Kang, Hwaseong-Si
Bumsuk Kang, Hwaseong-Si KR
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20090152894 | STRUCTURE OF MOUNTING GARNISH TO DOOR FRAME OF VEHICLE - A garnish to be mounted to a door frame of a vehicle, and a mounting structure thereof. The garnish has a mounting boss, a first end, and a second end. The mounting structure includes a door frame with a space for the mounting boss of the garnish to be inserted therein and secured by a fastener. The mounting structure also includes a glass run channel with an edge that contacts an outer end of the door frame. The first end of the garnish is shaped to be fitted into an edge of the glass run channel. The second end of the garnish has a protrusion shaped to cover an end of the door frame. The glass run channel may have a clearance groove to prevent interference with the fastener. The fastener may be a screw. Double-sided tape may be provided for further securing the garnish to the door frame. | 06-18-2009 |
Byoungjoong Kang, Hwaseong-Si KR
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20110006826 | PHASE SIGNAL GENERATING APPARATUSES - In at least one example embodiment, a phase signal generating apparatus includes a phase signal generator and phase controller. The phase signal generator is configured to receive a plurality of first phase signals and a plurality of second phase signals, adjust a phase difference between the plurality of first phase signals and the plurality of second phase signals and generate a plurality of adjusted first phase signals and a plurality of adjusted second phase signals, based on a switch control signal and a phase control signal, a phase difference between the plurality of adjusted first phase signals and the plurality of adjusted second phase signals being the adjusted phase difference. The phase controller is configured to generate the switch control signal and the phase control signal based on phase information for the plurality of first phase signals and the plurality of second phase signals. | 01-13-2011 |
Byoung Joong Kang, Hwaseong-Si KR
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20110050474 | METHOD AND CIRCUIT FOR CALIBRATING PHASE, AND SIGNAL PROCESSING APPARATUS HAVING THE SAME - A method for calibrating a phase include comparing a phase of an in-phase output signal and a phase of a quadrature-phase output signal and generating a digital code corresponding to a comparison result, and controlling the phase of the in-phase output signal in response to quadrature-phase differential input signals and the digital code, and controlling the phase of the quadrature-phase output signal in response to in-phase differential input signals and the digital code, to make a phase difference between the in-phase output signal and the quadrature-phase output signal 90°. | 03-03-2011 |
20120257656 | TRANSCEIVERS HAVING LOOPBACK SWITCHES AND METHODS OF CALIBRATING CARRIER LEAKAGE THEREOF - A transceiver includes a transmitter circuit, a receiver circuit, and the loopback switch. The transmitter circuit performs a digital-to-analog conversion (DAC) operation on a calibration code without a transmission digital signal in a calibration mode to generate a calibration signal. The transmitter circuit up-converts the calibration signal and generates a transmission signal. The receiver circuit down-converts the transmission signal in the calibration mode and generates a receiving digital signal. The loopback switch electrically connects an output terminal of the transmitter circuit and an input terminal of the receiver circuit in the calibration mode. Thus, the transceiver may stably reduce a carrier leakage irrespective of processes, voltages, and temperatures. | 10-11-2012 |
Chang Ky Kang, Hwaseong-Si KR
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20110083295 | WIPER BLADE FOR VEHICLE - A wiper blade for a vehicle may include a secondary lever including a lever rivet hole, an adapter including a guide rib formed in the longitudinal direction thereof, a locking projection formed at the rear thereof, and an adapter rivet hole, a primary cover including a guide groove formed in the longitudinal direction thereof and into which the guide rib of the adapter is inserted, and a locking groove into which the locking projection of the adapter is inserted, and a hinge member penetrating the lever rivet hole and the adapter rivet hole and pivotally coupling the adapter and secondary lever. | 04-14-2011 |
20130056571 | SEAT BELT PRETENSIONER FOR VEHICLE AND METHOD FOR PROTECTING PASSENGER USING THE SAME - A seat belt pretensioner apparatus for a vehicle may include a motor operated in response to a control signal of a seat-belt controller, a reduction gear transmitting a rotating force of the motor, and a rotary roll rotated by a rotating force transmitted from the reduction gear, an end of a seat belt being coupled to the rotary roll. | 03-07-2013 |
Chang-Sig Kang, Hwaseong-Si KR
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20110210433 | SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND FILM - A semiconductor chip for a tape automated bonding (TAB) package is disclosed. The semiconductor chip comprises a connection surface including a set of input pads connected to internal circuitry of the chip and for conveying external signals to the internal circuitry, the set of input pads comprising all of the input pads on the chip. The connection surface includes a set of output pads connected to internal circuitry of the chip and for conveying internal chip signals to outside the chip, the set of output pads comprising all of the output pads on the chip. The connection surface includes a first edge and a second edge that are substantially parallel to each other and are opposite each other on a respective first side and second side of the chip, and a third edge and fourth edge that are substantially perpendicular to the first and second edges, and are opposite each other on a respective third side and fourth side of the chip. A plurality of input pads of the set of input pads are adjacent the first edge, and are arranged in a first row substantially parallel to the first edge and extending in a first direction; a plurality of first output pads of the set of output pads are adjacent the second edge, and are arranged in a second row substantially parallel to the second edge and extending in the first direction; and a plurality of second output pads of the set of output pads are located between the first row and the second row. The plurality of second output pads include at least first and second outermost pads located a certain distance from the respective third edge and fourth edge, and at least first and second inner pads located a greater distance from the respective third edge and fourth edge than the first and second outermost pads. | 09-01-2011 |
20110273424 | DISPLAY PANEL DATA DRIVER AND DISPLAY APPARATUS INCLUDING SAME - A data driver driving a display panel includes a data processing unit receiving digital data synchronously with a master clock signal and storing the digital signal, and a driving signal output unit generating a driving signal corresponding to the digital data in response to a driving instruction signal, and outputting the driving signal to the display panel. The data processing unit is activated at an activation time determined according to a setting signal. | 11-10-2011 |
20140084430 | SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND FILM - A semiconductor chip for a TAB package includes a surface including a set of input pads connected to internal circuitry of the chip and for receiving external signals The surface includes output pads. A plurality of input pads are adjacent a first edge and are in a first row substantially parallel to the first edge and extending in a first direction; a plurality of first output pads are adjacent a second edge, and are in a second row substantially parallel to the second edge and extending in the first direction; and a plurality of second output pads are located between the first row and the second row. The plurality of second output pads first and second outermost pads located a certain distance from a respective third edge and fourth edge, and first and second inner pads located a greater distance from the respective third edge and fourth edge. | 03-27-2014 |
Chinkyu Kang, Hwaseong-Si KR
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20130016638 | METHOD FOR CONTROLLING DISCONTINUOUS RECEPTION IN MOBILE COMMUNICATION DEVICEAANM LEE; KyounghoAACI Hwaseong-siAACO KRAAGP LEE; Kyoungho Hwaseong-si KRAANM CHUNG; JaepilAACI SeoulAACO KRAAGP CHUNG; Jaepil Seoul KRAANM KANG; ChinkyuAACI Hwaseong-siAACO KRAAGP KANG; Chinkyu Hwaseong-si KRAANM YOON; JaeseungAACI Yongin-siAACO KRAAGP YOON; Jaeseung Yongin-si KRAANM LEE; SangbongAACI Suwon-siAACO KRAAGP LEE; Sangbong Suwon-si KR - A method for controlling a discontinuous reception (DRX) in a mobile communication device is provided. According to the method, when a specific application is selected, the device activates a DRX setting timer having a long DRX period for a direct long DRX mode, and enters into the DRX mode. When the setting timer expires in the DRX mode, the device activates the setting timer again and receives control information from a base station in an on-duration zone. The device enters into the DRX mode in response to no reception of valid control information in the on-duration zone, or enters into a continuous mode for executing the specific application in response to reception of valid control information. | 01-17-2013 |
Dae Chul Kang, Hwaseong-Si KR
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20120122522 | MOBILE TERMINAL DEVICE FOR RECEIVING DUAL BAND SIGNAL USING MULTIPLE RESONANCE ANTENNA - A mobile terminal device for receiving a dual band signal using a multiple resonance antenna in a mobile terminal is provided. The mobile terminal device includes a multiple resonance antenna, a first band filter connecting with the multiple resonance antenna, for filtering a first band signal of a low band received through the multiple resonance antenna, a second band filter connecting with the multiple resonance antenna, for filtering a second band signal of a high band received through the multiple resonance antenna, and a signal processor including a first signal processing unit for converting a frequency of the first band signal to generate a first baseband signal and a second signal processing unit for converting a frequency of the second band signal to generate a second baseband signal, and for activating a corresponding signal processing unit according to selection of a user. | 05-17-2012 |
Daehyuk Kang, Hwaseong-Si KR
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20100178755 | Method of fabricating nonvolatile memory device - A method of fabricating a nonvolatile memory device with a three-dimensional structure includes alternately stacking first and second material layers in two or more layers on a semiconductor substrate, forming trenches penetrating the stacked first and second material layers by performing a first etching process, and removing the second material layers exposed in the trenches by performing a second etching process. The first and second material layers are formed of materials that have the same main component but have different impurity contents, respectively. | 07-15-2010 |
20100181610 | NON-VOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING NON-VOLATILE MEMORY DEVICE - Provided are nonvolatile memory devices with a three-dimensional structure and methods of fabricating the same. The nonvolatile memory device includes conductive patterns three-dimensionally arranged on a semiconductor substrate, semiconductor patterns that extend from the semiconductor substrate and intersect one-side walls of the conductive patterns, charge storage layers interposed between the semiconductor patterns and one-side walls of the conductive patterns, and seed layer patterns interposed between the charge storage layers and one-side walls of the conductive patterns. | 07-22-2010 |
20120003831 | Methods of Forming Nonvolatile Memory Devices Using Nonselective and Selective Etching Techniques to Define Vertically Stacked Word Lines - Methods of forming nonvolatile memory devices include forming a stack of layers of different materials on a substrate. This stack includes a plurality of first layers of a first material and a plurality of second layers of a second material arranged in an alternating sequence of first and second layers. A selected first portion of the stack of layers is isotropically etched for a sufficient duration to define a first trench therein that exposes sidewalls of the alternating sequence of first and second layers. The sidewalls of each of the plurality of first layers are selectively etched relative to sidewalls of adjacent ones of the plurality of second layers. Another etching step is then performed to recess sidewalls of the plurality of second layers and thereby expose portions of upper surfaces of the plurality of first layers. These exposed portions of the upper surfaces of the plurality of first layers, which may act as word lines of a memory device, are displaced laterally relative to each other. | 01-05-2012 |
Dae-Hyuk Kang, Hwaseong-Si KR
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20100267225 | Method of manufacturing semiconductor device - A method of manufacturing a semiconductor device, the method including forming a photoresist film on a substrate, and removing the photoresist film from the substrate using a composition that includes a sulfuric acid solution, a hydrogen peroxide solution, and a corrosion inhibitor. | 10-21-2010 |
20110159660 | Methods of Forming Integrated Circuit Capacitors Having Sidewall Supports and Capacitors Formed Thereby - In a method of forming a capacitor, a first mold layer pattern including a first insulating material may be formed on a substrate. The first mold layer pattern may have a trench. A supporting layer including a second insulating material may be formed in the trench. The second insulating material may have an etching selectivity with respect to the first insulating material. A second mold layer may be formed on the first mold layer pattern and the supporting layer pattern. A lower electrode may be formed through the second mold layer and the first mold layer pattern. The lower electrode may make contact with a sidewall of the supporting layer pattern. The first mold layer pattern and the second mold layer may be removed. A dielectric layer and an upper electrode may be formed on the lower electrode and the supporting layer pattern. | 06-30-2011 |
