Patent application number | Description | Published |
20080279028 | FLASH/DYNAMIC RANDOM ACCESS MEMORY FIELD PROGRAMMABLE GATE ARRAY - A circuit for selectively interconnecting two nodes in an integrated circuit device includes a memory array having a plurality of wordlines and a plurality of bitlines. A refresh transistor has a source coupled to one of the plurality of bitlines, a control gate coupled to a dynamic random access memory wordline and a drain. A switching transistor has a gate coupled to the drain of the refresh transistor, a source coupled to a first one of the nodes and a drain coupled to a second one of the nodes. An address decoder for supplies periodic signals to the wordlines and the dynamic random access memory wordline. | 11-13-2008 |
20090057821 | REPROGRAMMABLE METAL-TO-METAL ANTIFUSE EMPLOYING CARBON-CONTAINING ANTIFUSE MATERIAL - A reprogrammable metal-to-metal antifuse is disposed between two metal interconnect layers in an integrated circuit. A lower barrier layer is formed from Ti. A lower adhesion-promoting layer is disposed over the lower Ti barrier layer. An antifuse material layer selected from a group comprising at least one of amorphous carbon and amorphous carbon doped with at least one of hydrogen and fluorine is disposed over the lower adhesion-promoting layer. An upper adhesion-promoting layer is disposed over the antifuse material layer. An upper Ti barrier layer is disposed over the upper adhesion-promoting layer. | 03-05-2009 |
20090141539 | RADIATION TOLERANT SRAM BIT - In an integrated circuit, a radiation tolerant static random access memory device comprising a first inverter having an input and an output, a second inverter having an input and an output. A first resistor is coupled between the output of the first inverter and the input of the second inverter. A second resistor is coupled between the output of the second inverter and the input of the first inverter. A first write transistor is coupled to the output of the first inverter and has a gate coupled to a source of a first set of write-control signals and a second write transistor is coupled to the output of the second inverter and has a gate coupled to said source of a second set of write-control signals. Finally, a pass transistor has a gate coupled to the output of on of the first and second inverters. | 06-04-2009 |
20090159954 | NON-VOLATILE TWO-TRANSISTOR PROGRAMMABLE LOGIC CELL AND ARRAY LAYOUT - A two-transistor non-volatile memory cell is formed in a semiconductor body. A memory-transistor well is disposed within the semiconductor body. A switch-transistor well is disposed within the semiconductor body and is electrically isolated from the memory transistor well. A memory transistor including spaced-apart source and drain regions is formed within the memory-transistor well. A switch transistor including spaced-apart source and drain regions is formed within the switch-transistor well region. A floating gate is insulated from and self aligned with the source and drain regions of the memory transistor and switch transistor. A control gate is disposed above and aligned to the floating gate and with the source and drain regions of the memory transistor and the switch transistor. | 06-25-2009 |
20090189634 | SINGLE EVENT TRANSIENT MITIGATION AND MEASUREMENT IN INTEGRATED CIRCUITS - A method for single event transient filtering in an integrated circuit device is described. The device comprises three sequential elements, each having a data input and a data output with each of the three data outputs coupled to one of three inputs of a voting gate. The method comprises generating first and second nominally equivalent logic signals in first and second SET domains, converting the first and second nominally equivalent logic signals into first, second and third nominally equivalent data channels, and transmitting the first, second and third nominally equivalent data channels to the data inputs of the first, second and third sequential elements. | 07-30-2009 |
20090212343 | NON-VOLATILE TWO-TRANSISTOR PROGRAMMABLE LOGIC CELL AND ARRAY LAYOUT - A two-transistor non-volatile memory cell is formed in a semiconductor body. A memory-transistor well is disposed within the semiconductor body. A switch-transistor well is disposed within the semiconductor body and is electrically isolated from the memory transistor well. A memory transistor including spaced-apart source and drain regions is formed within the memory-transistor well. A switch transistor including spaced-apart source and drain regions is formed within the switch-transistor well region. A floating gate is insulated from and self aligned with the source and drain regions of the memory transistor and switch transistor. A control gate is disposed above and aligned to the floating gate and with the source and drain regions of the memory transistor and the switch transistor. | 08-27-2009 |
