Patent application number | Description | Published |
20100301954 | PIEZOELECTRIC TRANSDUCER, PIEZOELECTRIC TRANSDUCER MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO CLOCK - Provided are: a piezoelectric oscillation piece which has a pair of oscillation arms disposed in parallel with each other with base ends of the oscillation arms fixed to a base of the piezoelectric oscillation piece and with weight metal films formed at the tips of the oscillation arms; a base substrate on the upper surface of which the piezoelectric oscillation piece is mounted; a lid substrate joined with the base substrate such that the mounted piezoelectric oscillation piece can be accommodated in a cavity; and a control film disposed in the vicinity of the pair of the oscillation arms as viewed in the plan view and formed at least on either of the substrates in such a manner as to extend from the base end side to the tip side in the longitudinal direction of the oscillation arms for increasing the degree of vacuum inside the cavity by heating. The control film is locally deposited on the side surfaces of the oscillation arms in the vicinity of the control film by heating. | 12-02-2010 |
20100308694 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, FIXING JIG, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED WATCH - The piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed of a cylindrical body, which is formed of a glass material to have two flat ends and a thickness substantially equal to that of the base substrate, and is implanted in the through-hole running through the base substrate; and an electroconductive core member which is formed to have two flat ends and a thickness substantially equal to that of the base substrate and is inserted into the center hole of the cylindrical body; and the through-hole, the cylindrical body and the core member are integrally fixed to each other by firing. | 12-09-2010 |
20110018388 | PIEZOELECTRIC VIBRATOR, MANUFACTURING METHOD OF PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED CLOCK - Provide a highly efficient manufacturing method of a piezoelectric vibrator and to provide a piezoelectric vibrator manufactured by this manufacturing method. A method for manufacturing a piezoelectric vibrator | 01-27-2011 |
20110018398 | PIEZOELECTRIC VIBRATOR, MANUFACTURING METHOD OF PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED CLOCK - Providing a piezoelectric vibrator which is capable of securing the degree of vacuum in a cavity and can be manufactured with high efficiency and to provide a manufacturing method thereof. A piezoelectric vibrator | 01-27-2011 |
20110050045 | PACKAGE, METHOD FOR MANUFACTURING THE SAME, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Providing a package and a method for manufacturing the package capable of achieving improvement in the degree of vacuum in the cavity, and to provide a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. There is provided a package which includes a plurality of kinds of gettering materials | 03-03-2011 |
20110138857 | BONDED GLASS CUTTING METHOD, PACKAGE MANUFACTURING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND ATOMIC TIMEPIECE - To provide a bonded glass cutting method whereby it is possible to suppress an occurrence of a crush or chipping when bonded glass is cut, and cut the bonded glass into pieces of a predetermined size, a package manufacturing method, a package, a piezoelectric vibrator, an oscillator, an electronic device, and an atomic timepiece. A bonded glass cutting method includes a scribing step, which irradiates a lid substrate wafer with a laser beam with a wavelength absorbed by a wafer bonded body along outlines, thus forming scribe lines on the lid substrate wafer, and a breaking step which, by cutting the wafer bonded body by applying a fracture stress to the scribe lines, dices the wafer bonded body into a plurality of piezoelectric vibrators, wherein a cutting step is carried out in a condition in which the wafer bonded body is placed on silicon rubber, and an outside end face of the lid substrate wafer is caused to face the silicon rubber. | 06-16-2011 |
20110140794 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - A piezoelectric vibrator including a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; a piezoelectric vibrating reed which has a pair of vibration arm portions extending in parallel, a pair of excitation electrodes that vibrate the pair of vibration arm portions, and a mount electrode that is electrically connected to the pair of excitation electrodes, the piezoelectric vibrating reed being mounted on the base substrate within the cavity via the mount electrode; an insulation film which is formed on the piezoelectric vibrating reed so as to cover the excitation electrodes; and a getter material formed of the metallic material that is formed on any of the base substrate or the lid substrate so as to be arranged within the cavity and improve a degree of vacuum within the cavity by being heated. | 06-16-2011 |
20110140796 | PIEZOELECTRIC VIBRATOR, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE - A piezoelectric vibrator includes a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions; a package that accommodates the piezoelectric vibrating reed; and a getter material that is formed along the longitudinal direction of the vibration arm portion in an inner portion of the package, wherein a cross-sectional area of a middle portion of the getter material adjacent to a center portion of the longitudinal direction of the vibration arm portion is greater than that of an end portion of the getter material. | 06-16-2011 |
20110148539 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; an external electrode that is formed on a lower surface of the base substrate; an internal electrode that is formed on an upper surface of the base substrate so as to be accommodated in the cavity; a through electrode which is formed so as to pass through the base substrate and electrically connect the external electrode with the internal electrode; a piezoelectric vibrating reed which is accommodated in the cavity in a state of being electrically connected to the internal electrode; and a getter material that is formed in the cavity, the getter material being formed of chromium or a metallic material consisting of chromium as a main ingredient. | 06-23-2011 |
