Kang, Cheongju-Si
Chang-Won Kang, Cheongju-Si KR
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20120231256 | CHIP THROUGH FLOORING MATERIAL USING PLA RESIN - Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin. | 09-13-2012 |
20130004703 | BOARD COMPLEX HAVING PLA COVER - The present invention relates to a board complex having a polylactic acid (PLA) cover. The board complex includes: a cover member having at least one layer containing a PLA resin; and a board formed beneath the cover member, wherein the material for the board is selected from medium-density fiberboard (MDF), plywood, asbestos-free cellulose fiber reinforced cement board, magnesium board, glued laminated timber, high density fiberboard (HDF), particle board, ceramic tile, porcelain tile, ceramic board, and click-fastened board. | 01-03-2013 |
20130004751 | FLOOR MATERIAL USING PLA RESIN - Disclosed is a flooring material using an environment-friendly PLA resin. According to the present invention, the flooring material using the PLA resin comprises: a base layer; a print layer which is formed on top of the base layer, and has a print pattern on an upper side thereof; and a transparent layer which is formed on top of the print layer, wherein one or more of the base layer, the print layer, and the transparent layer include polylactic acid (PLA) resin. | 01-03-2013 |
20130302577 | CHIP-INLAID FLOORING MATERIAL USING PLA RESIN - Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder. | 11-14-2013 |
20140295169 | FOAM SHEET USING CROSS-LINKED POLYLACTIC ACID, AND PREPARATION METHOD THEREOF - The present invention relates to a foam sheet using cross-linked polylactic acid and method of manufacturing the same, and more particularly a foam sheet using cross-linked polylactic acid and method of manufacturing the same with not only excellent waterproofing and workability but also relatively high foaming ratio and a uniform closed foam cell structure, by producing cross-linked polylactic acid resin in a fixed condition using composites comprising polylactic acid, cross linking agents, and/or co-crosslinking agents, and then forming a sheet shape in a fixed condition using composites comprising the cross-linked polylactic acid and foaming agents, and then foaming at relatively high temperature conditions. | 10-02-2014 |
20150051320 | BOARD USING CROSSLINKED POLYLACTIC ACID AND METHOD FOR PREPARING SAME - The present invention relates to a board using crosslinked polylactic acid and a method for preparing same, and more specifically, to a board using the crosslinked polylactic acid which has superior processing properties during the preparation process and superior water-resistant properties after processing, by using a composition comprising the crosslinked polylactic acid and wood fiber, and to a method for preparing the same. | 02-19-2015 |
20150073070 | BOARD USING CROSSLINKED POLYLACTIC ACID AND METHOD FOR PREPARING SAME - The present invention relates to a board using crosslinked polylactic acid and a method for preparing same, and more specifically, to a board using the crosslinked polylactic acid having superior processing properties during the preparation process and water resistance properties after processing by using a composition comprising the crosslinked polylactic acid and wood powder, and to a method for preparing the board. | 03-12-2015 |
20150080503 | ENVIRONMENTALLY-FRIENDLY BOARD USING POLYLACTIC ACID AND WOOD FIBER, AND METHOD FOR PREPARING SAME - Disclosed are an environmentally-friendly board, which provides the advantages of energy reduction and greenhouse gas reduction and does not emit toxic substances such as toxic gas or endocrine-disrupting chemicals, and a method for preparing same. The environmentally-friendly board, according to the present invention, comprises a biodegradable resin composition including a polylactic acid resin, a crosslinking agent, and wood fiber, and thus provides the advantages of not emitting toxic substances such as toxic gas or endocrine-disrupting chemicals, securing water resistance of a product by PLA crosslinking, and not sticking to a processing tool when heat is applied during processing. | 03-19-2015 |
20160068682 | BOARD COMPRISING BIODEGRADABLE RESIN AND WOODEN FLOUR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a board for building or industry comprising biodegradable resin and wooden flour, which is capable of implementing an excellent physical property and protecting the human body and the environment, and a method of manufacturing the same. A method of manufacturing a board may comprise fabricating wooden flour by pulverizing a raw log or wood chips that are raw materials, inputting biodegradable resin to the wooden flour and fabricating compounds by mulling the biodegradable resin and the wooden flour at high temperature, forming the fabricated compounds in a sheet form through mold forming, and cooling the formed board. Accordingly, there are advantages in that an excellent physical property can be implemented, the human body and the environment can be protected because there is no possibility of environmental pollution when the board is buried due to the biodegradable resin, and a cost related to the disposal of wastes can be reduced. | 03-10-2016 |