20110201203 | METHODS OF FORMING A HOLE HAVING A VERTICAL PROFILE AND SEMICONDUCTOR DEVICES HAVING A VERTICAL HOLE - In a method of forming a hole, an insulation layer is formed on a substrate, and a preliminary hole exposing the substrate is formed through the insulation layer. A photosensitive layer pattern including an organic polymer is then formed on the substrate to fill the preliminary hole. An etching gas including hydrogen fluoride (HF) or fluorine (F | 08-18-2011 |
20110281415 | METHODS OF FORMING AN ISOLATION LAYER AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES HAVING AN ISOLATION LAYER - In a method of forming an isolation layer, first and second trenches are formed on a substrate. The first and the second trenches have first and second widths, respectively, and the second width is greater than the first width. A second isolation layer pattern partially fills the second trench. A first isolation layer pattern and the third isolation layer pattern are formed. The first isolation layer pattern fills the first trench, and the third isolation layer pattern is formed on the second isolation layer pattern and fills a remaining portion of the second trench. | 11-17-2011 |
20110287625 | METHODS OF FORMING A PATTERN, METHODS OF FORMING A GATE STRUCTURE AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - A method of forming a pattern in a semiconductor device includes forming an etching object layer on a substrate, the etching object layer is an oxide that is substantially free of impurities. A mask is formed on the etching object layer, the mask is an oxide that includes impurities. The etching object layer is patterned using the mask as an etching mask and then the mask is removed. The mask is removed using an etchant having an etching selectivity to an oxide that is substantially free of impurities and an oxide that includes impurities during removing of the mask to limit damage to the patterned etching object layer during removal of the mask. | 11-24-2011 |
20110306197 | Methods of Manufacturing Semiconductor Devices - Method of manufacturing semiconductor device are provided including forming an insulation layer having a pad on a substrate; forming an etch stop layer on the insulation layer and the pad; forming a mold structure having at least one mold layer on the etch stop layer; forming a first supporting layer on the mold structure; etching the first supporting layer and the mold structure to form a first opening exposing the etch stop layer; forming a spacer on a sidewall of the first opening; etching the etch stop layer using the spacer as an etching mask to form a second opening, different from the first opening, exposing a first portion of the pad having a first associated area; etching the etch stop layer using the spacer as an etching mask to form a third opening exposing a second portion of the pad having a second associated area, the second associated area being larger than the first associated area; and etching the mold structure to form a fourth opening having a width larger than a width of the third opening. | 12-15-2011 |
20110306208 | Method for Fabricating Semiconductor Device - Methods for forming a mold for a storage electrode in a semiconductor device include forming an interlayer dielectric layer including a contact plug on a substrate. A first mold dielectric layer is formed of a first material on the interlayer dielectric layer. A second mold dielectric layer is formed of a second material on the first mold dielectric layer. The second material has a different etch selectivity than the first material. A first opening is formed that penetrates the first and second mold dielectric layers. The first opening is dry etched to define a second opening having a larger width in the first mold dielectric layer than in the second mold dielectric layer based on the different etch selectivity of the first and second mold dielectric layers to define the mold for the storage electrode. | 12-15-2011 |
20120064680 | METHODS OF FORMING A CAPACITOR STRUCTURE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME - A method of forming a capacitor structure and manufacturing a semiconductor device, the method of forming a capacitor structure including sequentially forming a first mold layer, a supporting layer, a second mold layer, an anti-bowing layer, and a third mold layer on a substrate having a conductive region thereon; partially removing the third mold layer, the anti-bowing layer, the second mold layer, the supporting layer, and the first mold layer to form a first opening exposing the conductive region; forming a lower electrode on a sidewall and bottom of the first opening, the lower electrode being electrically connected to the conductive region; further removing the third mold layer, the anti-bowing layer, and the second mold layer; partially removing the supporting layer to form a supporting layer pattern; removing the first mold layer; and sequentially forming a dielectric layer and upper electrode on the lower electrode and the supporting layer pattern. | 03-15-2012 |
20120112317 | INTEGRATED CIRCUIT CAPACITORS HAVING SIDEWALL SUPPORTS - In a method of forming a capacitor, a first mold layer pattern including a first insulating material may be formed on a substrate. The first mold layer pattern may have a trench. A supporting layer including a second insulating material may be formed in the trench. The second insulating material may have an etching selectivity with respect to the first insulating material. A second mold layer may be formed on the first mold layer pattern and the supporting layer pattern. A lower electrode may be formed through the second mold layer and the first mold layer pattern. The lower electrode may make contact with a sidewall of the supporting layer pattern. The first mold layer pattern and the second mold layer may be removed. A dielectric layer and an upper electrode may be formed on the lower electrode and the supporting layer pattern. | 05-10-2012 |
20120148944 | PHOTOMASKS AND METHODS OF MANUFACTURING THE SAME - In a method of manufacturing a photomask pattern, a light-shielding layer pattern and an anti-reflective layer pattern are formed sequentially on a transparent substrate. Oxidation and nitridation processes are performed on a sidewall of the light-shielding layer pattern to form a protection layer pattern on a lateral portion of the light-shielding layer pattern. | 06-14-2012 |
Dae Lim Kang, Hwaseong-Si KR
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20120112311 | Electrical Fuses Using Junction Breakdown and Semiconductor Integrated Circuits Including the Same - An electrical fuse includes first and second active regions doped with respective first-type and second-type impurities that form a horizontal P/N junction, first and second spaced apart silicide layers on respective portions of the top surfaces of the first and second active regions, and first and second contacts on the respective top surfaces of the first and second silicide layers. When a first reverse voltage that is higher than a threshold voltage is applied to the electrical fuse through the first and second contacts, the P/N junction is broken down by a reverse current flowing between the first and second active regions so that the electrical fuse is rendered conductive in response to a second reverse voltage that is less than the threshold voltage. | 05-10-2012 |
Dong-Jun Kang, Hwaseong-Si KR
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20110041022 | APPARATUS AND METHOD FOR RETRANSMITTING DATA IN WIRELESS COMMUNICATION SYSTEM - An apparatus and a method for operating an Automatic Repeat reQuest (ARQ) in consideration of an operation state of a Hybrid Automatic Repeat reQuest (HARQ) in a wireless communication system. In the method, when an an ARQ timer expires, operation state information of a HARQ module for controlling a HARQ is determined. Whether to delay generation of Negative ACKnowledge (NACK) information in consideration of the operation state information of the HARQ module, then determined. When determining to delay the generation of the NACK information, the generation of the NACK information is delayed for a delay time determined in consideration of the operation state information of the HARQ module. | 02-17-2011 |
20110170548 | APPARATUS AND METHOD FOR REORDERING DATA PACKETS IN COMMUNICATION SYSTEM - An apparatus and method for reordering data packets in a communication system are provided. The method includes detecting that a first time value of a timer used for reordering data packets needs to be set when a missing data packet occurs in receiving data packets, and, when the timer restarts, setting the first time value to a time value determined by compensating for a second time value which is used when the timer starts. The timer starts when a first Transmission Sequence Number (TSN) of a received data packet is greater than a TSN of a data packet which is expected to be received immediately after data packets received already and when the timer is not in an active state. The timer expires at a point of time when the second time value lapses. The timer stops when a data packet with the same TSN as the first TSN is sent as a reassembly entity before the expiring of the timer. The timer restarts when a received data packet which cannot be sent as the reassembly entity is buffered in a buffer after the stopping or the expiring of the timer. | 07-14-2011 |
Dong-Kil Kang, Hwaseong-Si KR
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20080202587 | SYSTEM AND METHOD TO SUPPLY CHEMICAL DURING SEMICONDUCTOR DEVICE FABRICATION - Disclosed are a system and method for supplying chemical during a semiconductor device fabrication process. The system includes a tank to store the chemical, a dispensing unit to hold the chemical, a refill line connected between the tank and the dispensing unit to supply the chemical from the tank to the chemical liquid dispensing unit, and a dispensing line connected between the chemical dispensing unit and a semiconductor substrate to supply the chemical from the chemical dispensing unit to the semiconductor substrate. | 08-28-2008 |
Dongsoo Kang, Hwaseong-Si KR
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20100318727 | MEMORY SYSTEM AND RELATED METHOD OF LOADING CODE - A memory system comprises a processor, a main memory comprising a volatile random access memory (RAM) that stores data to be accessed by the processor and a nonvolatile memory that provides a swap space for the RAM, and a disk that provides data transfer to the RAM with a greater latency than the nonvolatile memory. | 12-16-2010 |
20150081989 | SEMICONDUCTOR DEVICES INCLUDING APPLICATION PROCESSOR CONNECTED TO HIGH-BANDWIDTH MEMORY AND LOW-BANDWIDTH MEMORY, AND CHANNEL INTERLEAVING METHOD THEREOF - A memory system includes a high-bandwidth memory device, the high-bandwidth memory device having a relatively high operation bandwidth, the high-bandwidth memory device having a plurality of access channels. A low-bandwidth memory device has a relatively low operation bandwidth relative to the high-bandwidth memory device, the low-bandwidth memory device having one or more access channels. An interleaving unit performs a memory interleave operation among the plurality of access channels of the high-bandwidth memory device and an access channel of the one or more access channels of the low-bandwidth memory device. | 03-19-2015 |
Dong-Soo Kang, Hwaseong-Si KR
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20110007583 | Semiconductor memory device and internal data transmission method thereof - In a semiconductor memory device and an internal data transmission method thereof, the device includes a memory controller, a pair of data lines, and a plurality of memory banks. During an internal data transmission operation, the memory controller externally receives and stores a source address and a target address in response to an externally applied command and outputs an internal control signal and an internal address signal using the source address and the target address. The internal control signal includes an internal write signal and an internal read signal. Transmission data is transmitted on the pair of data lines during the internal data transmission operation. The plurality of memory banks read the transmission data stored in a region corresponding to the source address in response to the internal read signal, transmit the transmission data on the pair of data lines, and write the transmission data transmitted on the pair of data lines in response to the internal write signal. During the internal data transmission operation, the transmission data is transmitted from the region corresponding to the source address to a region corresponding to the target address, and is not output external to the semiconductor memory device | 01-13-2011 |
20140040541 | METHOD OF MANAGING DYNAMIC MEMORY REALLOCATION AND DEVICE PERFORMING THE METHOD - A method of managing dynamic memory reallocation includes receiving an input address including a block bit part, a tag part, and an index part and communicating the index part to a tag memory array, receiving a tag group communicated by the tag memory array based on the index part, analyzing the tag group based on the block bit part and the tag part and changing the block bit part and the tag part based on a result of the analysis, and outputting an output address including a changed block bit part, a changed tag part, and the index part. | 02-06-2014 |
20140149652 | MEMORY SYSTEM AND METHOD OF MAPPING ADDRESS USING THE SAME - In one example embodiment, a memory system includes a memory module and a memory controller. The memory module is configured generate density information of the memory module based on a number of the bad pages of the memory module, the bad pages being pages that have a fault. The memory controller is configured to map a continuous physical address to a dynamic random access memory (dram) address of the memory module based on the density information received from the memory module. | 05-29-2014 |
