Patent application number | Description | Published |
20110105457 | HETEROCYCLIC COMPOUND HAVING INHIBITORY ACTIVITY ON PI3K - The purpose of the present invention is to provide a compound or a pharmaceutically acceptable salt thereof which inhibits the activity of PI3K to regulate many biological processes including the growth, differentiation, survival, proliferation, migration, metabolism, and the like of cells and is therefore useful for the prevention/treatment of diseases including inflammatory diseases, arteriosclerosis, vascular/circulatory diseases, cancer/tumors, immune system diseases, cell proliferative diseases, infectious diseases, and the like. This was achieved by providing a substituted 2-amino-5,6-nitrogenated fused ring compound shown in the present specification, or a pharmaceutically acceptable salt thereof. | 05-05-2011 |
20120022251 | METHOD OF PRODUCING PYRONE AND PYRIDONE DERIVATIVES - The present invention provides a pyrone derivative and a pyridone derivative, which are novel intermediates for synthesizing an anti-influenza drug, a method of producing the same, and a method of using the same. | 01-26-2012 |
20140011995 | Process for Preparing Compound Having HIV Integrase Inhibitory Activity - A process for preparing a compound represented by formula (Y1) or (Y2) [wherein R | 01-09-2014 |
20150031876 | METHOD FOR PRODUCING PYRONE AND PYRIDONE DERIVATIVES - The present invention provides a pyrone derivative and a pyridone derivative, which are novel intermediates for synthesizing an anti-influenza drug, a method of producing the same, and a method of using the same. | 01-29-2015 |
20150038702 | Method of producing compounds having HIV integrase inhivitory activity - A process for preparing a compound represented by formula (Y1) or (Y2) | 02-05-2015 |
Patent application number | Description | Published |
20090139591 | SOLENOID VALVE MANIFOLD - Attaching/detaching workability of a fitting block to/from an solenoid valve assembly is improved, and a fixing strength of the fitting block to the solenoid valve assembly is enhanced. The fitting block | 06-04-2009 |
20090212247 | MANIFOLD SOLENOID VALVE - A plurality of valve assemblies are provided to a base, and an air-supply flow path for supplying compressed air to each valve assembly is formed in the base. A main flow path communicating with the air-supply flow path and communicating with a pilot air-supply flow path is formed in an air supply block. When the compressed air is supplied to the air-supply flow path and the pilot air-supply flow path from the main flow path, a manifold solenoid valve becomes an internal pilot type. An external pilot flow path communicating with the pilot air-supply flow path is formed in an external pilot block, and when the external pilot block is provided, communication between the main flow path and the pilot air-supply flow path is shut off, and the manifold solenoid valve becomes an external pilot type in which the pilot pressure is supplied from the external pilot flow path. | 08-27-2009 |
20100168908 | TRANSPORT METHOD AND TRANSPORT APPARATUS - Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on acceleration of the substrate holders. Whether there is the possibility of misalignment may be judged based on acceleration of a transporting section that transports the substrate holders. Whether there is the possibility of misalignment may be judged based on relative positions of the substrate holders. Whether there is the possibility of misalignment may be judged based on relative positions of (i) a transporting section that transports the pair of substrate holders and (ii) one of the pair of substrate holders. | 07-01-2010 |
20100201432 | Multi-layered semiconductor apparatus - Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus ( | 08-12-2010 |
20110155327 | Adhesive Injection Device - Provided is an adhesive injection device for injecting an adhesive between the substrates of laminates which each comprise at least two substrates that face each other. The adhesive injection device is provided with: a cassette which holds multiple laminates aligned along the direction of lamination of the substrates; and an adhesive injector which injects adhesive into each inter-substrate space, as the laminates are being held in the cassette, so that the actions of injecting the adhesive into each inter-substrate space overlap chronologically. Holding multiple laminates in the cassette makes it possible to treat the multiple laminates as a unit. By injecting adhesive into each inter-substrate space, as the laminates are being held, so that the actions of injecting the adhesive into each inter-substrate space overlap chronologically, the injection of adhesive into multiple laminates is simplified, and the time required for injection can be reduced. | 06-30-2011 |
20120256679 | MULTI-LAYERED SEMICONDUCTOR APPARATUS - Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus ( | 10-11-2012 |
20130226334 | MULTIPLE-POINTS MEASUREMENT - A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages. | 08-29-2013 |
20130251494 | WH (WAFER-HOLDER) PROCESS - A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages. | 09-26-2013 |
20130271211 | MULTI-LAYERED SEMICONDUCTOR APPARATUS - Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus ( | 10-17-2013 |
Patent application number | Description | Published |
20090004762 | Stacking apparatus and method for stacking integrated circuit elements - A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages. | 01-01-2009 |