20090292937 | PROGRAMMABLE SYSTEM ON A CHIP - A programmable system-on-a-chip integrated circuit device comprises a programmable logic block, a non-volatile memory block, an analog sub-system, an analog input/output circuit block, and a digital input/output circuit block. A programmable interconnect architecture includes programmable elements and interconnect conductors. Ones of the programmable elements are coupled to the programmable logic block, the non-volatile memory block, the analog sub-system, the analog input/output circuit block, the digital input/output circuit block, and to the interconnect conductors, such that inputs and outputs of the programmable logic block, the non-volatile memory block, the analog sub-system, the analog input/output circuit block, and the digital input/output circuit block can be programmably coupled to one another. | 11-26-2009 |
20100038697 | NON-VOLATILE TWO-TRANSISTOR PROGRAMMABLE LOGIC CELL AND ARRAY LAYOUT - A two-transistor non-volatile memory cell is formed in a semiconductor body. A memory-transistor well is disposed within the semiconductor body. A switch-transistor well is disposed within the semiconductor body and is electrically isolated from the memory transistor well. A memory transistor including spaced-apart source and drain regions is formed within the memory-transistor well. A switch transistor including spaced-apart source and drain regions is formed within the switch-transistor well region. A floating gate is insulated from and self aligned with the source and drain regions of the memory transistor and switch transistor. A control gate is disposed above and aligned to the floating gate and with the source and drain regions of the memory transistor and the switch transistor. | 02-18-2010 |
20100044768 | REDUCED-EDGE RADIATION-TOLERANT NON-VOLATILE TRANSISTOR MEMORY CELLS - An edgeless one-transistor flash memory array includes transistors that have two polysilicon gate layers that overlay an active region. The bottom polysilicon gate layer is electrically isolated. The memory is configured such that current passes from drain to source under the bottom polysilicon layer, such that it does not approach a field oxide region. An edgeless two-transistor programmable memory includes memory cells that have two active devices. Two polysilicon gate layers overlay two active regions and are shared between the two active devices. One of the devices is used to program and erase the cell while the other used as a programmable switch in a programmable logic device. The bottom polysilicon gate layer is electrically isolated. The memory is configured such that current passes from drain to source under the bottom polysilicon layer, such that it does not approach a field oxide region. | 02-25-2010 |
20100060311 | CIRCUITS AND METHODS FOR TESTING FPGA ROUTING SWITCHES - An FPGA architecture includes multiplexers having non-volatile switches having control gates coupled to word lines W, each word line associated with a row, the switches connecting to wiring tracks through buffers having a controllable ground connection NGND, at least some of the switches being a tie-off switch coupleable to one of a plurality of bitlines B, each bitline associated with column. | 03-11-2010 |
20100149873 | PUSH-PULL FPGA CELL - A flash memory cell includes a p-channel flash transistor having a source, a drain, a floating gate, and a control gate, an n-channel flash transistor having a source, a drain coupled to the drain of the p-channel flash transistor, a floating gate, and a control gate, a switch transistor having a gate coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source, and a drain, and an n-channel assist transistor having a drain coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source coupled to a fixed potential, and a gate. | 06-17-2010 |
20100261326 | ISOLATED-NITRIDE-REGION NON-VOLATILE MEMORY CELL AND FABRICATION METHOD - An isolated-nitride-region non-volatile memory cell is formed in a semiconductor substrate. Spaced-apart source and drain regions are disposed in the semiconductor substrate forming a channel therebetween. An insulating region is disposed over the semiconductor substrate. A gate is disposed over the insulating region and is horizontally aligned with the channel. A plurality of isolated nitride regions are disposed in the insulating region and are not in contact with either the channel or the gate. | 10-14-2010 |
20100315118 | CIRCUITS AND METHODS FOR TESTING FPGA ROUTING SWITCHES - An FPGA architecture includes multiplexers having non-volatile switches having control gates coupled to word lines W, each word line associated with a row, the switches connecting to wiring tracks through buffers having a controllable ground connection NGND, at least some of the switches being a tie-off switch coupleable to one of a plurality of bitlines B, each bitline associated with column. | 12-16-2010 |