20150049570 | MEMORY DEVICE, MEMORY SYSTEM INCLUDING THE SAME, OPERATING METHOD THEREOF - In one embodiment, the memory device includes at least one memory bank including first and second subbanks, and control logic configured to control storing data into the memory bank. The control logic is configured to activate the first subbank and to precharge the second subbank in response to a first activate command for the first subbank. | 02-19-2015 |
Eung Cheon Kang, Hwaseong-Si KR
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20080211488 | Rotary manipulation type input apparatus - A rotary manipulation type input apparatus is disclosed. The rotary manipulation type input apparatus including a rotatable wheel; a magnet joined to the bottom of the wheel; a printed circuit board having one or more detection elements mounted thereon, the detection elements detecting a rotation of the magnet; a base having the printed circuit board joined thereto; and a holder joined to the base and supporting the wheel such that the wheel is rotatable, where the holder includes a body portion, an inclination portion extending in a particular angle from the body portion, and a securing portion extending from an end of the inclination portion and joined to the base, and the inclination portion is made of metal, has a reduced thickness and has superior endurance to external impact. | 09-04-2008 |
20090071808 | Rotary input apparatus - A rotary input apparatus is disclosed. A rotary input apparatus that includes a wheel which inputs information by rotation; a holder which rotatably supports the wheel; a tooth or teeth formed on any one of the wheel and the holder; and a flat spring which is supported by the other of the wheel and the holder and which catches onto the tooth to elastically support the wheel in the direction of rotation, utilizes a simple structure to allow smooth operation while implementing a clicking sensation for each section. | 03-19-2009 |
20090078551 | Rotary input apparatus - A rotary input apparatus is disclosed. The rotary input apparatus may include a wheel, a cover having a center hole that exposes the wheel to the exterior, and a sheet interposed between the wheel and the cover, where the wheel may include a flange portion formed on a periphery of the wheel. A holding groove may be formed in the flange portion, and a protrusion protruding upwards may be formed on the flange portion. The cover may include an insertion portion formed on a periphery of the center hole. The insertion portion may protrude downwards and may be placed in the holding groove. The sheet may be in contact with both the protrusion and the insertion portion. This rotary input apparatus can stop foreign substances from infiltrating the interior of the rotary input apparatus. | 03-26-2009 |
20090301855 | ROTATABLE INPUTTING APPARATUS - Disclosed herein is a rotatable inputting apparatus. When a circuit board of the rotatable inputting apparatus is coupled to a main circuit board of a terminal or remote control, the rotatable inputting apparatus of the invention allows reference points of the boards to be instinctively recognized without the necessity of forming reference projections or using screws, thus enabling its easy assembly. The rotatable inputting apparatus includes a wheel having a ring magnet, a support having a pressure pin, a center key moving in a vertical direction, a dome seat including a central dome button and peripheral dome buttons, a circuit board to which the dome seat is attached, and a connecting guide which is secured to the circuit board and has a connecting part. The connecting part passes through the circuit board and is inserted into the main circuit board. | 12-10-2009 |
Eun-Jin Kang, Hwaseong-Si KR
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20120249542 | ELECTRONIC APPARATUS TO DISPLAY A GUIDE WITH 3D VIEW AND METHOD THEREOF - An electronic apparatus includes a storage unit which stores therein a guide program regarding the electronic apparatus, a display unit which displays a three dimensional (3D) view of the electronic apparatus and a tag regarding a hardware component appearing on the 3D view when the guide program is executed, an input unit which receives a user command directing to rotate the 3D view, and a control unit which rotates the 3D view according to the user command, and controls the display unit to display the tag regarding the hardware component appearing on the rotated 3D view. | 10-04-2012 |
Eun Ju Kang, Hwaseong-Si KR
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20100310944 | ELECTROLYTE OF HIGH TEMPERATURE PROPERTY AND OVERCHARGE-PREVENTION PROPERTY AND SECONDARY BATTERY EMPLOYED WITH THE SAME - Provided is a secondary battery electrolyte having improved high temperature properties and overcharge-prevention properties, particularly improved overcharge-prevention properties under high voltage/high current conditions, in conjunction with a minimized deterioration of the battery performance, by adding 3 to 5% 100 by weight of cyclohexyl benzene (CHB) and 0.2 to 1.5% by weight of 2-fluoro biphenyl (2-FBP) as overcharge-preventing additives to an electrolyte of a lithium secondary battery. | 12-09-2010 |
Geun Kang, Hwaseong-Si KR
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20110265343 | CLOTHES DRYER AND CONTROL METHOD THEREOF - Disclosed herein are a clothes dryer and a control method thereof in which a drying time is adjusted according to wool content during a drying cycle of a wool course. Wool content of woolen textiles is judged by sensing a dryness of the woolen textiles during a drying cycle of a wool course, and a drying time is adjusted according to the wool content, thereby minimizing contraction or deformation of the woolen textiles while satisfying the range of a target dryness set by wool mark standards. Further, only a high-capacity heater is driven during the drying cycle of the wool course, thereby allowing an internal temperature of a rotary drum to keep the optimum temperature without contraction or deformation of the woolen textiles. | 11-03-2011 |
20130340276 | CLOTHES DRYER AND CONTROL METHOD THEREOF - Disclosed herein are a clothes dryer and a control method thereof in which a drying time is adjusted according to wool content during a drying cycle of a wool course. Wool content of woolen textiles is judged by sensing a dryness of the woolen textiles during a drying cycle of a wool course, and a drying time is adjusted according to the wool content, thereby minimizing contraction or deformation of the woolen textiles while satisfying the range of a target dryness set by wool mark standards. Further, only a high-capacity heater is driven during the drying cycle of the wool course, thereby allowing an internal temperature of a rotary drum to keep the optimum temperature without contraction or deformation of the woolen textiles. | 12-26-2013 |
Gonsu Kang, Hwaseong-Si KR
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20120269498 | UNIT FOR SUPPORTING A SUBSTRATE AND APPARATUS FOR TREATING A SUBSTRATE WITH THE UNIT - A substrate treatment apparatus and a supporting unit are provided. The substrate treatment apparatus includes a chamber in which a substrate is processed; a supporting unit that is disposed in the chamber and is configured to support the substrate; and a heating member that is configured to apply heat to the substrate supported by the supporting unit. The supporting unit includes a plate; a plurality of supporting pins upwardly protruding from the plate; and at least one auxiliary pin upwardly protruding from the plate. A distance between a central point of the plate and the at least one auxiliary pin is different from a distance between the central point of the plate and the supporting pins. | 10-25-2012 |
20130171744 | METHODS OF THERMALLY TREATING A SEMICONDUCTOR WAFER - A method of thermally treating a wafer includes loading a wafer into a process chamber having one or more regions of uniform temperature gradient and one or more regions of non-uniform temperature gradient. A defect is detected in the wafer. The wafer is aligned to position the defect within one of the one or more regions of uniform temperature gradient. A rapid thermal process is performed on the wafer in the process chamber while the defect is positioned within one of the one or more regions of uniform temperature gradient. | 07-04-2013 |
Gyung Yeun Kang, Hwaseong-Si KR
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20100170276 | Switch assembly and air conditioner having the same - Disclosed herein are a switch assembly and an air conditioner having the same. A switch and a circuit board of the switch assembly are detachably coupled to each other, thus resulting in enhanced maintenance and workability. The switch assembly includes a switch to sense an electrical signal of a human body, a conductive connector to provide the switch with an elastic force, and a circuit board adapted to receive the electrical signal through the connector so as to perform a control operation. The circuit board is detachably coupled with the switch. | 07-08-2010 |
Hee-Beom Kang, Hwaseong-Si KR
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20090033804 | METHOD FOR FORMATTING DIGITAL BROADCAST TRANSPORT STREAM PACKET FOR IMPROVED RECEIVING PERFORMANCE, DIGITAL BROADCAST TRANSMITTER, AND SIGNAL PROCESSING METHOD THEREOF - A method of formatting a digital broadcast transport stream packet, a digital broadcast transmitter, and a signal processing method thereof, includes constructing a transport stream packet that includes a stuffing region for an insertion of a known supplementary reference signal (SRS) data therein, randomizing the packet that includes the stuffing region is randomized, and the SRS data is inserted into the stuffing region of the randomized packet. Adding a parity for an error correction to the packet into which the SRS data has been inserted, the packet to which the parity has been added is interleaved, and a trellis encoding of the interleaved packet is performed. Inserting a segment sync signal and a field sync signal into the trellis-encoded packet, and a vestigial side band (VSB) modulation and an RF conversion of the packet are performed to transmit the VSB-modulated and RF-converted packet. | 02-05-2009 |
20090040392 | METHOD FOR FORMATTING DIGITAL BROADCAST TRANSPORT STREAM PACKET FOR IMPROVED RECEIVING PERFORMANCE, DIGITAL BROADCAST TRANSMITTER, AND SIGNAL PROCESSING METHOD THEREOF - A method of formatting a digital broadcast transport stream packet, a digital broadcast transmitter, and a signal processing method thereof, includes constructing a transport stream packet that includes a stuffing region for an insertion of a known supplementary reference signal (SRS) data therein, randomizing the packet that includes the stuffing region is randomized, and the SRS data is inserted into the stuffing region of the randomized packet. Adding a parity for an error correction to the packet into which the SRS data has been inserted, the packet to which the parity has been added is interleaved, and a trellis encoding of the interleaved packet is performed. Inserting a segment sync signal and a field sync signal into the trellis-encoded packet, and a vestigial side band (VSB) modulation and an RF conversion of the packet are performed to transmit the VSB-modulated and RF-converted packet. | 02-12-2009 |
20090074081 | METHOD FOR FORMATTING DIGITAL BROADCAST TRANSPORT STREAM PACKET FOR IMPROVED RECEIVING PERFORMANCE, DIGITAL BROADCAST TRANSMITTER, AND SIGNAL PROCESSING METHOD THEREOF - A method of formatting a digital broadcast transport stream packet, a digital broadcast transmitter, and a signal processing method thereof, includes constructing a transport stream packet that includes a stuffing region for an insertion of a known supplementary reference signal (SRS) data therein, randomizing the packet that includes the stuffing region is randomized, and the SRS data is inserted into the stuffing region of the randomized packet. Adding a parity for an error correction to the packet into which the SRS data has been inserted, the packet to which the parity has been added is interleaved, and a trellis encoding of the interleaved packet is performed. Inserting a segment sync signal and a field sync signal into the trellis-encoded packet, and a vestigial side band (VSB) modulation and an RF conversion of the packet are performed to transmit the VSB-modulated and RF-converted packet. | 03-19-2009 |
Hwan Jun Kang, Hwaseong-Si KR
Patent application number | Description | Published |
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20110080515 | Camera module - The present invention relates to a camera module assembled by using a connector. The present invention provides a camera module including: a main substrate having an image sensor mounted on an upper surface and a connector insertion groove formed at one side of the image sensor; a plurality of connectors mounted in a row in the connector insertion groove; a housing mounted on the main substrate and having a lens barrel vertically movably coupled therein; a flexible printed circuit board mounted to surround an outer peripheral surface of the housing while being electrically connected to a lens transfer device coupled to one side of the housing; and a shield case coupled to the outer peripheral surface of the housing. Since it is possible to minimize a distance between pads which are connectable through the connector, there is an advantage of miniaturizing the camera module as a whole by size reduction of the main substrate. | 04-07-2011 |
Hyun-Il Kang, Hwaseong-Si KR
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20080198066 | Apparatus and method for calibrating signal in multi-antenna system - A calibration apparatus and method for use in a transmitting end of a multi-antenna system. The apparatus comprises at least two antennas, at least two transmitters for transmitting a signal through one of the antennas and transmitting a reference signal for channel estimation of transmission and reception paths, at least two receivers for receiving a signal through one of the antennas and coupling and receiving a reference signal transmitted through one of the antennas except the antenna for receiving the signal, and a calibration section for estimating channels for transmission and reception paths of the transmitters and the receivers using reference signals received by the receivers and calibrating signals to be transmitted through the transmission paths using the estimated channels. | 08-21-2008 |
