Kenichi Watanabe, Yokohama-Shi JP
Kenichi Watanabe, Yokohama-Shi JP
Patent application number | Description | Published |
---|---|---|
20100052636 | CONSTANT-VOLTAGE CIRCUIT DEVICE - A constant-voltage circuit converts a voltage input to an input terminal and outputs a predetermined constant voltage from an output terminal. The constant-voltage circuit includes an output transistor to output an electrical current to the output terminal in response to a control signal, a reference voltage circuit to generate a predetermined reference voltage, a control circuit to adjust a voltage proportional to the output voltage output from the output terminal to the reference voltage output from the reference voltage circuit by controlling the output transistor and a soft start circuit including a capacitor for soft start that is charged at start-up and a current control unit to control an electrical current supplied to the reference voltage circuit. The current control unit adjusts the reference voltage to a voltage determined by the capacitor for soft start at the start-up until the reference voltage reaches a desired voltage. | 03-04-2010 |
20140077392 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - The semiconductor device has insulating films | 03-20-2014 |
20140145335 | SEMICONDUCTOR DEVICE INCLUDING TWO GROOVE-SHAPED PATTERNS - The semiconductor device has insulating films | 05-29-2014 |
20140145336 | SEMICONDUCTOR DEVICE INCLUDING TWO GROOVE-SHAPED PATTERNS - The semiconductor device has insulating films | 05-29-2014 |
20140179098 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The semiconductor device includes a capacitor including a plurality of interconnection layers stacked over each other, the plurality of interconnection layers each including a plurality of electrode patterns extended in a first direction, a plurality of via parts provided between the plurality of interconnection layers and electrically interconnecting the plurality of the electrode patterns between the interconnection layers adjacent to each other, and an insulating films formed between the plurality of interconnection layers and the plurality of via parts. Each of the plurality of via parts is laid out, offset from a center of the electrode pattern in a second direction intersecting the first direction, and the plurality of electrode patterns has a larger line width at parts where the via parts are connected to, and a distance between the electrode patterns and the adjacent electrode patterns is reduced at the parts. | 06-26-2014 |
20140291861 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 10-02-2014 |
20140291862 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 10-02-2014 |
20140291863 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 10-02-2014 |
20140291864 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 10-02-2014 |
20140299960 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 10-09-2014 |
20140299987 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 10-09-2014 |
20140299993 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 10-09-2014 |
20140299994 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 10-09-2014 |
20140299996 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 10-09-2014 |
20140306346 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 10-16-2014 |
20140327143 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 11-06-2014 |