Keat
Kelvin Yeo Soon Keat, Singapore SG
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20140028838 | MEASURING LAUNCH AND MOTION PARAMETERS - An example embodiment includes an apparatus for monitoring launch parameters of an object. The apparatus includes a transmitter optical subassembly (TOSA), a receiver optical subassembly (ROSA), a processing unit, and a camera. The TOSA includes at least one laser source configured to transmit a laser sheet along an expected flight path of an object. The ROSA is configured to receive light reflected from the object. The processing unit is configured to estimate a velocity of the object based at least partially on the received light. The camera is configured to capture one or more images of the object at a time in which the object passes through a field of view of the camera according to the estimated velocity. | 01-30-2014 |
Leow Hong Keat, Penang MY
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20100019392 | STACKED DIE PACKAGE HAVING REDUCED HEIGHT AND METHOD OF MAKING SAME - A stacked die package is disclosed. The stacked die package includes a wire-bond die that is electrically coupled to other components via one or more wire bonds and a flip-chip die that is coupled to the top surface of the wire-bond die via one or more solder joints. The wire-bond die is formed underneath the flip-chip die. A space defined by the height of the loops of the one or more wire-bonds overlap a space defined by the thickness of one or more solder joints. | 01-28-2010 |
Lim Haw Keat, Singapore SG
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20120024542 | HANGER FLOATING RING AND SEAL ASSEMBLY SYSTEM AND METHOD - Systems and methods are provided for isolating a landing ring of a hanger from pressure inside a wellhead and sealing a portion of the hanger via a seal assembly. The hanger includes a floating ring axially interposed between the landing ring and the seal assembly, and between the landing ring and a shoulder of the hanger. The seal assembly includes one or more radially retractable elastomeric seals that are radially retracted during run in of the seal assembly. The radially retractable seals may be radially expanded via shearing of one or more shear pins by torque applied to the seal assembly. The seal assembly may also include one or more metal seals having a plurality of rings having a nib configuration that includes three smaller nibs for sealing and a larger flat nib for withstanding the energizing load on the seal assembly. | 02-02-2012 |
Phang Hon Keat, Ipoh MY
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20120104421 | LEADFRAME PACKAGE WITH RECESSED CAVITY FOR LED - An LED package includes a die pad having a bottom surface, an upper surface and a centrally located recessed cavity. The recessed cavity has a chip attach surface between the bottom surface and upper surface and sidewalls that extend from the recessed chip attach surface to the upper surface. The package additionally has leads arranged on opposing sides of the die pad. The leads have a bottom surface that is coextensive with the bottom surface of the die pad and an upper surface coextensive with the upper surface of the die pad. An LED chip is attached to the chip attach surface. The package further includes a package body having an encapsulant which fills space between the die pad and leads forming a bottom encapsulant surface that is coextensive with the bottom surfaces of the die pad and leads. | 05-03-2012 |
20120107974 | MANUFACTURING LIGHT EMITTING DIODE (LED) PACKAGES - A method of manufacturing an LED package includes mounting a large panel frame/substrate (LPF/S) having a substantially square shape to a ring. The LPF/S includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. Each of the die pads includes a planar chip attach surface. An LED chip is attached to the planar chip attach surface of each of the die pads. An encapsulant material is applied overlaying the LED chips and at least a part of the LPF/S. Each die pad and corresponding leads are separated from the LPF/S to form individual LED packages. The steps of attaching the LED chips and applying the encapsulant material are performed while the LPF/S is mounted to the ring. | 05-03-2012 |
20130221382 | MANUFACTURING LIGHT EMITTING DIODE (LED) PACKAGES - A method of manufacturing an LED package includes mounting a large panel frame/substrate (LPF/S) having a substantially square shape to a ring. The LPF/S includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. Each of the die pads includes a planar chip attach surface. An LED chip is attached to the planar chip attach surface of each of the die pads. An encapsulant material is applied overlaying the LED chips and at least a part of the LPF/S. Each die pad and corresponding leads are separated from the LPF/S to form individual LED packages. The steps of attaching the LED chips and applying the encapsulant material are performed while the LPF/S is mounted to the ring. | 08-29-2013 |
Phang Hon Keat, Jelapang MY
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20130109137 | LARGE PANEL LEADFRAME | 05-02-2013 |
Tan Boon Keat, Singapore SG
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20110063276 | Methods, Systems, Devices and Components for Reducing Power Consumption in an LCD Backlit by LEDs - Disclosed are various embodiments of methods, systems, devices and components nets for reducing power consumption in an LCD display that is backlit by LEDs. The various embodiments typically require the use of an array of backlighting LEDs | 03-17-2011 |