezoelectric vibrating piece, and the lid seals the piezoelectric vibrating piece in the package. The base includes first and second metal wires, extending therethrough, whose ends are denuded to the first and second surfaces and connected to the first and second electrodes, respectively. In disclosed methods for making the packaged devices, such as piezoelectric oscillators, multiple packaged devices are made simultaneously by stacking and simultaneously bonding respective wafers on which glass bases, piezoelectric vibrating pieces, and lids have been formed. | 02-02-2012 |
20140291538 | STEP UP CIRCUIT AND RADIATION METER - A step-up circuit includes a transistor configured to perform switching operation in response to a pulse signal input into a base of the transistor, an inductor disposed between a collector of the transistor and a power source, and a basic step-up circuit connected to a connecting point of the collector of the transistor and the inductor. The basic step-up circuit includes: a first diode, a second diode whose anode is connected to a cathode of the first diode, a third diode whose anode is connected to a cathode of the second diode, a first capacitor disposed between the cathode of the first diode and ground, a second capacitor disposed between an anode of the first diode and the cathode of the second diode, and a third capacitor disposed between a cathode of the third diode and the ground. | 10-02-2014 |