Heon-Sung Kang, Cheongju-Si KR
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20130025966 | ASSEMBLY WALL BODY HAVING IMPROVED SOUND ABSORBING AND SCREENING PERFORMANCE AND A ASSEMBLY STRUCTURE COMPRISING THE SAME - The present invention relates to an assembly wall having improved sound absorption/insulation performance and an assembly structure thereof. The assembly wall includes plate members separated from each other to face each other and each forming at least one layer; stud members alternately placed on different inner surfaces of the plate members and comprising a web formed with a plurality of first perforated holes having at least one diameter; an insulation member interposed in a space defined between the plate members and the stud members; and a sheet member adjoining an outer surface of the insulation member and being formed with a plurality of second perforated holes having at least one diameter. With this structure, the assembly wall has excellent sound absorption and insulation performance over various frequency bands including a low frequency band without increasing wall thickness. | 01-31-2013 |
20130199872 | GYPSUM PANEL HAVING OUTSTANDING SOUND-ABSORBING PROPERTIES AND A PRODUCTION METHOD THEREFOR - Disclosed is a gypsum panel having outstanding sound-absorbing properties whereby it is possible to impart various aesthetic effects while also having outstanding sound-absorbing effects. The gypsum panel having outstanding sound-absorbing properties according to the present invention comprises: a perforated gypsum body having a plurality of holes, and a sound-absorbing cover layer which is attached to one side of the gypsum body and which has through-holes of a smaller size than the holes, wherein the mean diameter of the through-holes is between 10 and 40 μm. | 08-08-2013 |
Hyoung-Gu Kang, Cheongju-Si KR
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20100182547 | Optical film, preparation method of the same, and liquid crystal display comprising the same - The present invention relates to an optical film, a method for manufacturing the same, and a liquid crystal display device including the same. In detail, the optical film according to the present invention includes an acryl-based substrate, a liquid crystal alignment film, and a liquid crystal film, the liquid crystal alignment film can maintain strong adhesion strength between the acryl-based substrate and the liquid crystal alignment film and between the liquid crystal alignment film and the liquid crystal film by further introducing a monomer having a functional group capable of performing crosslinking reaction to the photoreactive polymer. | 07-22-2010 |
Il Gyu Kang, Cheongju-Si KR
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20130142503 | SHUTTER DEVICE FOR CAMERA - A shutter device for a camera is provided, which effectively provides an operating space of a shutter blade and a light-amount adjuster, improves assemblability of a top cover, and improves mechanical stability according to the assembly of the top cover by modifying the geometry of the top cover. The shutter device includes a driving unit driving a shutter blade and a light-amount adjuster, the shutter device including: a base where the driving unit is installed; a first plate placed on the top of the base; a second plate disposed on the top of the first plate; a top cover including first supports bent downward and supports projecting downward, where the first supports extend to pass through the second plate and support the top surface of the first plate, and the second supports are supported on the top surface of the second plate. | 06-06-2013 |
20140255016 | DEVICE FOR DRIVING CAMERA LENS MODULE IN PORTABLE TERMINAL - A camera lens module of a portable terminal includes: an external case; an Optical Image Stabilizer (OIS) carrier disposed within the external case; and at least one OIS driver disposed in at least one of corner regions of the external case to correct a hand shaking state of the OIS carrier. | 09-11-2014 |
20150378169 | CAMERA LENS MODULE FOR MOBILE TERMINAL - A camera lens module includes: an external case; an Automatic Focusing (AF) driver disposed at one surface of the external case to guide a lens carrier along an optical axis, the AF driver having a magnet and a coil arranged to face each other in parallel to the optical axis; and first and second OIS drivers located opposite the AF driver with the lens carrier as the center, each of the first and second OIS drivers having a coil and a magnet arranged to face each other in parallel to the optical axis in a vertical or horizontal direction to correct shaking of the lens carrier, wherein each of the OIS drivers and the AF driver includes a position sensor opposed to the magnet. | 12-31-2015 |
