Patent application number | Description | Published |
20080303144 | STRUCTURE, METHOD AND SYSTEM FOR ASSESSING BONDING OF ELECTRODES IN FCB PACKAGING - Structures, methods, and systems for assessing bonding of electrodes in FCB packaging are disclosed. In one embodiment, a method comprises mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrode of a second shape, wherein the second shape is different from the first shape, bonding a respective on of the plurality of first electrodes and the second electrode using a first solder bump, generating an X-ray image of the first solder bump, and determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump. | 12-11-2008 |
20080318214 | Genome Analysis Method - This invention makes it possible to perform analysis for estimating the characteristics of a population using sample data. By obtaining sample data, embedding genetic (statistical) knowledge in a first and second state variable that have duality, and having the first and second state variables converge to the original value, the characteristics of the population of the sample data are estimated, and the estimated results of the characteristics of the population are output. By doing so, it is possible to perform analysis for estimating characteristics of a population using sample data. | 12-25-2008 |
20090093967 | GENOME ANALYSIS SYSTEM II - The present invention provides that the analysis can be estimated the characteristics of the originated populations which belong to the samples and the characteristics of the samples from sample data. By loading the sample data, by interfering with the second state variable showing the characteristics in the environment system to the first state variable showing the characteristics in the objective system, by converging the variable by selecting the maximum resonant state, and by estimating the characteristics of the samples and the characteristics of the originated populations which belong to the samples, then the result estimated the characteristics of the originated populations is outputted. | 04-09-2009 |
20090115070 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF - A semiconductor device includes a semiconductor chip | 05-07-2009 |
20090174057 | SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD - The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion. | 07-09-2009 |
20090212423 | STACKED SOLDER BALLS FOR INTEGRATED CIRCUIT DEVICE PACKAGING AND ASSEMBLY - A semiconductor device is provided that includes a semiconductor chip, a plurality of solder bumps that electrically couple the semiconductor chip to the outside, and a metal bump being provided on the surface of each first solder bump which is at least a part of the plurality of solder bumps and being made of a metal having a melting point higher than that of the first solder bump. The wettability of the first solder bump is improved as each metal bump serves as a core when the corresponding first solder bump melts. Thus, the connection reliability of the first solder bump can be improved. | 08-27-2009 |
20090256250 | SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD - The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion. | 10-15-2009 |
20110057309 | STRUCTURE, METHOD AND SYSTEM FOR ASSESSING BONDING OF ELECTRODES IN FCB PACKAGING - Structures, methods, and systems for assessing bonding of electrodes in FCB packaging are disclosed. In one embodiment, a method comprises mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrode of a second shape, wherein the second shape is different from the first shape, bonding a respective on of the plurality of first electrodes and the second electrode using a first solder bump, generating an X-ray image of the first solder bump, and determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump. | 03-10-2011 |
20120083096 | SEMICONDUCTOR DEVICE HAVING A SIMPLIFIED STACK AND METHOD FOR MANUFACTURING TEHREOF - Embodiments of the present invention are directed to provide a semiconductor device including a semiconductor chip formed of a conductive material, a connector terminal around the semiconductor chip, which is formed of a same material for forming the semiconductor chip, an insulating member for electrically insulating the semiconductor chip from the connector terminal, and a first connection member for electrically coupling the semiconductor chip with the connector terminal Simplified step of manufacturing the connector terminal may further simplify the steps of manufacturing the semiconductor device. | 04-05-2012 |