Patent application number | Description | Published |
20110025794 | Inkjet head and inkjet head assembly - There is provided an inkjet head including an inkjet head plate slantedly coupled to a cartridge supplying ink; a nozzle ejecting ink moving through a path formed inside the inkjet head plate, and formed at a flattened edge of the inkjet head plate contacting a printing medium; and an actuator provided on a surface of the inkjet head plate opposite to that coupled to the cartridge and controlling the ejection of the ink. | 02-03-2011 |
20110032309 | Inkjet head, method of manufacturing the same, and electrical connection device therefor - An inkjet head according to an aspect of the invention may include: an inkjet head body having an ink chamber provided therein and an electrode portion provided on a surface thereof adjacent to the ink chamber; a piezoelectric actuator being mounted on the surface of the inkjet head body so that the piezoelectric actuator is electrically connected to the electrode portion; and a substrate being pressed using a bonding tool so that the substrate is electrically connected to the electrode portion and the piezoelectric actuator, arranged in different planes, through a conductive adhesive. | 02-10-2011 |
20110057995 | Inkjet head and inkjet head assembly having the same - There is provided an inkjet head and an inkjet head assembly having the same. The inkjet head includes an inkjet head plate having a plurality of nozzles ejecting ink provided therein; pressure chambers storing ink drawn in from both outer ends of the inkjet head plate in a width direction thereof and facing each other in a direction inwards of the width direction; piezoelectric elements supplying the pressure champers with driving force allowing ink to be ejected through the nozzles connected to the pressure chambers and disposed on the pressure chambers having membranes interposed therebetween; a pressure adjusting channel connecting the pressure chambers to adjust a pressure of ink ejected through the nozzles. | 03-10-2011 |
20110109702 | Inkjet head - There is provided an inkjet head. An inkjet head according to an aspect of the invention may include: a body having a nozzle in an outer surface thereof; a reservoir provided within the body and containing ink being externally injected; an ink chamber receiving the ink from the reservoir through a restrictor and ejecting the ink to an outside through the nozzle; and a reservoir actuator mounted on the body at a position corresponding to the reservoir and transmitting vibrations to the reservoir. | 05-12-2011 |
20110134182 | INKJET HEAD PACKAGE - There is provided an inkjet head package including: an ink head having an actuator mounted thereon and ejecting ink to the outside by a driving force of the actuator; an intermediate substrate disposed between the ink head and an ink storage supplying ink to the ink head, and having a socket provided on a surface thereof; and a lead frame provided on an upper surface of the ink head such that the intermediate substrate and the actuator are electrically connected to each other. | 06-09-2011 |
20110134196 | Inkjet head - There is provided an inkjet head including: a flow path plate having a plurality of ink chambers; a nozzle plate having a plurality of nozzles connected to the respective ink chambers in order to eject ink in the ink chambers to the outside; a piezoelectric actuator provided above the ink chambers and controlling pressure of the ink chambers; and a parylene protective film provided in order to prevent oxidization of the piezoelectric actuator. | 06-09-2011 |
20110162181 | Device for polling piezoelectric element and polling method using the same - A device for polling a piezoelectric element includes: a polling chamber in which a plurality of piezoelectric elements are disposed; a power supply unit providing voltage to poll the piezoelectric elements; a capacitance measurement unit connected with the piezoelectric elements to measure the capacitance of the piezoelectric elements; and a switching system connected with the power supply unit and the piezoelectric elements within the polling chamber, and selectively providing the voltage of the power supply unit to the piezoelectric elements. | 07-07-2011 |
20110169895 | Inkjet print head, wafer level package and method of manufacturing the same - There is provided an inkjet print head including an ink head and a chipping prevention portion. The ink head includes a nozzle for ejecting ink to the outside by a driving force of a piezoelectric actuator mounted on a surface of the ink head. The chipping prevention portion includes a cutting portion disposed at a side of the ink head and being cut so as to have a height lower than that of the nozzle. | 07-14-2011 |
20110181668 | Inkjet print head and manufacturing method thereof - There is provided an inkjet print head including: a body portion including a nozzle ejecting ink, an ink chamber connected to the nozzle so as to supply the ink to the nozzle, and a vibration plate transferring vibrations to the ink chamber and formed of an elastomer; an actuator mounted on the body portion in order to be arranged to correspond to the ink chamber and generating the vibrations transferred to the ink chamber; and a buffer layer allowing for an electrical connection with the actuator and having a Young's modulus greater than that of the body portion. | 07-28-2011 |
20110193915 | Piezoelectric actuator, inkjet head including the same, and method of manufacturing piezoelectric actuator - A piezoelectric actuator according to an aspect of the invention may include: upper and lower electrodes supplying a driving voltage; and a piezoelectric material formed by solidifying a piezoelectric liquid having viscosity between the upper and lower electrodes and providing a driving force to ink inside an ink chamber of an inkjet head. | 08-11-2011 |