20160033786 | CAMERA LENS MODULE - A camera lens module of a portable terminal includes an external case; an OIS carrier disposed in the external case; a lens system which is guided along an optical axis in the OIS carrier; an AF driving unit facing to a first surface of the external case and which enables the lens system to move; a first OIS driving unit disposed in parallel along a second surface of the external case at the other side opposite to the first surface on which the AF driving unit is disposed; and a second OIS driving unit disposed in parallel along a third surface of the external case between the first OIS driving unit and the AF driving unit. | 02-04-2016 |
Ingyu Kang, Cheongju-Si KR
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20130096928 | METHOD AND APPARATUS FOR PROCESSING AN AUDIO SIGNAL - The present invention relates to a method for processing an audio signal, comprising: determining bandwidth information indicating to which of a plurality of bands the current frame corresponds; determining information on the order corresponding to the present frame on the basis of the bandwidth information; performing a linear predictive analysis of the present frame to generate a first set linear predictive transform coefficient of a first order; performing a vector quantization on the first set linear predictive coefficient to generate a first index; performing a linear predictive analysis of the current frame to generate a second set linear predictive transform coefficient of a second order in accordance with the information on the order; and performing a vector quantization on a second set difference by using the first set index and the second set linear predictive transform coefficient, when the second set linear predictive coefficient is generated. | 04-18-2013 |
In Soo Kang, Cheongju-Si KR
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20080203583 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - There is provided a semiconductor package comprising: a multilayer thin film structure including a plurality of dielectric layers and at least one or more redistribution layers; a semiconductor chip positioned at one side of the multilayer thin film structure and electrically connected to the redistribution layer; and a solder bump formed at the other side of the multilayer thin film structure. The multilayer thin film structure functions as the substrate for the semiconductor package and realizes the light, thin, short and small BGA package without any additional substrate. A plurality of the packages can be simultaneously formed at wafer level or carrier level, to simplify the process and to be favorable for mass production. After the semiconductor chips are formed at wafer level, only the semiconductor chips having the excellent operation characteristic through the test are selectively bonded to the multilayer thin film structure, to provide the high quality package products in which the fault rate is maximally reduced. The light, thin, short and small BGA package according to the present invention enables small and slim communication devices, displayers and other diverse electronic devices, to be contributed to the increase of the competitiveness of the products to which the BGA package is applied. | 08-28-2008 |
20120146216 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided. The package includes a package substrate with a first surface and a second surface on the opposite side, and a plurality of via sets connecting vertically the first surface with the second surface, said via sets having a plurality of micro vias and filled with conductive material. The micro vias are grouped together, and the distance between micro vias in the via set is smaller than the distance between neighboring via sets. | 06-14-2012 |
Jae-Hoon Kang, Cheongju-Si KR
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20150125677 | HARD COATING FOR CUTTING TOOL - Provided is a hard film for a cutting tool formed on a surface of a base material, the hard film being comprised of a nano multi-layered structure comprising a thin layer A, a thin layer B, a thin layer C and a thin layer D or a structure in which the nano multi-layered structure is repeatedly stacked at least twice, wherein the thin layer A is comprised of Ti | 05-07-2015 |
20150125678 | HARD FILM FOR CUTTING TOOL - Provided is a hard film formed on a surface of a base material, the hard film being comprised of a nano multi-layered structure formed by stacking a thin layer A, a thin layer B a thin layer C in order of thin layers A-B-A-C from the base material or being comprised of a structure formed by repeatedly stacking the nano multi-layered structure at least twice, wherein the thin layer A is comprised of Ti | 05-07-2015 |
20150152561 | HARD FILM FOR CUTTING TOOL - Provided is a hard film for a cutting tool formed on a surface of a base material, the hard film being comprised of a nano multi-layered structure formed by sequentially stacking a thin layer A, a thin layer B, a thin layer C and a thin layer D or being comprised of a structure formed by repeatedly stacking the nano multi-layered structure at least twice, wherein the thin layer A is comprised of Ti | 06-04-2015 |
Jeong-Soo Kang, Cheongju-Si KR
