Patent application number | Description | Published |
20080202803 | Wiring structure, forming method of the same and printed wiring board - There is disclosed a wiring structure or the like capable of sufficiently improving a connection property between a body to be wired and a wiring pattern (layer) connected to the body to be wired. In a semiconductor-embedded substrate | 08-28-2008 |
20090025961 | Electronic component-embedded board and method of manufacturing the same - A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet | 01-29-2009 |
20090025965 | Assembly substrate and method of manufacturing the same - The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board | 01-29-2009 |
20090025971 | Electronic component-embedded board and method of manufacturing the same - A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet | 01-29-2009 |
20090211799 | Printed wiring board and manufacturing method therefor - The present invention provides a printed wiring board which can prevent a plating failure in a connection hole such as a via to be formed in the printed wiring board, thereby can enhance the connection reliability and a manufacturing method therefor. The printed wiring board | 08-27-2009 |
20090218678 | SEMICONDUCTOR IC-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A semiconductor IC-embedded substrate suitable for embedding a semiconductor IC in which the electrode pitch is extremely narrow. The substrate comprises a semiconductor IC | 09-03-2009 |
20100013103 | Semiconductor embedded module and method for producing the same - A semiconductor embedded module | 01-21-2010 |
20100051189 | Method of manufacturing wiring board - Provided is a method of manufacturing a wiring board, in which; a composite adhesive sheet | 03-04-2010 |
20100065194 | Method for manufacturing printed wiring board - To provide a method for manufacturing a printed wiring board which can easily and surely form a fine wiring pattern having a small layer thickness while enhancing the productivity by simplifying a process, when forming a wiring structure having a filled via. The method for manufacturing a printed wiring board according to the present invention includes: bonding a metal foil | 03-18-2010 |
20100073082 | RECTIFIER - Provided is a highly efficient rectifier which can readily replace a two-terminal diode and whose conduction loss is reduced from that of the two-terminal diode. | 03-25-2010 |
20100083490 | MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayer circuit board comprises core layers | 04-08-2010 |
20100178737 | Semiconductor IC and Its Manufacturing Method, and Module with Embedded Semiconductor IC and Its Manufacturing Method - A semiconductor IC includes a semiconductor IC main body having a predetermined circuit formed on a main surface, a metal layer selectively provided on substantially the whole back surface of the semiconductor IC main body excluding the periphery. According to the present invention, the metal layer provided on the semiconductor IC main body can dissipate heat at a high level. Because the metal layer is selectively provided, even when the semiconductor IC main body is thinned by polishing, warpage does not occur easily in a wafer state. The metal layer is selectively provided at the center of the back surface of the semiconductor IC. Therefore, a laminate of a semiconductor wafer and a thick metal does not need to be diced. As a result, chipping on the disconnected surface can be prevented effectively. | 07-15-2010 |
20100243601 | Multilayer wiring board and manufacturing method thereof - Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil | 09-30-2010 |
20110182041 | LEAD-FREE SOLDER AND ELECTRONIC COMPONENT BUILT-IN MODULE - First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy. | 07-28-2011 |
20110198115 | ELECTRONIC COMPONENT BUILT-IN MODULE AND METHOD OF MANUFACTURING THE SAME - An electronic component built-in module includes an electronic component, a substrate on which the electronic component is mounted, a first resin covering the electronic component and the substrate, and a second resin covering the surface of the first resin. The first resin is formed of a resin including pores. The first resin is formed so that the thickness of the first resin on an area where the electronic component is not mounted is larger than that on an area where the electronic component is mounted on the surface of the substrate. A porosity of the second resin is smaller than that of the first resin. | 08-18-2011 |
20110229708 | ELECTRONIC CIRCUIT MODULE COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT MODULE COMPONENT - An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer. | 09-22-2011 |
20120138346 | WIRING BOARD, ELECTRONIC COMPONENT EMBEDDED SUBSTRATE, METHOD OF MANUFACTURING WIRING BOARD, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE - A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole. | 06-07-2012 |
20120285013 | Electronic Component-Embedded Board and Method of Manufacturing the Same - A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet includes insulating layers on one surface of an approximately rectangular substrate, and an electronic component and a plate-like frame member (member) embedded inside the insulating layer, wherein the plate-like frame member satisfying the relationship represented by the following formula (1): | 11-15-2012 |
20130256848 | ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME - An electromagnetic component module includes: a molding resin provided so as to cover electronic components mounted on a substrate and a surface of the substrate; and a conductive shield formed so as to further cover the molding resin. The conductive shield includes a first filler and a second filler which are different from each other and the conductive shield is connected to ground wires exposed on lateral surfaces of the substrate. The average particle diameter of the first filler is ½ or less of the thickness of the ground wires and the second filler forms a metallic bond in the temperature range of 250 degrees Celsius or lower. | 10-03-2013 |
20140153196 | MOUNTING STRUCTURE OF CHIP COMPONENT AND ELECTRONIC MODULE USING THE SAME - An electronic module is provided with a circuit board | 06-05-2014 |
20140293561 | WIRING BOARD, ELECTRONIC COMPONENT EMBEDDED SUBSTRATE, METHOD OF MANUFACTURING WIRING BOARD, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE - A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating on the inner wall of the via formation hole. | 10-02-2014 |
20140356967 | TISSUE MIMICKING PHANTOM AND CALIBRATION DEVICE - A tissue mimicking phantom for ultrasonic treatment and a calibration device of an ultrasonic treatment device using the phantom are aimed to be provided. In order to dissolve the above-mentioned problems, the tissue mimicking phantom in accordance with the present invention is characterized by including an indicator agent which is denatured by an increase in temperature and which simulates an ultrasonic treatment effect, and a denaturation sensitivity controlling agent which is a different component from that of the indicator agent, which serves as a nucleus of cavitation at the time of ultrasonic irradiation, and which supports the increase in temperature and the denaturation of the indicator agent. The configuration makes it possible to obtain an tissue mimicking phantom which resolves the shortage of sensitivity, and which has excellent stability. | 12-04-2014 |
20150052743 | MANUFACTURING METHOD OF MODULE COMPONENTS - A manufacturing method of electronic module components according to the present invention includes: forming a plurality of module components on a principal surface of a substrate; forming a groove by dicing between the module components; spraying a conductive paste toward the principal surface of the substrate; and separating the module components. The spraying is performed so that an angle formed between a spray direction and the principal surface is an angle θ. The angle θ is set so as to satisfy the following expression (1), assuming that a depth of the groove is D and a width of the groove is w. the expression (1) is | 02-26-2015 |