Patent application number | Description | Published |
20130333202 | Method for Manufacturing High Frequency Inductor - Disclosed herein is a method for manufacturing a high frequency inductor, the method including; forming a primary coil for manufacturing the high frequency inductor on a wafer; coating a primary PSV on the wafer on which the primary coil is formed; forming a secondary coil for manufacturing the high frequency inductor, after the coating of the primary PSV; coating a secondary PSV, after the forming of the secondary coil; forming a barrier layer on an electrode portion to be exposed of the high frequency inductor, after the coating of the secondary PSV; filling and curing an insulating resin on the wafer, after the forming of the barrier layer; and polishing the cured resin up to the barrier layer to expose the electrode. | 12-19-2013 |
20140062644 | THIN FILM TYPE COMMON MODE FILTER - Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained. | 03-06-2014 |
20140176280 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a common mode filter, inlcuding: an external magnetic layer; an insulating layer formed on the external magnetic layer and having coil electrodes therein; a protecting layer formed on the insulating layer; an internal magnetic layer formed inside an opening part formed in one surface of the protecting layer; and external electrode terminals passing through the protecting layer and connected with end portions of the coil electrodes, so that there can be provided a common mode filter having excellent durability, moisture resistance, and heat resistance. | 06-26-2014 |
20140176284 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a method of manufacturing a common mode filter forming a coil electrode by directly patterning metal layers laminated on both surfaces of a core insulating layer while not using a build-up process, and the common mode filter manufactured according to the method. | 06-26-2014 |
20140184377 | INDUCTOR - Disclosed herein is an inductor including: a substrate; an insulating part provided on the substrate; and a conductive pattern part provided in the insulating part, wherein the insulating part includes first and second insulating parts that are provided at regions physically separated from each other, the first and second insulating parts being made of materials of which at least one of dielectric constant and heat resistance are different. In the inductor according to the present invention, high Q and L values may be implemented, and deformation by heat treatment may also be decreased, thereby making it possible to improve reliability. | 07-03-2014 |
20140285304 | INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is an inductor including: a core layer having a conductive pattern formed on a surface thereof and having a through-hole formed at a region in which the conductive pattern is not formed; and a magnetic layer covering the core layer, wherein the magnetic layer includes: a filled part filled in the through-hole and having high magnetic material filling density; and a cover part covering the surface of the core layer and having magnetic material filling density lower than that of the filled part. | 09-25-2014 |
20140285305 | INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process. | 09-25-2014 |
20140320251 | THIN FILM CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a thin film chip device, including: a substrate; a circuit layer disposed on the substrate and having coil patterns; and a functional layer formed on the circuit layer and having an embossed shape. | 10-30-2014 |