Patent application number | Description | Published |
20080203864 | ROTATABLE TOP SHELL - In one example, a rotatable top shell is provided for an example optoelectronic device. The rotatable top shell includes a body defining a curved tongue on one end. The tongue is configured to rotate about a complimenting curved mating surface of a bottom shell of the optoelectronic device to allow the body to rotate between an open position and a closed position. The rotatable top shell further includes means for securing the rotatable top shell relative to the bottom shell. The means for securing the rotatable top shell may include one or more of: a plurality of nubs defined along at least one edge of the body, a hole defined in the body for receiving a retention pin of the bottom shell, two sides for being received within a main cavity of the bottom shell, or the like. | 08-28-2008 |
20080205827 | PRINTED CIRCUIT BOARD POSITIONING MECHANISM - In one example embodiment, a printed circuit board positioning mechanism includes a solderable plate and a compressible structure attached to the solderable plate. | 08-28-2008 |
20080205893 | ANGULAR SEAM FOR AN ELECTRONIC MODULE - In one example embodiment, an angular seam includes a first complementary structure defined in a first shell of an optoelectronic transceiver module, and a second complementary structure defined in a second shell of the optoelectronic transceiver module. The second complementary structure is configured to receive the first complementary structure so that an angular seam is defined that is substantially non-transmissive to electromagnetic radiation. | 08-28-2008 |
20080205895 | OPTICAL SUBASSEMBLY POSITIONING DEVICE FOR AN ELECTRONIC MODULE - In one example embodiment, an optical subassembly (OSA) positioning device includes a front piece, a top back piece, and a top connector piece connecting the front piece and the top back piece, a bottom back piece, and a bottom connector piece connecting the from piece ad the bottom back piece. The front piece defines a first port. The first port is configured to receive and substantially secure a first OSA in an x-axis position and a y-axis position when the OSA positioning device is positioned within an optoelectronic module. The top and bottom connector pieces are deformable in response to an exerted force so as to bias a flange of the first OSA against a shell of the optoelectronic module such that the first OSA is secured in a z-axis position when the OSA positioning device is positioned within the optoelectronic module. | 08-28-2008 |
20080205896 | POSITIONING PLATE FOR OPTICAL SUBASSEMBLY - In one example, an optical subassembly positioning plate is provided that includes a substantially flat body that defines at least one edge. A port is defined in the body. The port is configured to receive and secure an optical subassembly in an x-direction and a y-direction when said optical subassembly positioning plate is positioned within an optoelectronic transceiver module. A plurality of fingers is defined along at least one edge of the body. Each of the plurality of fingers is configured to contact a shell of the optoelectronic transceiver module so as to bias a flange of the optical subassembly against a portion of the shell of the optoelectronic transceiver module such that the optical subassembly is substantially retained in a z-direction when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module. | 08-28-2008 |
20080207039 | COLLAR CLIP FOR AN ELECTRONIC MODULE - In one example embodiment, a collar clip includes a body that is sized and configured to partially encircle a shell of an optoelectronic transceiver module. Each extended element in a pair of the extended elements is separated from the other extended element in the pair by a cavity. Each cavity is configured to receive a portion of a corresponding structure of the shell. | 08-28-2008 |
20080232067 | MECHANISMS FOR HEAT TRANSFER IN AN OPTICAL TRANSCEIVER MODULE AND CARD CAGE SYSTEM - Mechanisms and systems for dissipating heat from an optical transceiver module to a module card cage system. In one embodiment, a thermal conductive label having at least one raised portion is attached to a surface of the module. The raised portion is configured to contact at least a portion of the card cage to dissipate heat from the module to the card cage. In another embodiment, the card cage has a protruding depression formed on a part of its surface that is above a slot configured to receive an optical transceiver module. The protruding depression is configured to contact at least a portion of the module to dissipate heat from the module to the card cage. | 09-25-2008 |
20080248683 | OPTOELECTRONIC MODULE RETENTION MECHANISM - A retention mechanism for an electronic or optoelectronic module. In one example embodiment, an optoelectronic module retention clip includes a base, a pair of arms extending from the base, and a protrusion extending from each arm. Each protrusion is configured to engage a complementary structure defined in a de-latch slide and a complementary structure defined in an optoelectronic module shell so as to prevent motion of the de-latch slide relative to the shell when the optoelectronic module retention clip is attached to the optoelectronic module. | 10-09-2008 |
