Patent application number | Description | Published |
20140020951 | METHOD OF FABRICATING HIGH-DENSITY HERMETIC ELECTRICAL FEEDTHROUGHS - A method of fabricating electrical feedthroughs selectively removes substrate material from a first side of an electrically conductive substrate (e.g. a bio-compatible metal) to form an array :of electrically conductive posts in a substrate cavity. An electrically insulating material (e.g. a bio-compatible sealing glass) is then flowed to fill the substrate cavity and surround each post, and solidified. The solidified insulating material is then exposed from an opposite second side of the substrate so that each post is electrically isolated from each other as well as the bulk substrate. In this manner a hermetic electrically conductive feedthrough construction is formed having an array of electrical feedthroughs extending between the first and second sides of the substrate from which it was formed. | 01-23-2014 |
20140107446 | FLEXIBLE MICROELECTRODE ARRAY WITH INTEGRATED STIFFENING SHANK, AND METHOD OF FABRICATION - A stiffener-reinforced microelectrode array device and fabrication method having a plurality of polymer layers surroundably encapsulating one or more electrodes connected to one or more metal traces so that the one or more electrodes are exposed. A stiffening shank is also integrally embedded in the polymer layers adjacent an insertion end of the device near the electrodes to provide mechanical support during insertion. | 04-17-2014 |
20140172051 | SINGLE LAYER POLYMER MICROELECTRODE ARRAY - A microelectrode array having one or more electrical conduits surrounded and insulated from each other by only a single layer of polymer (e.g. polyimide), and a method of fabricating the same. Multiple layers of an uncured polymer precursor (such as polyamic acid) are separately formed with metal layers sandwiched in between. Formation of the uncured polymer precursor layers includes deposition and heating to remove solvent only but not polymerize the precursor. Upon completing construction, the array is subjected to a high-temperature curing process that converts the uncured polymer precursor layers into the polymer. The different layers of the polymer precursor are thus covalently bonded together during the curing process to create a single continuous layer (e.g. monolithic block) of polymer, with no polymer-polymer interfaces. | 06-19-2014 |
20140262462 | DEPOSITING BULK OR MICRO-SCALE ELECTRODES - Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer. | 09-18-2014 |
20140273545 | HIGH-DENSITY PERCUTANEOUS CHRONIC CONNECTOR FOR NEURAL PROSTHETICS - A high density percutaneous chronic connector, having first and second connector structures each having an array of magnets surrounding a mounting cavity. A first electrical feedthrough array is seated in the mounting cavity of the first connector structure and a second electrical feedthrough array is seated in the mounting cavity of the second connector structure, with a a feedthough interconnect matrix positioned between a top side of the first electrical feedthrough array and a bottom side of the second electrical feedthrough array to electrically connect the first electrical feedthrough array to the second electrical feedthrough array. The two arrays of magnets are arranged to attract in a first angular position which connects the first and second connector structures together and electrically connects the percutaneously connected device to the external electronics, and to repel in a second angular position to facilitate removal of the second connector structure from the first connector structure. | 09-18-2014 |
20140277296 | INCORPORATING AN OPTICAL WAVEGUIDE INTO A NEURAL INTERFACE - An optical waveguide integrated into a multielectrode array (MEA) neural interface includes a device body, at least one electrode in the device body, at least one electrically conducting lead coupled to the at least one electrode, at least one optical channel in the device body, and waveguide material in the at least one optical channel. The fabrication of a neural interface device includes the steps of providing a device body, providing at least one electrode in the device body, providing at least one electrically conducting lead coupled to the at least one electrode, providing at least one optical channel in the device body, and providing a waveguide material in the at least one optical channel. | 09-18-2014 |
20140277317 | FLEXIBLE NEURAL INTERFACES WITH INTEGRATED STIFFENING SHANK - A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material. | 09-18-2014 |
20150145590 | System And Method For On Demand, Vanishing, High Performance Electronic Systems - An integrated circuit system having an integrated circuit (IC) component which is able to have its functionality destroyed upon receiving a command signal. The system may involve a substrate with the IC component being supported on the substrate. A module may be disposed in proximity to the IC component. The module may have a cavity and a dissolving compound in a solid form disposed in the cavity. A heater component may be configured to heat the dissolving compound to a point of sublimation where the dissolving compound changes from a solid to a gaseous dissolving compound. A triggering mechanism may be used for initiating a dissolution process whereby the gaseous dissolving compound is allowed to attack the IC component and destroy a functionality of the IC component. | 05-28-2015 |