20090104884 | Apparatus and method for receiving signal in multiple input multiple output system - A receiving apparatus and method of a Multiple Input Multiple Output (MIMO) system are provided. The receiving apparatus includes a clock generation/delay compensation unit for generating a clock, an antenna switching unit for temporally dividing signals received through multiple antennas by performing switching according to the clock, a radio frequency (RF) chain to be shared for converting the temporally divided signals into baseband signals, and an analog to digital converter (ADC) to be shared for converting the converted signals into digital signals and for outputting the converted signals according to the clock. Accordingly, the number of RF chains used to implement a MIMO RFIC is reduced. | 04-23-2009 |
Hyun-Jo Kang, Hwaseong-Si KR
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20130078658 | METHOD OF QUANTIFYING RECOVERY RATE OF EXOSOME - A recombinant exosome comprising a fusion protein of a membrane protein and light-emitting protein, and a method of determining an exosome recovery rate by using the recombinant exosome are provided. Use of the method ensures accurate quantification of exosomes in a sample, and thus, improves the efficiency of an exosome-based diagnosis. | 03-28-2013 |
Hyun-Joon Kang, Hwaseong-Si KR
Patent application number | Description | Published |
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20110131350 | ASYNCHRONOUS UPSIZING CIRCUIT IN DATA PROCESSING SYSTEM - An asynchronous upsizing circuit in a data processing system. The asynchronous upsizing circuit includes an asynchronous packer and an asynchronous unpacker. The asynchronous packer includes a write buffer commonly used for an asynchronous bridge and for upsizing and for buffering a write channel data; and first and second asynchronous packing controllers controlling channel compaction according to first and second clocks, respectively, regarding the write channel data inputted/outputted to/from the write buffer during a burst write operation. The asynchronous unpacker includes a read buffer commonly used for an asynchronous bridge and for upsizing and for buffering a read channel data; and first and second asynchronous unpacking controllers controlling channel compaction according to the first and second clocks, respectively, regarding the read channel data inputted/outputted to/from the read buffer during a burst read operation. | 06-02-2011 |
20120089758 | System On Chip Keeping Load Balance And Load Balancing Method Thereof - At least one example embodiment discloses a System on Chip (SoC). The SoC includes a master block, a plurality of slave blocks configured to operate in response to a request from the master block, and an interconnect block configured to deliver transactions occurring in the master block to the plurality of slave blocks through a plurality of transfer paths. The interconnect block is configured to monitor load information of the plurality of transfer paths and select one of the plurality of transfer paths according to the load information. | 04-12-2012 |
20120117286 | Interface Devices And Systems Including The Same - An interface device includes a transaction management unit, a buffer unit and a selection circuit. The transaction management unit selectively splits a transaction of a master device into a first sub-transaction and at least one remaining sub-transaction based on a size of the transaction. The buffer unit stores the remaining sub-transaction. The selection circuit selects one of the first sub-transaction and an output of the buffer unit in response to a select control signal. | 05-10-2012 |
20120131246 | SYSTEM-ON-CHIP AND DATA ARBITRATION METHOD THEREOF - A system-on-a-chip semiconductor device comprises a first master device configured to issue a request having a transaction ID, a plurality of slave devices configured to provide data in response to the request, and an interconnector configured to include a slave interface for providing the request to one or more master interfaces and for supplying response data to the first master device based on operation characteristics of the first master. | 05-24-2012 |
20120246368 | SYSTEM ON CHIP IMPROVING DATA TRAFFIC AND OPERATING METHOD THEREOF - A system on chip (SoC) includes a first master, a slave, a bus switch transmitting a first command of the master and a first response of the slave, and a first priority controller connected between the first master and the bus switch The first priority controller measures at least one of first bandwidth and first latency based on the first command and the first response and adjusts the priority of the first command according to at least one of the measurement results. | 09-27-2012 |
Hyun-Ju Kang, Hwaseong-Si KR
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20130011931 | POLYMER INCLUDING GROUP HAVING AT LEAST TWO HYDROXYLS OR ZWITTERIONIC GROUP AND USE THEREOF - A solid support comprising a polymer that includes a group having at least two hydroxyls or a zwitterionic group and a method of using the same. | 01-10-2013 |
20130157300 | METHODS OF QUANTIFYING EXOSOME IN CELL CULTURE AND METHOD OF INCREASING RECOVERY RATE OF EXOSOME USING THE SAME - A method of detecting and recovering of exosomes in a sample, as well as a method of determining the recovery rate of exosomal recovery, and a method of screening for a material that induces secretion of the exosomes in a sample, which methods employ the use of a protease. | 06-20-2013 |
20140080131 | COMPOSITION AND KIT FOR ISOLATING VESICLES AND METHOD OF ISOLATING THE VESICLES USING THE SAME - The invention provides compositions, kits, and methods for analyzing vesicles or vesicle proteins, glycoproteins, lipids or nucleic acids, and may be used for screening ligands that have a binding affinity to vesicles. | 03-20-2014 |
20140080136 | COMPOSITIONS, KITS, AND METHODS FOR DETECTING AND ANALYZING VESICLES - Provided are compositions, kits, and methods for detecting a vesicle comprising a membrane permeable marker that is converted into a detectable marker inside the vesicle. | 03-20-2014 |
20140099652 | COMPOSITION FOR MONITORING VESICLE, KIT AND METHOD OF MONITORING VESICLE USING THE SAME - Provided is a method of monitoring a vesicle in a sample, including contacting a vesicle in a sample with a membrane permeable marker that is converted into a detectable marker in the vesicle, measuring a signal of the detectable marker, and monitoring the vesicle based on the measured signal. | 04-10-2014 |
20140178885 | COMPOSITION AND KIT FOR DIAGNOSING BREAST CANCER INCLUDING POLYNUCLEOTIDE WITHIN VESICLE, AND METHOD OF DIAGNOSING BREAST CANCER USING THE SAME - A breast cancer diagnostic composition and kit, and methods of diagnosing breast cancer or acquiring information for breast cancer diagnosis by using the composition or kit are provided. The composition or kit includes a polynucleotide that is the same as or complementary to at least one microRNA (miRNA) selected from the group consisting of hsa-miR-126, hsa-miR-23a, hsa-miR-24, hsa-miR-19b, hsa-miR-103, hsa-miR-142-3p, hsa-miR-144, hsa-miR-15a, hsa-miR-185, hsa-miR-93, and hsa-miR-30c in a vesicle, or a fragment of the microRNA. | 06-26-2014 |
20140377779 | COMPOSITION FOR DIAGNOSING BREAST CANCER INCLUDING MATERIAL SPECIFICALLY BINDING TO POLYMERIC IMMUNOGLOBULIN RECEPTOR PROTEIN OR FRAGMENT THEREOF, AND METHOD OF DIAGNOSING BREAST CANCER BY USING THE COMPOSITION - A composition for breast cancer diagnosis using a material specifically binding to a polymeric immunoglobulin receptor (PIGR) or a fragment thereof, and a method for detecting breast cancer or acquiring information for breast cancer diagnosis using the composition. | 12-25-2014 |
Im-Soo Kang, Hwaseong-Si KR
Patent application number | Description | Published |
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20110298590 | APPARATUS COMPRISING DISPLAY DRIVING INTEGRATED CIRCUIT AND RADIO-FREQUENCY IDENTIFICATION READER - A display driving integrated circuit operates as both a radio-frequency identification (RFID) reader and a display driver. The display driving integrated circuit operates as the RFID reader by supplying power to an RFID tag, verifying the RFID tag according to communication between the RFID tag and the processor to produce verification data, transferring the verification data from the processor to the RFID tag, and transmitting some of the verification data to the display unit. It operates as a display driver by processing data received from the processor and transferring the processed data to the display unit. The display driving integrated circuit implements functions for the RFID reader and the display unit driver using one or more shared elements selected from a timer, a clock signal generator, a cyclic redundancy check calculator, and a data interface. | 12-08-2011 |
Jintae Kang, Hwaseong-Si KR
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20110134620 | MEMORY CARDS AND ELECTRONIC MACHINES - Provided is a memory card. The memory card includes interconnection terminals for electric connection with an external electronic machine. The interconnection terminals may be spaced from the front side of the memory card by a distance greater than the lengths of the interconnection terminals. Alternatively, the memory card may include other interconnection terminals between its front side and the former interconnection terminals. The former and latter interconnection terminals may be used for electric connection with different kinds of electronic machines. | 06-09-2011 |
Kiho Kang, Hwaseong-Si KR
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20110008957 | METAL INTERCONNECTION METHOD OF SEMICONDUCTOR DEVICE - A metal interconnection method of a semiconductor device includes forming a copper layer on a semiconductor substrate and planarizing the copper layer. Two thermal treatments are performed at different temperatures between formation of the copper layer and planarization of the copper layer. | 01-13-2011 |
Kyoungho Kang, Hwaseong-Si KR
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20090139399 | APPARATUS AND METHOD FOR COLLECTING AND DETECTING AIRBORNE PARTICLES - An apparatus for collecting airborne particles includes a cyclone into which external air and an absorbing liquid are sprayed to absorb the airborne particles in the external air with the absorbing liquid, a reservoir in fluid communication with the cyclone and which stores the absorbing liquid to be sprayed into the cyclone as an absorbing liquid film, a collector in fluid communication with the cyclone and which collects the absorbing liquid film from the cyclone, and a feedback pipe in fluid communication with the collector and the reservoir and which transports the absorbing liquid film collected in the collector to the reservoir. | 06-04-2009 |
Kyoung-Ho Kang, Hwaseong-Si KR
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20090045054 | APPARATUS AND METHOD FOR ELECTROMAGNETICALLY DETECTING MICROORGANISM - An apparatus and a method for electromagnetically detecting microorganisms. The apparatus includes a pair of first electrodes which are positioned to be opposite to each other on a measuring cell and are connected to a power supply to generate an electric field around a solution contained in the measuring cell, a magnetic field generating unit which generates a magnetic field around the solution contained in the measuring cell in a perpendicular direction to the electric field, second electrodes which are positioned perpendicularly to both the electric field and the magnetic field, and a voltage measurer which measures the voltage generated between the second electrodes as the microorganisms move in the measuring cell. The apparatus determines the presence, quantity and identity of microorganisms with negative surface charge with improved sensitivity using the Hall effect. | 02-19-2009 |
20100125212 | METHOD AND APPARATUS FOR TESTING ACCURACY OF BLOOD PRESSURE MONITORING APPARATUS - A method for testing accuracy of blood pressure measurement in a blood pressure monitoring apparatus includes calculating a difference between measured blood pressures of a user measured at two or more measurement points, calculating a difference between hydrostatic pressures of blood estimated at the two or more measurement points, and calculating an error of the measured blood pressures. | 05-20-2010 |
20100179394 | METHOD AND APPARATUS FOR DISPLAYING BIO-INFORMATION - A method of displaying bio-information on a screen includes outputting basic bio-information of a plurality of bio-parameters indicating a condition of a patient on one display screen, determining an occurrence of an event related to the plurality of bio-parameters, converting the basic bio-information into detailed bio-information about one of the plurality of bio-parameters based on a result of the determining an occurrence of an event, and outputting the converted detailed bio-information on the one display screen. | 07-15-2010 |
20100286538 | APPARATUS AND METHOD FOR MEASURING BLOOD PRESSURE - A blood pressure measuring apparatus includes a sensing unit including a plurality of sensors sensing sphygmus waves at a measurement site, a selection unit selecting one sensor of the plurality of sensors based on the sphygmus waves sensed by the plurality of sensors, and a blood pressure estimation unit estimating blood pressure of the measurement site based on a sphygmus wave sensed by the selected sensor. | 11-11-2010 |
Mi-Kyeong Kang, Hwaseong-Si KR
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20100306491 | Data storage device - A data storage device capable of improving reading and writing performance includes at least one memory chip comprising a control unit and a plurality of blocks for storing data, and communicating with a host through a channel; and memory storing data output from the at least one memory chip. The control unit may sequentially read data having continuous logic addresses and discontinuous physical addresses from the plurality of blocks and store the data in the memory to have continuous physical addresses. | 12-02-2010 |
Myung-Sung Kang, Hwaseong-Si KR
