Kazuichi
Kazuichi Hamada, Saitama JP
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20120318784 | CERAMIC HEATER, AND MANUFACTURING METHOD THEREOF - A ceramic heater includes a ceramic resistor, at least one metallic film, and at least one foam metal member. The at least one metallic film is formed on at least one surface, of the ceramic resistor, which is assigned as at least one electrode plane. The at least one foam metal member is formed in a plate-like shape. The at least one foam metal member covers and is attached to the at least one metallic film. | 12-20-2012 |
Kazuichi Hayashi, Nirasaki-Shi JP
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20090042384 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND TARGET SUBSTRATE PROCESSING SYSTEM - A semiconductor device manufacturing method includes removing copper deposits, by use of an organic acid gas and an oxidizing gas, from a surface of a second interlayer insulation film having a groove formed therein and reaching a copper-containing electric connector member. The second interlayer insulation film is disposed on a first interlayer insulation film provided with the electric connector member. The method then includes reducing a surface of the electric connector member exposed at a bottom of the groove of the second interlayer insulation film; forming a barrier layer on the second interlayer insulation film; and forming a copper-containing conductive film to fill the groove of the second interlayer insulation film. | 02-12-2009 |
20100230386 | PROCESSING DEVICE, ELECTRODE, ELECTRODE PLATE, AND PROCESSING METHOD - A processing gas fed from a gas feed pipe ( | 09-16-2010 |
20110265950 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND TARGET SUBSTRATE PROCESSING SYSTEM - A semiconductor device manufacturing method includes removing copper deposits, by use of an organic acid gas and an oxidizing gas, from a surface of a second interlayer insulation film having a groove formed therein and reaching a copper-containing electric connector member. The second interlayer insulation film is disposed on a first interlayer insulation film provided with the electric connector member. The method then includes reducing a surface of the electric connector member exposed at a bottom of the groove of the second interlayer insulation film; forming a barrier layer on the second interlayer insulation film; and forming a copper-containing conductive film to fill the groove of the second interlayer insulation film. | 11-03-2011 |
Kazuichi Hayashi, Yamanashi JP
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20100108108 | SUBSTRATE MOUNTING TABLE, SUBSTRATE PROCESSING APPARATUS AND METHOD FOR TREATING SURFACE OF SUBSTRATE MOUNTING TABLE - A substrate mounting table includes a mounting table main body whose top surface and side surface are covered with an upper cover member. Surface treatment is performed partially to a substrate surrounding region disposed outside a substrate mounting region on a top surface of the upper cover member, so that the substrate surrounding region is smoother than the substrate mounting region. The substrate mounting region is covered by a wafer when the wafer is mounted thereon. Thus, for instance, a metal component generated upon removal of a metal oxide film from the substrate is not easily adhered on the mounting table, and is easily removed if adhered. | 05-06-2010 |
Kazuichi Tomonobu, Utsunomiya-Shi JP
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20130230630 | OIL OR FAT COMPOSITION - A fat or oil composition comprising from 0.02 to 0.65 mass % of a free type triterpene alcohol and 0.18 mass % or less of a γ-oryzanol. | 09-05-2013 |
Kazuichi Tomonobu, Chiba-Shi JP
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20130280407 | FAT AND/OR OIL COMPOSITION - Provided is a fat or oil composition, comprising: (A) from 0.02 to 1.8 mass % of a free type triterpene alcohol; and (B) 1.4 mass % or less of a fatty acid ester type triterpene alcohol, in which a mass ratio of the component (A) to the component (B) ((A)/(B)) is larger than 1. | 10-24-2013 |