20080315528 | Gasketed Collar For Reducing Electromagnetic Interference (Emi) Emission From Optical Communication Module - A gasketed collar for reducing EMI emission from a communication module is presented. The gasketed collar includes a conductive metal collar designed to fit at least partway around the communication module, and a gasket. The gasket is electrically conductive and compressible. The gasket fits at least partway around the communication module and overlaps the conductive metal collar. A communication module including such gasketed collar and a method of making such communication module are also presented. | 12-25-2008 |
20090015456 | ANECHOIC STRUCTURES FOR ABSORBING ELECTROMAGNETIC INTERFERENCE IN A COMMUNICATIONS MODULE - A communications module includes an interior configuration designed to intercept, disrupt, and scatter EMI produced by the module during operation. The interior configuration may include an anechoic structure that includes a plurality of anechoic elements positioned proximate EMI-producing components within the module. The anechoic elements may form truncated pyramids, columns having rounded tops, cones, or other shapes. The anechoic elements may be uniform or non-uniform in size, length, or shape and can be arranged in a periodic, non-periodic, or random pattern. In some embodiments, the anechoic elements may include cast zinc metal, Nickel, and/or radiation absorbent material, such as a mixture of iron and carbon. In operation, EMI impinging on the anechoic elements is scattered by their surfaces until absorbed by the elements or other structures of the module, thereby preventing the EMI from exiting the module. | 01-15-2009 |
20090032291 | SPIDER CLIP FOR SECURING A CIRCUIT BOARD WITHIN A COMMUNICATIONS MODULE - A clip for securing a component, such as a circuit board, within a communications module is disclosed. The clip may include a flat base with legs extending therefrom and resilient springs disposed at terminal ends of each of the legs. The legs may be configured to frictionally secure the clip to the module. For instance, the legs may secure the clip to a top shell portion of the module. The springs may be configured to resiliently compress against corresponding contact zones on the circuit board when the top shell is mated with a bottom shell of the module such that the circuit board is secured in place within the module. Accordingly, embodiments of the invention enable the quick and simple assembly of modules without the need for fasteners and other time-consuming and/or labor-intensive solutions conventionally implemented to secure circuit boards and other components within the modules. | 02-05-2009 |
20090148106 | LINE-SIDE OUT-OF-BAND ELECTRICAL INTERFACE FOR OPTOELECTRONIC MODULES - Electrical connections from the printed circuit board (“PCB”) of an optoelectronic device through the front or line-side of the device enable a microcontroller or other component on the PCB to electrically communicate with an optical connector or other line-side device. The electrical connections can be integrated within a lead frame and trace structure providing mechanical support for the electrical connections and the PCB, with each electrical connection including a PCB-side contact and a line-side contact supported by the integrated structure. Alternately, the electrical connections can be integrated within one or more flex circuits. The optical connector can include traces and contacts configured to be electrically coupled to corresponding line-side contacts when the optical connector is received within the device. | 06-11-2009 |
20090261955 | INTELLIGENT BAIL - An identification device is configured to be coupled externally to an optoelectronic device to provide connectivity and/or identification information in an optical network in which the optoelectronic device is implemented. The identification device may include an integrated circuit with unique identification information and a plurality of contacts coupled to the integrated circuit and configured to be coupled to an outside identification system. The outside identification system communicates with the identification device via the plurality of contacts to collect unique identification information, the ability to retrieve the unique identification information additionally implicating connectivity in some embodiments. The identification device may include a plurality of clips configured to engage corresponding posts on a latch of the optoelectronic device. | 10-22-2009 |
20090275230 | POWERED LATCHING MECHANISM FOR A MODULE - A latching system for use in selectively securing a module within a receptacle of a host device is described. In one or more examples, the latching system includes a powered actuation mechanism and a latching mechanism. In one or more examples, the module latching mechanism includes a latch and the powered actuation mechanism disengages a latch from a catch. In one or more examples, two latches are provided. In one or more examples, the latching mechanism of a module includes a pusher that interacts with a latch located on a receptacle. In one or more examples, a module includes two latches. | 11-05-2009 |