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20130032947 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package that stably protects an internal semiconductor chip from external shocks, and a method of manufacturing the semiconductor package is disclosed. The semiconductor package includes a first semiconductor chip including a first body layer having a first surface, a second surface, and a lateral surface between the first surface and the second surface, and a first protective layer that exposes an edge portion of the first surface and forms a step difference with the first surface; an encapsulation structure that covers a lateral surface of the first body layer and the edge portion of the first surface so as to encapsulate the first semiconductor chip to have a locking structure; and a first conductive terminal formed on the first body layer through the protective layer. | 02-07-2013 |
20130258188 | BI-DIRECTIONAL CAMERA MODULE AND FLIP CHIP BONDER INCLUDING THE SAME - Bi-directional camera modules and flip chip bonders including the same are provided. The module includes a circuit board on which an upper sensor and a lower sensor are mounted, an upper lens and a lower lens disposed on the upper sensor and under the lower sensor, respectively, and a housing fixing the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively. The housing surrounds the circuit board. The housing has a plurality of inlets and an outlet through which air flows, and the housing has an air passage connected from the inlets to the outlet via a space between lower lens and the lower sensor. | 10-03-2013 |
Nam Wook Kang, Hwaseong-Si KR
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20130073798 | FLASH MEMORY DEVICE AND DATA MANAGEMENT METHOD - Disclosed is a data management method for a flash storage device. The method includes collecting cold data stored in the flash memory device with reference to a cold list table, compressing the collected cold data, and then storing the compressed cold data in the flash memory. | 03-21-2013 |
20130117630 | METHOD OF ENHANCING ERROR CORRECTION PERFORMANCE AND STORAGE DEVICE USING THE METHOD - A method of enhancing an error correction performance in a data storage system, and a storage device using the method, determines a deterioration status of a physical area of a memory device to which data is to be stored and compresses data and stores the compressed data and an error correction code (ECC) with respect to the compressed data in an area of which the deterioration status is equal to or greater than a threshold value that is initially set and stores uncompressed data and an ECC with respect to the uncompressed data in an area of which the deterioration status is less than the threshold value. | 05-09-2013 |
Sangbeom Kang, Hwaseong-Si KR
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20100103724 | Variable Resistance memory device - The variable resistance memory device may include a memory cell array including a plurality of memory blocks, a bit line selection circuit including a plurality of bit lines connected to the plurality of memory blocks, at least one readout Y-pass driver configured to control a connection of the bit line selection circuit when a readout operation is performed, and a write Y-pass driver configured to control a connection of the bit line selection circuit when a write operation is performed. The write Y-pass driver is configured to control at least two of the plurality of bit lines connections. | 04-29-2010 |
20120299133 | MAGNETIC DEVICES AND METHODS OF FABRICATING THE SAME - Magnetic devices and methods of fabricating the same are provided. According to the magnetic device, a tunnel barrier pattern is interposed between a first magnetic pattern and a second magnetic pattern. An edge portion of the tunnel barrier pattern is thicker than a central portion of the tunnel barrier pattern. The central portion of the tunnel barrier pattern has a substantially uniform thickness. | 11-29-2012 |
Sangchul Kang, Hwaseong-Si KR
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20120113733 | Nonvolatile Memory Devices With On Die Termination Circuits And Control Methods Thereof - Non-volatile memory devices including on-die termination circuits connected to an input/output circuit and an on-die termination control logic detecting a preamble of a strobe signal based on a command and a control signal and activating the on-die termination within the preamble period. | 05-10-2012 |
20120218817 | NONVOLATILE MEMORY DEVICE, MEMORY SYSTEM INCLUDING THE SAME, AND METHOD OF OPERATING NONVOLATILE MEMORY DEVICE - A non-volatile memory device includes a non-volatile memory cell array including a plurality of word lines, a voltage generator configured to generate a first high-voltage using a supply voltage and a second high-voltage using an external voltage which is higher than the supply voltage, and a word line selection circuit configured. The word line selection circuit is configured apply, during a program operation of the memory cell array, the first high-voltage to a selected word line among the plurality of word lines, and the second high-voltage to unselected word lines among the plurality of word lines | 08-30-2012 |
20150036435 | NONVOLATILE MEMORY DEVICE, MEMORY SYSTEM INCLUDING THE SAME, AND METHOD OF OPERATING NONVOLATILE MEMORY DEVICE - A non-volatile memory device includes a non-volatile memory cell array including a plurality of word lines, a voltage generator configured to generate a first high-voltage using a supply voltage and a second high-voltage using an external voltage which is higher than the supply voltage, and a word line selection circuit configured. The word line selection circuit is configured apply, during a program operation of the memory cell array, the first high-voltage to a selected word line among the plurality of word lines, and the second high-voltage to unselected word lines among the plurality of word lines | 02-05-2015 |
Sang Chul Kang, Hwaseong-Si KR
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20090147574 | Flash Memory Device for Determining Most Significant Bit Program - A flash memory device capable of efficiently determining whether most significant bit (MSB) programming has been performed is provided. The flash memory device includes a cell array, a control unit, and a determination unit. The cell array includes at least one flag cell for storing information about whether MSB programming has been performed on a multi-level cell. The control unit controls a program operation, a read operation, and an erasure operation with respect to the cell array. The determination unit receives flag data stored in the flag cells, performs an OR operation and/or an AND operation on the flag data, and generates a determination signal based on a result of the OR operation and/or the AND operation, wherein the determination signal represents whether the MSB programming has been performed. | 06-11-2009 |
20110066899 | NONVOLATILE MEMORY SYSTEM AND RELATED METHOD OF PERFORMING ERASE REFRESH OPERATION - A memory system comprises a flash memory and a memory controller. The flash memory comprises a plurality of memory blocks. The memory controller performs a read retry operation on a memory block containing an uncorrectable read error until an accurate data value is read from the memory block. The memory controller then controls the flash memory to perform an erase refresh operation on the memory block. | 03-17-2011 |
20120213003 | NON-VOLATILE MEMORY DEVICE AND RELATED READ METHOD - A nonvolatile memory device comprises a memory cell array, a page buffer, and a bit line connection signal controller. The memory cell array comprises a plurality of word lines and bit lines arranged in rows and columns, and a plurality of memory cells connected to the respective word lines and bit lines. The page buffer connects a selected bit line among the plurality of bit lines to the page buffer, applies a precharge voltage to the selected bit line, and senses a voltage of the selected bit line after developing of the selected bit line according to a bit line connection signal, during a read operation. The bit line connection signal controller changes the bit line connection signal according to a control signal, during the read operation. | 08-23-2012 |
20120213004 | NON-VOLATILE MEMORY DEVICE AND RELATED READ METHOD - A nonvolatile memory device comprises a memory cell array and a voltage generator. The memory cell array comprises a plurality of memory cells connected in series between a string selection transistor connected to a bit line and a ground selection transistor connected to a source line. The voltage generator provides read voltages to word lines of memory cells selected from among the plurality of memory cells during a read operation. The read voltages of the selected memory cells differ from each other according to their respective distances from the string selection transistor. | 08-23-2012 |
20140321209 | NON-VOLATILE MEMORY DEVICE AND RELATED READ METHOD - A nonvolatile memory device comprises a memory cell array and a voltage generator. The memory cell array comprises a plurality of memory cells connected in series between a string selection transistor connected to a bit line and a ground selection transistor connected to a source line. The voltage generator provides read voltages to word lines of memory cells selected from among the plurality of memory cells during a read operation. The read voltages of the selected memory cells differ from each other according to their respective distances from the string selection transistor. | 10-30-2014 |
Sang-Gu Kang, Hwaseong-Si KR
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20100148811 | Probe card, and apparatus and method for testing semiconductor device using the probe card - A probe card transmitting electrical test signals between a tester and a semiconductor device includes a main circuit board configured to receive and transmit electrical signals from the tester, an interface unit electrically connected to the main circuit board, the interface unit including a signal line and a signal connection terminal, and at least one probe unit connected to the interface unit, the probe unit being detachable and including a plurality of probe needles arranged in a pattern corresponding to a pattern of electrode pads of the semiconductor device. | 06-17-2010 |
Sang Hoon Kang, Hwaseong-Si KR
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20080303589 | HIGH-ORDER LOW-PASS FILTER CIRCUIT AND METHOD - A low-pass filtering circuit and method are disclosed. The circuit includes a low-pass filter with a capacitor, and a multiplier configured to multiply the capacitance of the capacitor by feeding-back a high-frequency signal apparent in an output signal of the low-pass filter to the capacitor. | 12-11-2008 |
Sang Kyu Kang, Hwaseong-Si KR
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20120073287 | TURBOCHARGER HAVING ANTI-SURGE VALVE - A turbocharger having an anti-surge valve may include a compressor that may be disposed at an intake line to compress intake air, and the anti-surge valve that selectively fluid-connects the downstream and the upstream of the compressor to circulate the intake air from the downstream to the upstream of the intake line, wherein a passage communicating with the downstream of the intake line may be formed in the anti-surge valve and the intake air flowing through the passage may be supplied to an edge portion outside a rotation center of a blade of the compressor. | 03-29-2012 |
20120117964 | INTAKE SYSTEM OF ENGINE - An intake system of an engine may include an intake line that is configured to supply cylinder of an engine with air, an exhaust line that exhaust gas combusted in the cylinder is exhausted, a housing disposed on the intake line and a compressor is disposed therein, the compressor is operated by a turbine disposed on an exhaust line, a recirculation line that recirculates the air from the intake line of a downstream side of the compressor to the intake line of an upstream side of the compressor, and an anti surge valve disposed on the recirculation line to open/close the recirculation line, wherein a length of a first section (l) that is straight from the anti surge valve is longer than two times the outlet diameter (d) of the anti surge valve in the recirculation line that is formed from the anti surge valve to an upstream side of the compressor. | 05-17-2012 |
Seok-Myong Kang, Hwaseong-Si KR
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20090032292 | PRINTED CIRCUIT BOARD REINFORCEMENT STRUCTURE AND INTEGRATED CIRCUIT PACKAGE USING THE SAME - A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board. | 02-05-2009 |
20100011573 | METHOD FOR FABRICATING PRINTED CIRCUIT BOARD - A method for fabricating a printed circuit board is provided. The method includes manufacturing a base film including a first side and a second side opposite to the first side; printing a first wiring on the first side with a high-viscosity conductive material having a viscosity of 5,000 to 300,000 centipoise (CPS); forming a via-hole that passes through both sides of the base film, and passes by the first wiring; and printing a second wiring on the second side with a low-viscosity conductive material having a viscosity of 100 to 5,000 CPS. The low-viscosity conductive material is applied to an inner wall of the via-hole to conductively connect the first wiring to the second wiring. | 01-21-2010 |
20110155426 | EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates. | 06-30-2011 |
20110157858 | SYSTEM-IN-PACKAGE HAVING EMBEDDED CIRCUIT BOARDS - Provided is a System-In-Package (SIP) having embedded circuit boards in which boards are electrically connected and a plurality of chips are embedded in a board in a stacked manner. The SIP includes a first board on a surface of which a first circuit is formed, a second board which is provided on a top surface of the first board in a stacked manner and includes a plurality of chips embedded therein in a stacked manner, and a third board which is provided on a top surface of the second board in a stacked manner and on a surface of which a second circuit is formed. | 06-30-2011 |
20130063391 | RESISTIVE OVERLAY-TYPE TOUCH SENSOR FOR TOUCH SCREEN PANEL AND METHOD FOR FABRICATING THE SAME - A resistive overlay-type touch sensor for a touch screen panel and a method for fabricating the same are provided, in which a plurality of first substrates are extended in parallel along a first direction, a plurality of second substrates are extended in parallel along a second direction perpendicular to the first direction, and a plurality of transparent electrodes are formed on the first and second substrates. The second substrates intersect with the first substrates, each second substrate facing alternately one and the other surfaces of the first substrates along the second direction, and each of the transparent electrodes on the first substrates faces one of the transparent electrodes on the second substrates. | 03-14-2013 |