20100325598 | SINGLE EVENT TRANSIENT MITIGATION AND MEASUREMENT IN INTEGRATED CIRCUITS - A method for single event transient filtering in an integrated circuit device is described. The device comprises three sequential elements, each having a data input and a data output with each of the three data outputs coupled to one of three inputs of a voting gate. The method comprises generating first and second nominally equivalent logic signals in first and second SET domains, converting the first and second nominally equivalent logic signals into first, second and third nominally equivalent data channels, and transmitting the first, second and third nominally equivalent data channels to the data inputs of the first, second and third sequential elements. | 12-23-2010 |
20110001108 | FRONT TO BACK RESISTIVE RANDOM ACCESS MEMORY CELLS - A resistive random access memory device formed on a semiconductor substrate comprises an interlayer dielectric having a via formed therethrough. A chemical-mechanical-polishing stop layer is formed over the interlayer dielectric. A barrier metal liner lines walls of the via. A conductive plug is formed in the via. A first barrier metal layer is formed over the chemical-mechanical-polishing stop layer and in electrical contact with the conductive plug. A dielectric layer is formed over the first barrier metal layer. An ion source layer is formed over the dielectric layer. A dielectric barrier layer is formed over the ion source layer, and includes a via formed therethrough communicating with the ion source layer. A second barrier metal layer is formed over the dielectric barrier layer and in electrical contact with the ion source layer. A metal interconnect layer is formed over the barrier metal layer. | 01-06-2011 |
20110001115 | RESISTIVE RAM DEVICES FOR PROGRAMMABLE LOGIC DEVICES - A resistive random access memory device formed on a semiconductor substrate comprises an interlayer dielectric having a via formed therethrough. A chemical-mechanical-polishing stop layer is formed over the interlayer dielectric. A barrier metal liner lines walls of the via. A conductive plug is formed in the via. A first barrier metal layer is formed over the chemical-mechanical-polishing stop layer and in electrical contact with the conductive plug. A dielectric layer is formed over the first barrier metal layer. An ion source layer is formed over the dielectric layer. A dielectric barrier layer is formed over the ion source layer, and includes a via formed therethrough communicating with the ion source layer. A second barrier metal layer is formed over the dielectric barrier layer and in electrical contact with the ion source layer. A metal interconnect layer is formed over the barrier metal layer. | 01-06-2011 |
20110001116 | BACK TO BACK RESISTIVE RANDOM ACCESS MEMORY CELLS - A resistive random access memory device formed on a semiconductor substrate comprises an interlayer dielectric having a via formed therethrough. A chemical-mechanical-polishing stop layer is formed over the interlayer dielectric. A barrier metal liner lines walls of the via. A conductive plug is formed in the via. A first barrier metal layer is formed over the chemical-mechanical-polishing stop layer and in electrical contact with the conductive plug. A dielectric layer is formed over the first barrier metal layer. An ion source layer is formed over the dielectric layer. A dielectric barrier layer is formed over the ion source layer, and includes a via formed therethrough communicating with the ion source layer. A second barrier metal layer is formed over the dielectric barrier layer and in electrical contact with the ion source layer. A metal interconnect layer is formed over the barrier metal layer. | 01-06-2011 |
20110002167 | PUSH-PULL PROGRAMMABLE LOGIC DEVICE CELL - A memory cell includes a non-volatile p-channel transistor having a source coupled to a first potential, a drain, and a gate. A non-volatile n-channel transistor has a source coupled to a second potential, a drain, and a gate. A switch transistor has a gate coupled to a switch node, a source, and a drain. A stress transistor has a source and drain coupled between the drain of the non-volatile p-channel transistor and the drain of the non-volatile n-channel transistor, the stress transistor having a gate coupled to a gate bias circuit. Where one of the first or second potentials is a bit line, an isolation transistor is coupled between the other of the second potentials and one of the non-volatile transistors. | 01-06-2011 |
