Patent application number | Description | Published |
20100140800 | SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE - A semiconductor device includes a multilayer wiring board and a semiconductor chip mounted on the multilayer wiring board. Electrode pads of the semiconductor chip include: first electrode pads including electrode pads respectively disposed in the vicinity of corners of the back surface of the semiconductor chip; and second electrode pads other than the first electrode pads. Connection pads of the multilayer wiring board include: first connection pads connected to the first electrode pads via bumps; and second connection pads connected to the second electrode pads via bumps. The first connection pads are supported by a first insulating region made of a thermoplastic resin, and the second connection pads are supported by a second insulating region made of a thermosetting resin. | 06-10-2010 |
20110147927 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a semiconductor chip having an element formation surface on which at least one element is formed and including a plurality of electrode pads formed on the element formation surface, an interconnect substrate having a principal surface facing the element formation surface of the semiconductor chip and including a plurality of connection pads formed at positions of the principal surface facing the respective corresponding electrode pads, and a plurality of solder bumps provided between the respective corresponding electrode pads and connection pads, and configured to electrically connect the respective corresponding electrode pads and connection pads together. An UBM layer is formed on a portion of each solder bump closer to the corresponding electrode pad and a barrier metal layer is formed on a portion of each solder bump closer to the corresponding connection pad, and the two layers have substantially the same composition of major materials. | 06-23-2011 |
20110316153 | SEMICONDUCTOR DEVICE AND PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor substrate | 12-29-2011 |
20130299957 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first extended semiconductor chip including a first semiconductor chip and an extension extending outwardly from a side surface of the first semiconductor chip. The semiconductor device also includes a second semiconductor chip mounted above the first extended semiconductor chip and electrically connected with the first semiconductor chip. The first extended semiconductor chip includes a first extension electrode pad provided above the extension and electrically connected with an electrode of the first semiconductor chip. | 11-14-2013 |
20140103504 | SEMICONDUCTOR DEVICE - A first chip including electrodes is mounted above an expanded semiconductor chip formed by providing an expanded portion at an outer edge of a second chip including chips. The electrodes of the first chip are electrically connected to the electrodes of the second chip by conductive members. A re-distribution structure is formed from a top of the first chip outside a region for disposing the conductive members along a top of the expanded portion. Connection terminals are provided above the expanded portion, and electrically connected to ones of the electrodes of the first chip via the re-distribution structure. | 04-17-2014 |
20140103544 | SEMICONDUCTOR DEVICE - A semiconductor device includes an extended semiconductor chip including a first semiconductor chip and an extension outwardly extending from a side surface of the first semiconductor chip; and a second semiconductor chip connected to the extended semiconductor chip through a plurality of bumps and electrically connected to the first semiconductor chip. The first semiconductor chip is smaller than the second semiconductor chip. At least one external terminal is provided on the extension. | 04-17-2014 |
20140117542 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes an expanded semiconductor chip having a first semiconductor chip and an expanded portion extending outward from a side surface of the first semiconductor chip, a second semiconductor chip provided so as to be connected to the expanded semiconductor chip via a plurality of first bumps, and a base provided so as to be connected to the expanded semiconductor chip via a plurality of second bumps. The first bumps are provided between the first semiconductor chip and the second semiconductor chip. The second bumps are provided between the expanded portion and the base. | 05-01-2014 |
20140124957 | EXPANDED SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE - A semiconductor device includes: a first semiconductor chip having a surface provided with first electrodes; and an expanded semiconductor chip including a second semiconductor chip and an expanded portion extending outward from at least one side surface of the second semiconductor chip. The expanded semiconductor chip has a surface provided with second electrodes. The surface of the first semiconductor chip provided with the first electrodes faces the surface of the expanded semiconductor chip provided with the second electrodes so that the first electrodes are connected to the second electrodes. Each one of the second electrodes that is connected to an associated one of the first electrodes is located only on the expanded portion. | 05-08-2014 |
20140217595 | MOUNTING STRUCTURE AND MANUFACTURING METHOD FOR SAME - In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal ( | 08-07-2014 |