20130100053 | FLEXIBLE DISPLAY DEVICE - Disclosed is a flexible display device adapted to accurately detect bending information when the flexible display device is flexed, bent or folded, and to be capable of variously controlling an image displayed on a screen on the basis of the detected bending information. The flexible display device includes a flexible touch screen part, and a bending detection part provided on the touch screen part, the bending detection part having an electrostatic capacitance or electric resistance that changes depending on a bending of the touch screen part, so as to detect bending information. | 04-25-2013 |
20140331781 | FLEXIBLE DEVICE, AND APPARATUS, METHOD AND COMPUTER-READABLE RECORDING MEDIUM FOR DETECTING SHAPE OF FLEXIBLE DEVICE - A flexible device including sensors for shape detection is provided. The flexible device includes a measurement unit including a plurality of bending sensors disposed along at least one edge of the flexible device, and configured to output measurement values sensed by the plurality of bending sensors, and a controller configured to detect a position of at least one curve point on the flexible device by receiving the sensed measurements values from the measurement unit, and to detect at least one bending line of the flexing device according to information about positions of curve points, which are detected on at least two different sides of the flexible device. | 11-13-2014 |
20150039259 | MOTION RECOGNITION METHOD AND APPARATUS - A apparatus for recognizing a motion of an object is disclosed. The apparatus comprises a camera configured to photograph images of the object having the motion, a plurality of pressure and position sensors configured to be installed on a floor and to measure a floor contact position, a floor contact area and a floor contact pressure of the object and a motion analyzer configured to analyze the motion of the object by combining two or more among the images, floor contact position, floor contact area and floor contact pressure of the object. | 02-05-2015 |
20150046179 | TERMINAL AND METHOD FOR PROVIDING HEALTH CONTENTS - The present disclosure relates to a terminal, and more particularly to a terminal and a method for providing health content. A method of providing health content using health information, includes receiving at least one piece of health information, comparing the received at least one piece of health information with a threshold value, and providing health content for a user to lessen a difference between the at least one piece of health information and the threshold value. | 02-12-2015 |
Seok Woo Kang, Hwaseong-Si KR
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20100286774 | ARTIFICIAL EARDRUM USING SILK PROTEIN AND METHOD OF FABRICATING THE SAME - Provided is an artificial eardrum using silk protein and a method of fabricating the same. The artificial eardrum is fabricated in the form of a silk membrane by desalinating and drying silk protein (or silk fibroin) or a silk protein complex solution obtained after removal of sericin from a silkworm cocoon or silk fiber. Thus, regeneration of an eardrum perforated due to disease or a sudden accident is stimulated, a boundary of the regenerated eardrum is clean and biocompatibility and transparency are increased. In addition, the artificial eardrum may be fabricated using the silk protein or silk protein complex solution obtained from a silkworm cocoon alone or mixed with collagen, alginic acid, PEG or pluronic 127. | 11-11-2010 |
Seong Hyuk Kang, Hwaseong-Si KR
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20090266328 | INTAKE MANIFOLD FOR VEHICLE - The present invention relates to an intake manifold for a vehicle and comprises tanks for stabilizing intaken air introduced from a throttle body; a plurality of zip tubes diverged from the tanks; a plurality of runners connected to the zip tubes and communicated with respective cylinders; and a adjustment apparatus provided at one side of the zip tubes and the runners for varying the diameter of the zip tube and the diameter of the runner according to an engine operation range. Due to the above structure, the diameter of the zip tube and the diameter of the runner can be varied continuously within the overall operating range of an engine by the adjustment apparatus. Hence, the performance of the engine can be enhanced. | 10-29-2009 |
Seong-Min Kang, Hwaseong-Si KR
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20090222456 | APPARATUS FOR STORING AND PROCESSING CONTENTS AND METHOD OF TRANSMITTING OBJECT META INFORMATION ON CONTENTS USING MEDIA TRANSFER PROTOCOL FROM THE APPARATUS - An apparatus for storing and processing contents and a method of transmitting object meta information on contents by using a media transfer protocol (MTP) in the apparatus includes selections for transmission a limited number of pieces of the object meta information according to a display status of a content reproduction apparatus receiving the transmission. Accordingly, since only a limited number of pieces of object meta information are selected according to a display status of the content reproduction apparatus, and only the selected pieces of object meta information are transmitted to the content reproduction apparatus, it is possible to minimize the MTP operation for transmitting the object meta information and to minimize transmission of data. As a result, an inconvenience to a user due to a latency time of an operation is reduced by reducing a delay time in a connection between devices. | 09-03-2009 |
20110087871 | CONSUMER ELECTRONIC DEVICE AND METHOD OF CONTROLLING A CONSUMER ELECTRONIC DEVICE - A method and apparatus for controlling a consumer electronics (CE) device, are provided. The method includes determining, when a touch is sensed, whether the touch corresponds to a booting request, and performing a booting operation when the touch is a booting request; and controlling the CE device to operate in a sleep mode when an operation start signal is not received until the booting operation is completed, and controlling the CE device to operate in a normal mode when an operation start signal is received before the booting operation is completed. The apparatus includes a touch sensing unit; which senses a touch to the CE device; a determining unit which determines whether the touch sensed by the touch sensing unit corresponds to a booting request; a booting unit, and a control unit controlling the CE device. | 04-14-2011 |
20120151082 | APPARATUS AND METHOD FOR PROVIDING STREAMING SERVICE IN A PORTABLE TERMINAL - An apparatus and method for providing a streaming service in a portable terminal are provided. The apparatus includes a communication unit, a memory unit, a display unit, a header analyzer, a state identifying unit, and a controller. The communication unit communicates with a streaming server and receives tracks constituting data. The memory unit stores the received tracks. The display unit reproduces and outputs the received tracks. The header analyzer identifies an array state of the tracks. The state identifying unit identifies a storage state of the stored tracks. The controller determines a change or non-change of a reception scheme of data, and receives the data in the determined data reception scheme. The data request unit sends a request for tracks to the streaming server. | 06-14-2012 |
Seunggon Kang, Hwaseong-Si KR
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20110199334 | RESISTIVE-FILM-BASED TOUCH-SENSITIVE SHEET, TOUCH-SENSITIVE PANEL, AND MANUFACTURING METHOD THEREOF - The present invention relates to a resistive-film-based touch-sensitive sheet, touch-sensitive panel, and manufacturing method thereof. Embodiments of the invention provide a touch-sensitive sheet used for manufacturing a resistive-film type touch panel that includes: a base film; a transparent insulative adhesive film, in which conductive balls are mixed, located over the base film; and a releasing paper adhered over the transparent insulative adhesive film, as well as an integrated type touch-sensitive sheet that includes: an upper board for a touch panel; an upper contact electrode patterned on the upper board; a transparent insulative adhesive film, in which conductive balls are mixed, located over the upper board and the upper contact electrode; and a releasing paper adhered over the transparent insulative adhesive film. | 08-18-2011 |
Seung Gon Kang, Hwaseong-Si KR
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20100118231 | LIQUID CRYSTAL DISPLAY DEVICE - Disclosed is an LCD. The LCD includes a first substrate, a second substrate facing the first substrate, a liquid crystal layer interposed between the first substrate and the second substrate, and a light source disposed at a lateral side of the second substrate to emit light toward the second substrate. According to the LCD, light is incident into the second substrate through a lateral side of the second substrate and an image is displayed by the incident light. Since the LCD does not require an additional light guide plate, the LCD can have a slim structure as compared with an existing LCD. | 05-13-2010 |
20120188488 | FIRST SUBSTRATE SHEET, LIQUID CRYSTAL PANEL HAVING FIRST SUBSTRATE SHEET AND METHOD FOR MANUFACTURING SAME - The present invention relates to a liquid crystal panel having the first substrate sheet. The object of the present invention can be accomplished by a liquid crystal capsule which is mixed with a binder and printed on one surface of the first substrate on which the transparent electrode is formed; a transparent adhesive applied to entirely cover the liquid crystal capsule and the binder printed on the first substrate; and a releasing sheet which is attached to entirely cover the transparent adhesive applied on the first substrate. | 07-26-2012 |
20120274620 | DATA WRITING APPARATUS FOR E-PAPER AND DATA WRITING METHOD USING THE SAME - There is provided a data writing apparatus for e-paper including a base unit on which the e-paper is provided and which applies a driving voltage corresponding to input data to the e-paper through an electrode array, and a first roller that is rotated around a central axis in a predetermined direction on the base unit and presses a part of the e-paper to be in contact with the base unit, wherein when the e-paper is pressed to be in contact with the base unit by the first roller, the base unit applies the driving voltage to the e-paper and data are written in the e-paper. | 11-01-2012 |
20120274648 | MEMORY-EFFECT DISPLAY DEVICE AND DRIVING METHOD THEREOF - There is provided a memory-effect display device including a memory-effect display, a data buffer unit that stores input data to be displayed on the memory-effect display, a buffer control unit that controls only some scan line data of input data of each frame to be stored in the data buffer unit, and a display control unit that controls the input data stored in the data buffer unit to be displayed at respective scan lines of the memory-effect display, wherein the display control unit controls only the some scan line data on the memory-effect display according to information of scan lines where the input data stored in the data buffer unit are to be assigned, and scan lines where the some scan line data are not assigned are maintained as they were displayed based on frame data before frame data containing the some scan line data are input. | 11-01-2012 |
20120274886 | REFLECTIVE LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - There is provided a reflective liquid crystal display device including a first liquid crystal panel containing a first liquid crystal material that reflects light of a first color, a second liquid crystal panel containing a second liquid crystal material that reflects light of a second color and a third liquid crystal material that reflects light of a third color, the second and third liquid crystal materials positioned to be distinct from each other, and a light absorption layer that is bonded to a lower surface of the second liquid crystal panel, wherein the second liquid crystal panel is bonded to a lower surface of the first liquid crystal panel, and the first to third liquid crystal materials reflect light in a planar state and transmit light in a focal conic state. | 11-01-2012 |
20120274887 | CHOLESTERIC LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - There is provided a cholesteric liquid crystal display device including a first liquid crystal panel containing a first cholesteric liquid crystal substancecrystal material for reflecting a light of a first color, a second liquid crystal panel containing a second cholesteric liquid crystal substancecrystal material for reflecting a light of a second color, a third liquid crystal panel containing a third cholesteric liquid crystal substancecrystal material for reflecting a light of a third color, a light absorption layer combined to a lower portion of the third liquid crystal panel, a first double-sided adhesive buffer layer configured to combine the second liquid crystal panel to a lower portion of the first liquid crystal panel and a second double-sided adhesive buffer layer configured to combine the third liquid crystal panel to a lower portion of the second liquid crystal panel. | 11-01-2012 |
Shin-Wook Kang, Hwaseong-Si KR
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20080301381 | DEVICE AND METHOD FOR CONTROLLING COMMANDS USED FOR FLASH MEMORY - A method and device for controlling commands used for a flash memory are provided. The method includes, substantially reducing usage of a central processing unit (CPU) and a bus, when controlling the flash memory, by receiving information on at least one command currently stored in a system memory, receiving a command represented by the received information from the system memory, and generating an interrupt representing that all the commands are received, when receiving of substantially all the commands represented by the received information is completed. | 12-04-2008 |