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20120200770 | SOURCE DRIVER, CONTROLLER, AND METHOD FOR DRIVING SOURCE DRIVER - A source driver, a controller, and a method for driving a source drive are provided. The source driver includes a controller configured to receive a start pulse signal, and generate and output one of a new start pulse signal if the start pulse signal is received, and an internal start pulse signal if the start pulse signal is not received, a shift register configured to receive video data, store the video data, and output the video data if the outputted start pulse signal is received by the shift register, a digital-to-analog converter (DAC) configured to convert the video data output from the shift register into an analog voltage signal, and output the analog voltage signal, and an output buffer configured to buffer the analog voltage signal output from the DAC, and output the buffered analog voltage signal. | 08-09-2012 |
Kue Seok Kang, Cheongju-Si KR
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20160059799 | MULTI-LAYERED NOISE ABSORBING AND INSULATING MATERIAL HAVING AIR-PERMEABILITY - A multi-layered noise absorbing and insulating material includes a noise insulation material having opposing first and second major surfaces. The noise insulation material includes an adhesive resin including an air permeability-forming material. A first noise absorption material is adhered to the first major surface of the noise insulation material. A second noise absorption material is adhered to the second major surface of the noise insulation material. The multi-layered noise insulation absorbing and insulating material has air-permeability. | 03-03-2016 |
Kui Won Kang, Cheongju-Si KR
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20110286191 | Printed circuit board and semiconductor package with the same - Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill. | 11-24-2011 |
Kwang-Choong Kang, Cheongju-Si KR
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20120227627 | NACREOUS PIGMENT WITH HIGH CHROMA AND MULTIPLE COLORS AND METHOD OF PREPARING THE SAME - The present invention relates to a nacreous pigment and a method of preparing the same. The nacreous pigment includes a flake substrate, a first metal oxide layer coated on the substrate, and an oxide layer coated on the first metal oxide layer and containing MgO.SiO2, and a second metal oxide layer coated on the oxide layer. The pigment exhibits high brightness, high chroma, high gloss, and multi-color effects. | 09-13-2012 |
20140041551 | PIGMENT PAINT FOR AN EXTERIOR MATERIAL HAVING GOOD WEATHER RESISTANCE AND METHOD FOR MANUFACTURING SAME - The present invention relates to a pigment paint for an exterior material and to a method for manufacturing the same. The pigment paint comprises: a flake matrix, a first metal oxide layer coated on the upper portion of the transparent matrix, an oxide layer containing MgO—SiO | 02-13-2014 |
20140050769 | SILVER COATING PIGMENT, AND METHOD FOR PRODUCING SAME - Disclosed is a method for producing a silver (Ag) coating pigment. The method for producing a silver coating pigment according to the present invention comprises: a step of forming a tin compound pretreatment layer on the matrix surface; and a step of forming a silver coating layer on the lower portion of the tin compound pretreatment layer through a reflux and electroless plating process using a diluted solution of silver nitrate, ammonia water, a citric acid solution, and a diluted solution of potassium hydroxide. | 02-20-2014 |
Min Jae Kang, Cheongju-Si KR
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20080202354 | Cooking apparatus and method of controlling the same - A cooking apparatus and a method of controlling the same utilize the operations of measuring a temperature of a cooking chamber, and periodically turning on and off a convection fan, which circulates air in the cooking chamber, when the temperature of the cooking chamber reaches a target temperature. | 08-28-2008 |
20090078244 | Metal panel, manufacturing method thereof and cooking device using the metal panel - A metal panel, a manufacturing method thereof and a cooking device using the metal panel capable of improving an external appearance of edges, enhancing efficiency of a manufacturing process and reducing the manufacturing cost. The manufacturing method of a metal panel includes cutting a metal plate to form a cutaway portion at a specified area of a border, bending the border on opposite sides of the cutaway portion, and coupling a bracket to a cutaway groove formed at the border by the bending. | 03-26-2009 |
20090078291 | Cooking apparatus and method of controlling steam cleaning thereof - A cooking apparatus and a method of controlling steam cleaning thereof realize optimal cleaning performance by maintaining an internal temperature of a cooking chamber at a temperature suitable for steam condensation at the time of cleaning the inside of the cooking chamber using steam. The cooking apparatus includes a cooking chamber, a steam supplying unit to supply steam into the cooking chamber, a temperature sensing unit to sense an internal temperature of the cooking chamber, and a control unit to compare the sensed internal temperature with a reference temperature and operate the steam supplying unit if the internal temperature of the cooking chamber is less than the reference temperature. | 03-26-2009 |