20110202890 | DESIGN SYSTEM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR BONDING SUBSTRATES - The terminals that oppose each other when substrates are bonded are designed to be reliably joined. Comprised in a semiconductor device design system are a numerical value acquiring part, which acquires the respective numerical values of a plurality of calculation parameters, a junction estimating part, which, in the case in which a plurality of substrates has been pressed at a prescribed pressure so that the bump front end faces come into contact, estimates whether or not the respective mutually opposing bumps will be joined based on the respective numerical values of the calculation parameters acquired by the numerical value acquiring part, and a change processing part, which, in the case in which it has been estimated by the junction estimating part that any of the bumps will not be joined, gives a warning or performs processing so as to change the numerical value of at least one calculation parameter among the plurality of calculation parameters. | 08-18-2011 |
20120118477 | STACKING APPARATUS AND METHOD FOR STACKING INTEGRATED CIRCUIT ELEMENTS - A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages. | 05-17-2012 |
20120330459 | Transport Method and Transport Apparatus - Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on at least one of an acceleration of the substrate holders, an acceleration of a transporting section that transports the substrate holders, relative positions of the substrate holders, or relative positions of the transporting section and one of the pair of substrate holders. | 12-27-2012 |
20130191806 | DESIGN SYSTEM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR BONDING SUBSTRATES - The terminals that oppose each other when substrates are bonded are designed to be reliably joined. Comprised in a semiconductor device design system are a numerical value acquiring part, which acquires the respective numerical values of a plurality of calculation parameters, a junction estimating part, which, in the case in which a plurality of substrates has been pressed at a prescribed pressure so that the bump front end faces come into contact, estimates whether or not the respective mutually opposing bumps will be joined based on the respective numerical values of the calculation parameters acquired by the numerical value acquiring part, and a change processing part, which, in the case in which it has been estimated by the junction estimating part that any of the bumps will not be joined, gives a warning or performs processing so as to change the numerical value of at least one calculation parameter among the plurality of calculation parameters. | 07-25-2013 |
20130274915 | Transport Method and Transport Apparatus - Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on acceleration of the substrate holders. Whether there is the possibility of misalignment may be judged based on acceleration of a transporting section that transports the substrate holders. Whether there is the possibility of misalignment may be judged based on relative positions of the substrate holders. Whether there is the possibility of misalignment may be judged based on relative positions of (i) a transporting section that transports the pair of substrate holders and (ii) one of the pair of substrate holders. | 10-17-2013 |
20140181781 | DESIGN SYSTEM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR BONDING SUBSTRATES - The terminals that oppose each other when substrates are bonded are designed to be reliably joined. Comprised in a semiconductor device design system are a numerical value acquiring part, which acquires the respective numerical values of a plurality of calculation parameters, a junction estimating part, which, in the case in which a plurality of substrates has been pressed at a prescribed pressure so that the bump front end faces come into contact, estimates whether or not the respective mutually opposing bumps will be joined based on the respective numerical values of the calculation parameters acquired by the numerical value acquiring part, and a change processing part, which, in the case in which it has been estimated by the junction estimating part that any of the bumps will not be joined, gives a warning or performs processing so as to change the numerical value of at least one calculation parameter among the plurality of calculation parameters. | 06-26-2014 |
20140304674 | DESIGN SYSTEM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR BONDING SUBSTRATES - The terminals that oppose each other when substrates are bonded are designed to be reliably joined. Comprised in a semiconductor device design system are a numerical value acquiring part, which acquires the respective numerical values of a plurality of calculation parameters, a junction estimating part, which, in the case in which a plurality of substrates has been pressed at a prescribed pressure so that the bump front end faces come into contact, estimates whether or not the respective mutually opposing bumps will be joined based on the respective numerical values of the calculation parameters acquired by the numerical value acquiring part, and a change processing part, which, in the case in which it has been estimated by the junction estimating part that any of the bumps will not be joined, gives a warning or performs processing so as to change the numerical value of at least one calculation parameter among the plurality of calculation parameters. | 10-09-2014 |
20150083786 | Substrate Bonding Apparatus and Substrate Bonding Method - A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition. | 03-26-2015 |
20150231873 | SUBSTRATE ALIGNING APPARATUS, SUBSTRATE BONDING APPARATUS, SUBSTRATE ALIGNING METHOD AND SUBSTRATE BONDING METHOD - A substrate aligning apparatus comprising: an aligning section that aligns a first substrate and a second substrate together; an acquiring section that acquires positional information on at least one of the first substrate and the second substrate, by the time the first substrate and the second substrate which have been aligned in the aligning section are carried out from the aligning section; a judging that judges misalignment of the first substrate and the second substrate, based on information acquired by the acquiring section. | 08-20-2015 |
Patent application number | Description | Published |