20090049464 | METHOD AND APPARATUS TO PURCHASE CONTENTS BY USING PORTABLE STORAGE MEDIUM OR VIA NETWORK - Users of a method and apparatus to purchase (e.g., rent or buy) contents using a portable storage medium, via a network or the like. Contents purchased using embodiments of a method and apparatus may be developed to be automatically deleted or to be non-reproducible after being reproduced one time or after a predetermined period. Accordingly, users do not need to return borrowed or purchased contents. Also an owner of a contents rental shop may prevent contents from being unfairly reproduced. Further, user inconvenience due to the conventional manner in which users have to memorize information related to the contents and visit a rental shop to obtain desired contents may be avoided or decreased. Portable storage mediums or network resources of exemplary methods and apparatuses may be repeatedly used (e.g., without limitation), and thus may contribute to the saving of resources. | 02-19-2009 |
20110249730 | METHOD AND APPARATUS FOR GENERATING VIDEO PACKETS, METHOD AND APPARATUS FOR RESTORING VIDEO - A method and apparatus for generating video packets and a method and apparatus for restoring video are provided. The method of generating video packets includes: generating at least one pixel block consisting of at least one reference pixel and a plurality of neighboring pixels adjacent to the at least one reference pixel from pixels of a video frame; replacing pixel values of the neighboring pixels in the at least one pixel block with pixel difference values, which are difference values between a pixel value of one of pixels adjacent to the neighboring pixels and the pixel values of the neighboring pixels; generating packets so that a pixel value of the at least one reference pixel and the pixel difference values of the neighboring pixels are allocated to different packets according to positions of the pixels; and performing entropy coding of some of the packets including the pixel difference values of the neighboring pixels. | 10-13-2011 |
20110274177 | METHOD AND APPARATUS FOR PROCESSING VIDEO FRAME BY USING DIFFERENCE BETWEEN PIXEL VALUES - A method and apparatus for processing a video frame is provided. The method includes dividing the video frame into pixel blocks each including a reference pixel; calculating difference values between the reference pixel and pixels neighboring the reference pixel; converting the calculated difference values into values that belong to a bit depth range; and performing entropy coding by using the converted difference values as symbols. | 11-10-2011 |
Soonnam Kang, Hwaseong-Si KR
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20100303362 | Image Data Processing Methods - Provided are image data processing methods. Such methods include obtaining image data with at least one bar pattern, detecting coordinates of an edge of the bar pattern, extracting an outline curve of the bar pattern by fitting the coordinates of the edge, setting a direction of a major axis by differentiating the outline curve of the bar pattern, rotating the image data to match the major axis with a reference axis, and extracting information of the bar pattern by processing the bar pattern of the rotated image data. | 12-02-2010 |
Sung Han Kang, Hwaseong-Si KR
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20110132297 | ELECTRO-HYDRAULIC VARIABLE VALVE LIFT APPARATUS - An electro-hydraulic variable valve lift apparatus may include a housing, a master portion which is slidably disposed to the housing and contacts a cam, a first oil supply portion which supplies hydraulic pressure, a slave piston which is slidably disposed within the housing and defines an oil chamber with the master portion, a latching portion which is supplied the hydraulic pressure from the first oil supply portion and selectively connects the slave piston and the master portion, a second oil supply portion which selectively supplies hydraulic pressure to the oil chamber so as to control relative distances between the master portion and the slave piston when the slave piston is disengaged with the master portion, and a stepped portion formed to the housing between the master portion and the slave piston to elastically support the master portion. | 06-09-2011 |
20110132299 | VARIABLE VALVE LIFT APPARATUS - A variable valve lift apparatus may include a variable valve lift housing, a master piston which is slidably disposed in the variable valve lift housing and contacts a cam, a slave piston which is slidably disposed in the variable valve lift housing, defines an oil chamber with the master piston therebetween, and opens a valve connected to the slave piston according to reciprocative motion of the master piston, and a lift control portion which supplies oil to the oil chamber or exhausts oil in the oil chamber selectively to control a relative distance between the master piston and the slave piston. | 06-09-2011 |
Sungho Kang, Hwaseong-Si KR
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20120269498 | UNIT FOR SUPPORTING A SUBSTRATE AND APPARATUS FOR TREATING A SUBSTRATE WITH THE UNIT - A substrate treatment apparatus and a supporting unit are provided. The substrate treatment apparatus includes a chamber in which a substrate is processed; a supporting unit that is disposed in the chamber and is configured to support the substrate; and a heating member that is configured to apply heat to the substrate supported by the supporting unit. The supporting unit includes a plate; a plurality of supporting pins upwardly protruding from the plate; and at least one auxiliary pin upwardly protruding from the plate. A distance between a central point of the plate and the at least one auxiliary pin is different from a distance between the central point of the plate and the supporting pins. | 10-25-2012 |
20130171744 | METHODS OF THERMALLY TREATING A SEMICONDUCTOR WAFER - A method of thermally treating a wafer includes loading a wafer into a process chamber having one or more regions of uniform temperature gradient and one or more regions of non-uniform temperature gradient. A defect is detected in the wafer. The wafer is aligned to position the defect within one of the one or more regions of uniform temperature gradient. A rapid thermal process is performed on the wafer in the process chamber while the defect is positioned within one of the one or more regions of uniform temperature gradient. | 07-04-2013 |
Tae-Gil Kang, Hwaseong-Si KR
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20120200767 | Display Apparatus Including Receiving Container Receiving a Camera Module and a Display Panel - A display apparatus includes a display panel for display an image, a camera module and a receiving container. The camera module includes a lens part mounted on a printed circuit board. The receiving container includes a main receiving space receiving the display panel and a sub receiving space extended from the main receiving space and receiving the camera module. | 08-09-2012 |
20120230051 | DISPLAY APPARATUS - A lower case for a display apparatus includes a receiving part and a sidewall part. The receiving part has a planar bottom plate extending in a first direction and a side portion substantially perpendicular to and extending from the bottom plate in a second direction normal to the bottom plate. The sidewall part is disposed along an edge of the bottom plate that forms a first receiving space with the bottom plate for receiving a backlight assembly having a light source assembly. The sidewall part further includes a first sidewall not adjacent to the light source unit, a second sidewall adjacent to the light source unit, and a third receiving space surrounding the first receiving space for receiving a wire. | 09-13-2012 |
20130286477 | THREE DIMENSIONAL IMAGE DISPLAY APPARATUS - A three dimensional image display apparatus includes a panel unit, a receiving container and an anti-shock part. The panel unit includes a display panel and an optical panel. The optical panel sorts a left eye image and a right eye image. The receiving container surrounds a side of the panel unit. The anti-shock part is disposed between the panel unit and the receiving container, and restricts movement of the panel unit toward the receiving container. | 10-31-2013 |
Taehan Kang, Hwaseong-Si KR
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20090294204 | Apparatus for Driving Steering Shaft in Motor-Driven Power Steering - An apparatus for driving a steering shaft in a motor-driven power steering system may include a pinion gear having a joining protrusion and a power transmission bearing member provided with a joining groove to be removably inserted with the joining protrusion of the pinion gear, wherein the power transmission bearing member rotates integrally with the pinion gear by being joined each other when the pinion gear is disengaged from a flywheel ring gear of an engine and thereby transmits rotation force of the power transmission bearing member to the wormwheel connected with a steering shaft. | 12-03-2009 |
Un Byoung Kang, Hwaseong-Si KR
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20080258299 | Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device - A method of manufacturing a semiconductor device includes forming a diffusion barrier layer on a substrate, and forming at least two features on the substrate such that the diffusion barrier layer is respectively disposed between each feature and the substrate and contacts the at least two features. A first impurity region of the substrate contains impurities of a first type, a second impurity region of the substrate contains impurities of a second type, different from the first type, a first feature of the at least two features is in the first impurity region, and a second feature of the at least two features is in the second impurity region, such that the second feature is electrically isolated from first feature by the different impurity regions. | 10-23-2008 |
20090122178 | CAMERA MODULE AND ELECTRONIC APPARATUS HAVING THE SAME - A camera module includes an image sensor chip, a lens structure, a transparent substrate, an adhesive portion, and a light blocking layer. The image sensor chip includes a light receiving area and a circuit area. The lens structure is positioned on the image sensor chip and configured to allow light to enter the image sensor chip. The transparent substrate is positioned between the image sensor chip and the lens structure, the transparent substrate allowing light from the lens structure to enter the light receiving area. The adhesive portion attaches the image sensor chip and the transparent substrate, and covers the circuit area. The light blocking layer is attached to the transparent substrate to block light from entering the circuit area. | 05-14-2009 |
20090200632 | IMAGE SENSOR HAVING THROUGH VIA - One embodiment exemplarily described herein can be characterized as an image sensor including a substrate having a front surface and a rear surface; a photoelectric converting portion on the front surface of the substrate; a through via extending through the substrate, wherein the through via is electrically connected to the photoelectric converting portion; an external connection terminal on the rear surface of the substrate, wherein the external connection terminal is connected to the through via; and a light shading layer formed on a portion of the rear surface of the substrate, wherein the light shading layer is substantially opaque with respect to an external light. In some embodiments, the portion of the rear surface of the substrate on which the light shading layer is formed is not overlapped by the through via or the external connection terminal. | 08-13-2009 |
20090256931 | Camera module, method of manufacturing the same, and electronic system having the same - A camera module, a method of manufacturing the same, and an electronic system having the same are provided. The camera module includes an image sensor chip having an active plane and a backside, a ground wiring extending from a sidewall of the image sensor chip to the backside, a lens structure having a light detector with at least one lens stacked on the active plane, and a conductive housing extending to the ground wiring along with an outer wall of the lens structure excluding the light detector. | 10-15-2009 |
20100117181 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern. | 05-13-2010 |
20100320500 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE - A method of manufacturing a semiconductor device includes forming a diffusion barrier layer on a substrate, and forming at least two features on the substrate such that the diffusion barrier layer is respectively disposed between each feature and the substrate and contacts the at least two features. A first impurity region of the substrate contains impurities of a first type, a second impurity region of the substrate contains impurities of a second type, different from the first type, a first feature of the at least two features is in the first impurity region, and a second feature of the at least two features is in the second impurity region, such that the second feature is electrically isolated from first feature by the different impurity regions. | 12-23-2010 |
20110180892 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package and a method for manufacturing the same are provided. The semiconductor package includes a semiconductor chip having a first surface, a second surface and a pixel area, first adhesion patterns disposed on the first surface, second adhesion patterns disposed between the first adhesion patterns and the pixel area and disposed on the first surface, and external connection terminals disposed on the second surface, wherein the second adhesion patterns and the external connection terminals are disposed to overlap each other. | 07-28-2011 |
20110233706 | Method For Wafer Level Package and Semiconductor Device Fabricated Using The Same - Provided is a wafer level packaging method and a semiconductor device fabricated using the same. In the method, a substrate comprising a plurality of chips is provided. An adhesive layer is formed on the substrate corresponding to boundaries of the plurality of chips. A cover plate covering an upper portion of the substrate and having at least one opening exposing the adhesive layer or the substrate at the boundaries among the plurality of chips is attached to the adhesive layer. | 09-29-2011 |