20110164473 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - A piezoelectric vibrator includes a base substrate and a lid substrate which are bonded to each other with a cavity formed therebetween; a piezoelectric vibrating reed which has a pair of vibration arm portions extending in parallel and is mounted on the base substrate within the cavity; and a getter material of a metallic film that is formed on the base substrate or the lid substrate so as to be arranged within the cavity and improve a degree of vacuum within the cavity by being heated. A restriction portion, which is arranged in the cavity and restricts a scattering direction of the getter material evaporated by the heating to suppress a scattering amount scattering toward the vibration arm portion, is formed in the base substrate or the lid substrate. | 07-07-2011 |
20110169584 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, AND ATOMIC TIMEPIECE - To provide a piezoelectric vibrator manufacturing method that curbs a dispersion of a bonding film at a time of a gettering step and with which good electrical characteristics can be obtained, and an oscillator, electronic device, and atomic timepiece, in which is mounted a piezoelectric vibrator with which good electrical characteristics can be obtained. A manufacturing method includes a gettering step whereby a getter material is irradiated with a first laser penetrating a base substrate from the outer side of the base substrate, activating the getter material so that it adsorbs gas existing inside a cavity, and a frequency adjustment step whereby a weight metal film formed at leading ends of vibrating arms of a piezoelectric vibrating piece is irradiated with a second laser penetrating the base substrate from the outer side of the base substrate, thus adjusting the frequency of the piezoelectric vibrating piece, wherein the intensity of the first laser in the gettering step is weaker than the intensity of the second laser in the frequency adjustment step. | 07-14-2011 |
20110187471 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - There are provided a piezoelectric vibrator capable of suppressing vibration leakage while securing mounting strength of a piezoelectric vibrating reed and an oscillator, an electronic apparatus, and a radio-controlled timepiece each using the piezoelectric vibrator. The piezoelectric vibrator includes: a package that accommodates a piezoelectric vibrating reed; and a bump that mounts the base portion of the piezoelectric vibrating reed on a package. The bump includes a plurality of main bumps which is arranged in a line in the width direction of the base portion so as to be bonded to the base portion; and an auxiliary bump which is bonded to the base portion in an area between the main bumps disposed at both ends in the width direction of the base portion and an area between the main bumps and base ends of the vibrating arms in the longitudinal direction of the base portion. | 08-04-2011 |
20110187472 | PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - There are provided a piezoelectric vibrating reed capable of securing a stable bonding strength between a bump and the piezoelectric vibrating reed, a piezoelectric vibrator having the piezoelectric vibrating reed, a method for manufacturing the piezoelectric vibrator, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. A piezoelectric vibrating reed includes: a vibrating portion; a base portion adjacent to the vibrating portion; excitation electrodes formed in the vibrating portion; mount electrodes formed in the base portion; and extraction electrodes for electrically connecting the excitation electrodes and the mount electrodes to each other. A bonding film made of gold is formed on the surfaces of the mount electrodes, and the bonding film is formed to a thickness such that, when the bonding film is ultrasonically bonded to a bump made of gold, mutual diffusion occurs over approximately the entire area in the thickness direction of the bonding film. | 08-04-2011 |
20110234329 | PACKAGE MARKING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided are a package marking method capable of printing a clean marking without impairing the reliability, a package manufactured by the method, a piezoelectric vibrator, and an oscillator, an electronic device, and a radio-controlled timepiece having the piezoelectric vibrator. A package marking method for printing a marking on the surface of a lid substrate formed of a glass includes a thin film forming step of forming a thin film on the surface of the lid substrate and a marking step of printing a marking on the surface of the lid substrate by irradiating the thin film formed by the thin film forming step with a laser beam to remove the thin film. | 09-29-2011 |
20110249534 | PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A package manufacturing method of the present invention is a method of manufacturing a package with a recessed cavity formed in at least one of first and second substrates formed of a glass material and includes a cavity forming step of forming the cavity by performing press molding on at least one molded substrate of the first and second substrates and a heat treatment step of heating the molded substrate formed with the cavity. | 10-13-2011 |
20110261659 | METHOD OF MANUFACTURING PACKAGES, BONDED WAFER MEMBER, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO TIMEPIECE - A method of manufacturing packages having contents sealed therein, including: a step of forming cavities in a plurality of package forming areas on a first wafer; a step of bonding the first wafer and a second wafer while arranging the contents in the cavities; and a step of irradiating a bonded wafer member with a laser and separating the packages into pieces, characterized in that dummy cavities are formed on an outside of the package forming area in an outermost periphery of the first wafer in the cavity forming step. | 10-27-2011 |