20130238222 | ENERGY MANAGEMENT SYSTEM - An engine control unit of a power system is provided with a memory module which stores a fuel consumption data. An electric power ECU of a power supply system controls an operation mode of a generator based on a fuel consumption associated data transmitted from an engine control unit. An air-condition ECU of a heat system controls an operation mode of a compressor based on the fuel consumption associated data transmitted from the engine control unit. By updating the fuel consumption data stored in the engine control unit, control characteristics of the power supply system and the heat system can be varied. The fuel consumption associated data is transmitted to the ECU in preference to the other data. Moreover, the fuel consumption associated data is transmitted in a period which the electric power ECU and the air-condition ECU require. | 09-12-2013 |
20140316671 | PLATOON TRAVEL SYSTEM - A platoon travel system organizes a platoon having plural platoon vehicles traveling in two vehicle groups, in which a preset inter-vehicle distance is reserved between each of the platoon vehicles. When a new vehicle joins in the platoon, the platoon travel system adjusts the inter-vehicle distance by decelerating, among all platoon vehicles, deceleration target vehicles that are the platoon vehicles behind a join position in the platoon, which are included in a latter one of the two vehicle groups. | 10-23-2014 |
20140316865 | PLATOON TRAVEL SYSTEM - A platoon travel system organizes and performs a platoon travel of plural vehicles along a preset travel route. The system has a grouping unit that divides the plural vehicles into a top group and a tail end group based on projection area information of the vehicles, and groups vehicles with a projection area in a first range to the top group and vehicles with a projection area in a second range to the tail end group, which is less than the first range. A final position determination unit determines a position of each of the plural vehicles in the vehicle groups based on the depart point information, positions the top group vehicles in an ascending order of depart point distances, and positions the tail end group vehicles in a descending order of depart point distances, thereby preventing deterioration of whole platoon energy consumption. | 10-23-2014 |
Patent application number | Description | Published |
20140350383 | PET-MRI DEVICE - A PET-MRI device according to an embodiment includes image generators and a derivation unit. The image generators capture an image of a target placed in an effective visual field of a PET by the PET and an MRI so as to generate a PET image and an MR image. The derivation unit calculates a strain correction factor for correcting strain on the MR image based on a positional relation between a target that is expressed on the PET image and a target that is expressed on the MR image. | 11-27-2014 |
20150045653 | PET-MRI APPARATUS - A positron emission tomography (PET)-magnetic resonance imaging (MRI) apparatus according to an embodiment includes a gantry having a static magnetic field magnet, a gradient coil, and a radio frequency coil, a PET detector, and a moving mechanism. The static magnetic field magnet generates a static magnetic field in a bore having an approximately cylindrical shape. The gradient coil is disposed on an inner circumference side of the static magnetic field magnet and applies a gradient magnetic field to an object disposed in the bore. The radio frequency coil is disposed on an inner circumference side of the gradient coil and applies a radio frequency magnetic field to the object. The PET detector detects gamma rays emitted from a positron-emitting radionuclide injected into the object. The moving mechanism causes the PET detector in the gantry along the axial direction of the bore. | 02-12-2015 |
20150065861 | MEDICAL IMAGE DIAGNOSTIC DEVICE - A medical image diagnostic device according to an embodiment includes a first collector, a second collector, and an image generator. The first collector collects data from a first region of a subject through a first detector. The second collector collects data from a second region of the subject that is different from the first region through a second detector. The image generator generates a first diagnostic image from the data collected by the first collector and generates a second diagnostic image from the data collected by the second collector. | 03-05-2015 |
20150253394 | MAGNETIC RESONANCE IMAGING APPARATUS AND RADIO FREQUENCY COIL - A magnetic resonance imaging apparatus according to an embodiment includes a radio frequency coil and a control signal transmitting unit. The radio frequency coil is that receives a magnetic resonance signal emitted from a patient as a result of an application of a radio frequency magnetic field thereto and to transmit the received magnetic resonance signal via a wireless communication. The control signal transmitting unit that transmits control information that collectively defines operations to be performed by the radio frequency coil during a predetermined repetition time period, to the radio frequency coil via a wireless communication, prior to the start of the operations performed during the predetermined repetition time period. Further, the radio frequency coil that receives the control information via a wireless communication and to perform the operations on the basis of the received control information. | 09-10-2015 |
20150253404 | MAGNETIC RESONANCE IMAGING APPARATUS - A magnetic resonance imaging apparatus according to an embodiment includes a wireless communication unit, a radio frequency (RF) coil, and a specifying unit. The wireless communication unit includes an antenna and that transmits and receives a wireless signal through the antenna. The RF coil includes one or more antennas and that receives the wireless signal and to respond to the received wireless signal through the one or more antennas. The specifying unit that specifies the position and the orientation of the RF coil on the basis of a response result indicated by the response from the RF coil. | 09-10-2015 |