20120018885 | SEMICONDUCTOR APPARATUS HAVING THROUGH VIAS - A semiconductor apparatus includes a base substrate and a logic chip disposed on the base substrate. The logic chip includes a memory control circuit, a first through silicon via, and a second through silicon via. The memory control circuit is disposed on a first surface of a substrate of the logic chip, and a memory chip is disposed on a second surface of the substrate of the logic chip. The first through silicon via electrically connects the memory control circuit and the memory chip, the second through silicon via is electrically connected to the memory chip and is configured to transmit power for the memory chip, the second through silicon via is electrically insulated from the logic chip, and the first surface of the substrate of the logic chip faces the base substrate. | 01-26-2012 |
20120119359 | BUMP STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE - Provided are a bump structure includes a first bump and a second bump, a semiconductor package including the same, and a method of manufacturing the same. The bump structure includes: first bump provided on a connection pad of a substrate, the first bump including a plurality of nano-wires extending from the connection pad and a body connecting end portions of the plurality of nano-wires; and a second bump provided on the body of the first bump. | 05-17-2012 |
20120133048 | SEMICONDUCTOR DEVICE, FABRICATING METHOD THEREOF AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE - In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The second surface defines a redistribution trench. The substrate has a via hole extending therethrough. The semiconductor device also includes a through via disposed in the via hole. The through via may include a via hole insulating layer, a barrier layer, sequentially formed on an inner wall of the via hole. The through via may further include a conductive connector adjacent the barrier layer. The semiconductor device additionally includes an insulation layer pattern formed on the second surface of the substrate. The insulation layer pattern defines an opening that exposes a region of a top surface of the through via. The semiconductor devices includes a redistribution layer disposed in the trench and electrically connected to the through via. The insulation layer pattern overlaps a region of the conductive connector. | 05-31-2012 |
20120153498 | Semiconductor Device and Method of Forming the Same - In a semiconductor device, an organic insulation pattern is disposed between first and second rerouting patterns. The organic insulation pattern may absorb the physical stress that occurs when the first and second rerouting patterns expand under heat. Since the organic insulation pattern is disposed between the first and second rerouting patterns, insulating properties can be increased relative to a semiconductor device in which a semiconductor pattern is disposed between rerouting patterns. Also, since a seed layer pattern is disposed between the first and second rerouting patterns and the organic insulation pattern and between the substrate and the organic insulation pattern, the adhesive strength of the first and second rerouting patterns is enhanced. This also reduces any issues with delamination. Also, the seed layer pattern prevents the metal that forms the rerouting pattern from being diffused to the organic insulation pattern. Therefore, a semiconductor device with enhanced reliability may be implemented. | 06-21-2012 |
20120156823 | METHOD OF FORMING SEMICONDUCTOR DEVICE - A method of forming a semiconductor device includes preparing a semiconductor substrate having a plurality of chips formed thereon and a scribe lane disposed between the chips, simultaneously forming a groove having a first depth in the scribe lane, and a through hole penetrating the chips and having a second depth. The chips are separated along the groove. The first depth is smaller than the second depth. | 06-21-2012 |
20120168792 | HETEROJUNCTION STRUCTURES OF DIFFERENT SUBSTRATES JOINED AND METHODS OF FABRICATING THE SAME - In one embodiment, a heterojunction structure includes a first substrate; a second substrate comprising an electrode pad, the second substrate joined to the first substrate by an adhesive layer interposed between the first and second substrates, the first substrate and the adhesive layer having a via hole penetrating therethrough to expose a region of the electrode pad; a connection electrode disposed in the via hole and contacting the electrode pad; and an insulation layer electrically insulating the connection electrode from the first substrate. One of the first and second substrates has a thermal expansion coefficient different than a thermal expansion coefficient of the other of the first and second substrates, and at least one of the adhesive layer or the insulation layer comprises an organic material. | 07-05-2012 |
20130260551 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - In a semiconductor device, an organic insulation pattern is disposed between first and second rerouting patterns. The organic insulation pattern may absorb the physical stress that occurs when the first and second rerouting patterns expand under heat. Since the organic insulation pattern is disposed between the first and second rerouting patterns, insulating properties can be increased relative to a semiconductor device in which a semiconductor pattern is disposed between rerouting patterns. Also, since a seed layer pattern is disposed between the first and second rerouting patterns and the organic insulation pattern and between the substrate and the organic insulation pattern, the adhesive strength of the first and second rerouting patterns is enhanced. This also reduces any issues with delamination. Also, the seed layer pattern prevents the metal that forms the rerouting pattern from being diffused to the organic insulation pattern. Therefore, a semiconductor device with enhanced reliability may be implemented. | 10-03-2013 |
20130267057 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package and a method for manufacturing the same are provided. The semiconductor package includes a semiconductor chip having a first surface, a second surface and a pixel area, first adhesion patterns disposed on the first surface, second adhesion patterns disposed between the first adhesion patterns and the pixel area and disposed on the first surface, and external connection terminals disposed on the second surface, wherein the second adhesion patterns and the external connection terminals are disposed to overlap each other. | 10-10-2013 |
20140057430 | SEMICONDUCTOR DEVICE, FABRICATING METHOD THEREOF AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE - In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The second surface defines a redistribution trench. The substrate has a via hole extending therethrough. The semiconductor device also includes a through via disposed in the via hole. The through via may include a via hole insulating layer, a barrier layer, sequentially formed on an inner wall of the via hole. The through via may further include a conductive connector adjacent the barrier layer. The semiconductor device additionally includes an insulation layer pattern formed on the second surface of the substrate. The insulation layer pattern defines an opening that exposes a region of a top surface of the through via. The semiconductor devices includes a redistribution layer disposed in the trench and electrically connected to the through via. The insulation layer pattern overlaps a region of the conductive connector. | 02-27-2014 |
20140110831 | MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A multi-chip package may include a package substrate, an interposer chip, a first semiconductor chip, a thermal dissipation structure and a second semiconductor chip. The interposer chip may be mounted on the package substrate. The first semiconductor chip may be mounted on the interposer chip. The first semiconductor chip may have a size smaller than that of the interposer chip. The thermal dissipation structure may be arranged on the interposer chip to surround the first semiconductor chip. The thermal dissipation structure may transfer heat in the first semiconductor chip to the interposer chip. The second semiconductor chip may be mounted on the first semiconductor chip. Thus, the heat in the first semiconductor chip may be effectively transferred to the interposer chip through the thermal dissipation line. | 04-24-2014 |
20140147974 | BUMP STRUCTURE INCLUDING NANO-WIRES AND A BODY CONNECTING ENDS OF THE NANO-WIRES, SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - Provided are a bump structure includes a first bump and a second bump, a semiconductor package including the same, and a method of manufacturing the same. The bump structure includes: first bump provided on a connection pad of a substrate, the first bump including a plurality of nano-wires extending from the connection pad and a body connecting end portions of the plurality of nano-wires; and a second bump provided on the body of the first bump. | 05-29-2014 |
20140210075 | METHODS FOR PROCESSING SUBSTRATES - A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer. | 07-31-2014 |
20140213039 | METHODS OF PROCESSING SUBSTRATES - Methods processing substrates are provided. The method may include providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting glue layer and thermosetting release layers provided on opposing sides of the thermosetting glue layer. | 07-31-2014 |
20140252626 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package and a method for fabricating the same are provided. The semiconductor package includes a wafer, a plurality of semiconductor chips each having a connection pad and being stacked on the wafer, resin layers formed to expose top surfaces of the connection pads and to cover lateral surfaces and top surfaces of the semiconductor chips, through lines formed in at least one side of opposite sides of each of the semiconductor chips, to be spaced apart from the semiconductor chips, and to extend in a first direction, and redistribution lines arranged between the through lines, formed to extend in a second direction on the resin layers, and connected to the connection pads, wherein the through lines and the redistribution lines include barrier layers formed on lateral surfaces and bottom surfaces of the through lines and the redistribution lines, and conductive layers formed on the barrier layers. | 09-11-2014 |
Woon-Byung Kang, Hwaseong-Si KR
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20080242000 | WAFER-LEVEL-CHIP-SCALE PACKAGE AND METHOD OF FABRICATION - A wafer-level-chip-scale package and related method of fabrication are disclosed. The wafer-level-chip-scale package comprises a semiconductor substrate comprising an integrated circuit, a conductive ball disposed on the semiconductor substrate and electrically connected to the integrated circuit, and a protective portion formed from an insulating material and disposed on bottom and side surfaces of the semiconductor substrate. | 10-02-2008 |
Woo-Sung Kang, Hwaseong-Si KR
Patent application number | Description | Published |
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20110158518 | METHOD OF DETECTING AN OBJECT USING A CAMERA - A method of detecting an object using a camera is provided. The method includes dividing image data including the object into pre-established areas and creating a detection window for each area; calculating a histogram for each created detection window; determining, for each one of the detection windows, weights for each pixel located within the one of the detection windows according to a determined similarity between a pre-stored histogram corresponding to the object the object and the histogram corresponding to the one of the detection windows; moving each of the detection windows in a direction corresponding to the determined weights according to an average movement, such that the detection windows converge towards the object; and selecting, from among the detection windows, a detection window having a histogram with maximum similarity to the pre-stored histogram corresponding to the object from the detection windows converging to the object. | 06-30-2011 |
20120105677 | METHOD AND APPARATUS FOR PROCESSING LOCATION INFORMATION-BASED IMAGE DATA - An apparatus for processing image data includes a camera for detecting image information received through an image sensor, a location information checker for checking location information, a memory for storing the image information and shooting location information at an acquisition time of the image information, a location information converter for converting the shooting location information based on display location information at a time the image information is to be displayed, and a controller for controlling output of image information corresponding to the display location information. | 05-03-2012 |
20120106792 | USER INTERFACE APPARATUS AND METHOD USING MOVEMENT RECOGNITION - A movement recognition method and a user interface are provided. A skin color is detected from a reference face area of an image. A movement-accumulated area, in which movements are accumulated, is detected from sequentially accumulated image frames. Movement information corresponding to the skin color is detected from the detected movement-accumulated area. A user interface screen is created and displayed using the detected movement information. | 05-03-2012 |
20130038613 | METHOD AND APPARATUS FOR GENERATING AND PLAYING ANIMATED MESSAGE - Methods and apparatus are provided for generating an animated message. Input objects in an image of the animated message are recognized, and input information, including information about an input time and input coordinates for the input objects, is extracted. Playback information, including information about a playback order of the input objects, is set. The image is displayed in a predetermined handwriting region of the animated message. An encoding region, which is allocated in a predetermined portion of the animated message and in which the input information and the playback information are stored, is divided into blocks having a predetermined size. Display information of the encoding region is generated by mapping the input information and the playback information to the blocks in the encoding region. An animated message including the predetermined handwriting region and the encoding region is generated. The generated animated message is transmitted. | 02-14-2013 |