Patent application number | Description | Published |
20120161806 | PROBE MANUFACTURING METHOD, PROBE STRUCTURE, PROBE APPARATUS, AND TEST APPARATUS - Minute probes are created to correspond to the alignment of the input/output terminals of a device under test. A probe manufacturing method of manufacturing a probe, includes: forming a contact section on a probe main body; and shaping at least one of the contact section and the probe main body by cutting by means of a cutting tool. The contact section is formed on a substrate that is to become the probe main body, and the probe manufacturing method further includes: after shaping at least one of the contact section and the substrate that is to become the probe main body, removing the portion of the substrate excluding the probe main body thereby forming a probe. | 06-28-2012 |
20130038345 | PROBE STRUCTURE, PROBE APPARATUS, PROBE STRUCTURE MANUFACTURING METHOD, AND TEST APPARATUS - Probes are arranged precisely and at a narrow pitch. Provided is a probe structure receiving and transmitting an electric signal from/to a device. The probe structure includes a contact point that transmits an electric signal, a probe on which the contact point is formed, a probe pad section that is electrically coupled to the contact point, and an insulating section that is provided on the probe and that insulates a bonding wire connected to the probe pad section from the probe. A probe apparatus, a manufacturing method of a probe structure, and a test apparatus are also provided. | 02-14-2013 |
Patent application number | Description | Published |
20150319842 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes an insulating layer, circuit layers including a first layer on first surface side of the insulating layer and a second layer on second surface side of the insulating layer, conductor heat transfer layers including a first transfer layer on the first side of the insulating layer and a second transfer layer on the second side of the insulating layer, through hole electrical conductors filling first through holes penetrating through the insulating layer such that the electrical conductors connect the first and second layers, and a through hole thermal conductor filling a second through hole penetrating through the insulating layer such that the thermal conductor connects the first and second transfer layers. The second hole is positioned between two or more of the first holes and has a shape extending in direction that intersects direction connecting the two or more of the first holes. | 11-05-2015 |
20160007451 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes a core substrate having cavity penetrating through the core substrate, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating layer and laminated on first side of the core substrate such that the first build-up layer is covering the cavity on the first side of the core substrate, and a second build-up layer including an insulating layer and laminated on second side of the core substrate such that the second build-up layer is covering the cavity on the second side of the core substrate, and a filling resin filling gap formed between the cavity and block positioned in the cavity of the core substrate. The block has roughened surfaces such that the roughened surfaces are in contact with the insulating layers in the first and second build-up layers on the first and second sides of the core substrate. | 01-07-2016 |
20160007468 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes a core substrate having cavity, metal blocks in the cavity, first and second build-up layers including insulating layers and laminated on first and second sides of the core substrate such that the insulating layers are covering the cavity, and a filling resin filling gap formed between the cavity and metal blocks in the cavity. The cavity is penetrating through the core substrate, the core substrate has an intracavity projection structure projecting from one or more side surfaces of the cavity such that the projection structure is positioned between the metal blocks and separating the metal blocks from contacting each other in the cavity, the first build-up layer has first conductors connected to the metal blocks such that each first conductor conducts electricity or heat, and the second build-up layer has second conductors connected to the metal blocks such that each second conductor conducts electricity or heat. | 01-07-2016 |