20110018070 | NON-VOLATILE PROGRAMMABLE MEMORY CELL AND ARRAY FOR PROGRAMMABLE LOGIC ARRAY - A non-volatile programmable memory cell suitable for use in a programmable logic array includes a non-volatile MOS transistor of a first conductivity type in series with a volatile MOS transistor of a second conductivity type. The non-volatile MOS transistor may be a floating gate transistor, such as a flash transistor, or may be another type of non-volatile transistor such as a floating charge-trapping SONOS, MONOS transistor, or a nano-crystal transistor. A volatile MOS transistor, an inverter, or a buffer may be driven by coupling its gate or input to the common connection between the non-volatile MOS transistor and the volatile MOS transistor. | 01-27-2011 |
20110024821 | PUSH-PULL FPGA CELL - A flash memory cell includes a p-channel flash transistor having a source, a drain, a floating gate, and a control gate, an n-channel flash transistor having a source, a drain coupled to the drain of the p-channel flash transistor, a floating gate, and a control gate, a switch transistor having a gate coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source, and a drain, and an n-channel assist transistor having a drain coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source coupled to a fixed potential, and a gate. | 02-03-2011 |
20110147821 | NON-VOLATILE TWO-TRANSISTOR PROGRAMMABLE LOGIC CELL AND ARRAY LAYOUT - A two-transistor non-volatile memory cell is formed in a semiconductor body. A memory-transistor well is disposed within the semiconductor body. A switch-transistor well is disposed within the semiconductor body and is electrically isolated from the memory transistor well. A memory transistor including spaced-apart source and drain regions is formed within the memory-transistor well. A switch transistor including spaced-apart source and drain regions is formed within the switch-transistor well region. A floating gate is insulated from and self aligned with the source and drain regions of the memory transistor and switch transistor. A control gate is disposed above and aligned to the floating gate and with the source and drain regions of the memory transistor and the switch transistor. | 06-23-2011 |
20130221316 | FRONT TO BACK RESISTIVE RANDOM ACCESS MEMORY CELLS - A resistive random access memory device formed on a semiconductor substrate comprises an interlayer dielectric having a via formed therethrough. A chemical-mechanical-polishing stop layer is formed over the interlayer dielectric. A barrier metal liner lines walls of the via. A conductive plug is formed in the via. A first barrier metal layer is formed over the chemical-mechanical-polishing stop layer and in electrical contact with the conductive plug. A dielectric layer is formed over the first barrier metal layer. An ion source layer is formed over the dielectric layer. A dielectric barrier layer is formed over the ion source layer, and includes a via formed therethrough communicating with the ion source layer. A second barrier metal layer is formed over the dielectric barrier layer and in electrical contact with the ion source layer. A metal interconnect layer is formed over the barrier metal layer. | 08-29-2013 |
20130235678 | NON-VOLATILE MEMORY ARRAY ARCHITECTURE OPTIMIZED FOR HI-RELIABILITY AND COMMERCIAL MARKETS - A sense amplifier arrangement includes a first sense amplifier having a first input and a second input. A second sense amplifier has a first input and a second input. A switching circuit is configured to selectively couple the first input of the first sense amplifier to a first bit line in the array and the second input of the first sense amplifier to a first bit line in the array to selectively couple the first input of the first sense amplifier to the first bit line in the array, the first input of the second sense amplifier to the second bit line in the array, and the second inputs of the first and second sense amplifiers to a reference voltage. | 09-12-2013 |
20130313650 | TID HARDENED MOS TRANSISTORS AND FABRICATION PROCESS - A radiation-hardened transistor is formed in a p-type body. An active region is disposed within the p-type body and has a perimeter defined by a shallow-trench isolation region filled with a dielectric material. Spaced-apart source and drain regions are disposed in the active region, forming a channel therebetween. A polysilicon gate is disposed above, aligned with, and insulated from the channel region. A p-type isolation ring is disposed in the p-type body separating outer edges of at least one of the source and drain regions from the perimeter of the active region. | 11-28-2013 |
20140246719 | Non-Volatile Push-Pull Non-Volatile Memory Cell Having Reduced Operation Disturb and Process for Manufacturing Same - A non-volatile memory cell includes a p-channel non-volatile transistor having a source and a drain defining a channel and a gate overlying the channel and an n-channel non-volatile transistor having a source and a drain defining a channel and a gate overlying the channel. In at least one of the p-channel non-volatile transistor and the n-channel non-volatile transistor, a lightly-doped drain region extends from the drain into the channel. | 09-04-2014 |