20100176116 | Cooking apparatus and heating device including working coils thereof - A cooking apparatus performing cooking with a cooking container disposed at any desired position on a cooking plate, and a heating device thereof. The cooking apparatus includes a cooking plate to receive a cooking container thereon, and at least one working coil disposed under the cooking plate to heat the cooking container, the at least one working coil including a first portion and a second portion having a different winding structure of a conducting wire which forms the working coil so that a winding density of the conducting wire at one of the first portion and the second portion is relatively higher than the other of the first portion and the second portion. | 07-15-2010 |
Nam-Wook Kang, Cheongju-Si KR
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20120151294 | METHOD AND APPARATUS FOR CORRECTING ERRORS IN MEMORY DEVICE - A memory controller analyzes read data received from a memory device and first error correction code (ECC) data of the read data. A control unit generates a plurality of sub-data from write data to be written in the memory device where the number of error bits in the read data is greater than a number of error bits that can be corrected using the first ECC data. An ECC block generates the first ECC data and second ECC data by using substantially the same algorithm to correct errors in each of the sub-data. The control unit transmits each of the sub-data, the first ECC data and the second ECC data to the memory device. | 06-14-2012 |
20120216094 | Controller, A Method Of Operating The Controller And A Memory System - The present disclosure provides a controller which comprises a command generator configured to generate a command to non volatile memory, and buffer configured to receive a first data and a second data and configured to combine the first data and the second data, an ECC unit configured to perform the ECC decoding. And the first page data may include at least one error bit corresponding to an error location table and the second page data may include at least one original bit which can be replaced with the error bit. The buffer may replace the at least one error bit with the said at least one original bit. The error location table may save information of location for the repeated error bit. | 08-23-2012 |
Pil Seung Kang, Cheongju-Si KR
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20140291767 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes: a deep trench in a substrate; a sidewall insulating film on a side surface of the deep trench; an interlayer insulating film on the sidewall insulating film; and an air gap in the interlayer insulating film. | 10-02-2014 |
Seon Ha Kang, Cheongju-Si KR
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20100021045 | Manufacturing method of printed circuit board and manufacturing apparatus for the same - The present invention relates to a method for manufacturing a printed circuit board and an apparatus for manufacturing the same; and, more particularly, to a method for manufacturing a printed circuit board and an apparatus for manufacturing the same capable of improving the degree of matching between contact holes and pads by correcting exposure position data of an exposing process for forming the pads according to positions of the contact holes. | 01-28-2010 |
Sin Il Kang, Cheongju-Si KR
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20120080623 | ELECTRIC VALVE FOR REFRIGERANT CONTROL - An electric valve for refrigerant control is provided, which includes: a base; a cover adapted to cover the base; a rotor adapted to perform stepping motions in a rotating direction by means of a stator disposed outside the cover; and a drive pad rotated by receiving a rotating force from the rotor through decelerating gears, wherein the base has a first port through which a refrigerant is introduced to the space inside the cover and at least two or more second ports through which the refrigerant introduced through the first port is discharged, and the drive pad has a contact surface contacted with the surface of the base and an open surface stepped from the contact surface and forming a passage extended to the second ports in accordance with the operation of the drive pad. | 04-05-2012 |
Steve Kang, Cheongju-Si KR
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20140347106 | DELAY-LOCKED LOOP (DLL) OPERATION MODE CONTROLLER CIRCUIT AND METHOD FOR CONTROLLING THEREOF - A delay-locked loop (DLL) operation mode control circuit and corresponding method are provided in which one of the output values from a display driver IC (DDI) is detected to switch a DLL block to standby mode. In examples, a CLKP/N frequency and CLKP/N common terminal voltage status are used to switch mode. Accordingly, since inoperable frequency domains otherwise present in a normal mode interval of the DLL block is included into standby mode, more stable operation of the DLL circuit is provided. | 11-27-2014 |
Sung-Muk Kang, Cheongju-Si KR