20110205313 | Inkjet print head and method of manufacturing the same - There is provided an inkjet print head including: a pressure chamber storing ink in order to eject the ink to a nozzle; a piezoelectric actuator receiving part being recessed in order to correspond to the pressure chamber in a direction of the pressure chamber; and a piezoelectric actuator received in the piezoelectric actuator receiving part, in which viscous liquid having piezoelectric properties is filled and hardened, and supplying the pressure chamber with a driving force for ejection of the ink. | 08-25-2011 |
20120024088 | Dissolution properties measurement system using piezoelectric sensor - There is provided a dissolution properties measurement system using a piezoelectric sensor, capable of continuously measuring dissolution properties of a substrate in an aqueous solution by using the piezoelectric sensor. The dissolution properties measurement system includes: a specimen receiving unit including a chamber receiving a specimen therein; a mass measuring unit connected with the specimen to measure a mass change of the specimen in real time; and a dissolution properties measuring unit measuring a dissolution properties of the specimen on the basis of the value measured by the mass measuring unit. | 02-02-2012 |
20120024573 | Printed circuit board and manufacturing method thereof - There are provided a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: preparing a substrate having active regions and non-active regions, the non-active regions being formed on edges thereof; printing resists on dummy portions corresponding to the non-active regions of the substrate by using an inkjet printing method; curing the resists; and performing plating on the active regions of the substrate. The resists are masked on the dummy portions corresponding to the non-active regions of the substrate to prevent plating from being performed on the dummy portions, thereby reducing manufacturing costs. | 02-02-2012 |
20120113181 | Resist ink printing device - There is provided a resist ink printing device according to an exemplary embodiment of the present invention including: a transfer unit transferring a substrate on which lead-in wires for electrolytic gold plating are patterned into a main body; a controller formed on the main body to measure a warpage degree of the substrate and recognizing a gerber file stored with circuit diagram information of the substrate to compensate for the warpage degree of the substrate and correct the gerber file; and at least one inkjet printing head part discharging liquid photo resist ink to the lead-in wires by the corrected gerber file. | 05-10-2012 |
20120169447 | NANOCOMPOSITE POWDER FOR INNER ELECTRODE OF MULTILAYER CERAMIC ELECTRONIC DEVICE AND FABRICATING METHOD THEREOF - There are disclosed a nanocomposite powder for an inner electrode of a multilayer ceramic electronic device and a manufacturing method thereof. The nanocomposite powder for an inner electrode of a multilayer ceramic electronic device includes a first metal particle having electrical conductivity, and a second metal coating layer formed on a top surface or a bottom surface of the first metal particle and having a higher melting point than that of the first metal particle. | 07-05-2012 |
20130118541 | THERMOELECTRIC MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a thermoelectric module and a method of manufacturing the same. The thermoelectric module includes: a thermoelectric laminate in which a plurality of N-type thermoelectric sheets made of an N-type thermoelectric material and a plurality of P-type thermoelectric sheets made of a P-type thermoelectric material are alternately disposed in a vertical direction and each of insulating sheets is provided between the N-type thermoelectric sheets and the P-type thermoelectric sheets; metal electrodes provided on left and right ends of the thermoelectric laminate; and substrates provided on outer side surfaces of the metal electrodes. | 05-16-2013 |
20130265131 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to an electronic component having a primary coil pattern and a secondary coil pattern with at least one selected from a dielectric and an insulator interposed therebetween, which includes at least one discharge terminal for discharging overvoltage or overcurrent applied to the primary coil pattern or the secondary coil pattern, and a method for manufacturing the same. Since it is possible to efficiently discharge overvoltage or overcurrent applied to an electronic component, it is possible to improve reliability of various electronic devices to which the electronic component in accordance with an embodiment of the present invention is applied as well as to extend lifespan of the electronic component itself. | 10-10-2013 |
20130320492 | SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE - Disclosed herein is a substrate including: a base substrate; an insulating layer formed on an upper portion of the base substrate; a circuit layer formed in a form in which it is buried in the insulating layer; at least one electrode formed on upper portions of the circuit layer and the insulating layer and having a prominence and depression formed at a side thereof; and a dielectric layer formed in a form in which it surrounds the side of the electrode. | 12-05-2013 |
20150029623 | COMMON MODE FILTER - Disclosed herein is a common mode filter, including: first and second coil layers electromagnetically coupled to each other; a pair of external terminals connected to ends of the first coil layer and a pair of external terminals connected to ends of the second coil layer; a first ESD prevention member connecting between the pair of external terminals carrying electric current with the first coil layer and a second ESD prevention member connecting between the pair of external terminals carrying electric current with the second coil layer; and a ground electrode connecting the first ESD prevention member to the second ESD prevention member, wherein the ground electrode has a stepped portion formed at the center. | 01-29-2015 |