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20160040814 | TUBE-FITTING STRUCTURE FOR PURE-WATER LINE - The present invention relates to a tube-fitting structure for a pure-water line of a water purifier or refrigerator. The present invention provides a tube connecting structure in which a tube fitted into a body having a fitting part formed therein is fixed by a cap, wherein a guide groove formed to have a receiving recess curved downward is formed on an outer circumferential surface of a tube link part of the body, and wherein a guide protrusion is formed on an inner circumferential surface of the tube corresponding to the outer circumferential surface of the body to allow the guide protrusion to be coupled along the guide groove, so that the tube is easily assembled with the body while the cap is rotated due to an inclined surface of the guide groove. Thus, in spite of enhancing the air tightness of the fitting structure, the assembly is improved. | 02-11-2016 |
Tae-Hyeong Kang, Cheongju-Si KR
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20100123235 | PACKAGE ON PACKAGE SUBSTRATE - A package on package substrate is disclosed. The package on package substrate in accordance with an embodiment of the present invention can include a bottom package substrate, on which and an electronic element is mounted and of which an upper surface is formed with a bottom pad part and a solder resist part corresponding to the bottom pad part, and a top package substrate, which is stacked on an upper side of the bottom package substrate by interposing a solder between the top package substrate and the bottom package substrate and of which a lower surface is formed with a top pad part corresponding to the bottom pad part. The solder resist part can include a first solder resist layer, which is formed on the upper surface of the bottom package substrate, corresponding to the bottom pad part, and a second solder resist layer, which is formed on the first solder resist layer such that the bottom pad part is exposed. | 05-20-2010 |
Yangbeom Kang, Cheongju-Si KR
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20150235868 | METHOD OF MANUFACTURING NON-VOLATILE MEMORY DEVICE - A method for manufacturing a non-volatile memory includes depositing a first conductive film and a protective film on a substrate including a logic area and a cell area, patterning the protective film, depositing a hard mask layer on the first conductive film and the patterned protective film to pattern the hard mask layer, using the patterned hard mask layer to form a logic gate on the logic area, exposing a surface of the first conductive film in the cell area and forming a control gate on the cell area. | 08-20-2015 |
Yang-Beom Kang, Cheongju-Si KR
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20140035146 | METAL WIRING OF SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A metal wiring for applying a voltage to a semiconductor component of a semiconductor device, the semiconductor device comprising a low voltage applying region adjacent to a high voltage applying region, is provide. The metal wiring includes: an isolator region, a first lower metal layer electrically connected to the semiconductor component, a first upper metal layer configured to be electrically connected to an external power supply, and a plurality of inter-metal dielectric layers deposited between the first lower metal layer and the first upper metal layer, each of the plurality of inter-metal dielectric layers comprising at least one contact plug for providing an electrical connection between the first lower metal layer and the first upper metal layer. | 02-06-2014 |
Yong Gu Kang, Cheongju-Si KR
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20090244994 | Data strobe signal generating circuit capable of easily obtaining valid data window - A data strobe signal generating circuit includes a pre-driver control unit for selectively transferring a ground voltage and a supply voltage, as a first control signal and a second control signal, in response to first and second clock pulse signals, wherein the second control signal is driven in response to a preamble signal, a pre-driver for generating a driving signal in response to the first and second control signals and the preamble signal, and an output buffer for driving an output pad in response to the driving signal. | 10-01-2009 |
Young-Soo Kang, Cheongju-Si KR
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20120171840 | CAPACITOR AND METHOD FOR FABRICATING THE SAME - A method for fabricating a capacitor is provided. The method for fabricating a capacitor includes forming a dielectric layer over a lower electrode on a substrate, forming an upper electrode over the dielectric layer, forming a hard mask over the upper electrode, etching the hard mask to form a hard mask pattern, etching the upper electrode to make the dielectric layer remain on the lower electrode in a predetermined thickness, forming an isolation layer along an upper surface of the remaining dielectric layer and the hard mask pattern, leaving the isolation layer having a shape of a spacer on one sidewall of the hard mask pattern, the upper electrode, and the dielectric layer, and etching the lower electrode to be isolated. | 07-05-2012 |