Patent application number | Description | Published |
20080274245 | Multicomponent Structures Having Improved Adhesion Between Components - The present invention includes a multicomponent structure comprising at least two components having a tie layer or adhesive layer directly between them, the tie layer comprising at least one olefin unsaturated ester copolymer and at least one photoinitiator and optionally a crosslinking enhancer. The tie layer is preferably irradiated with sufficient actinic radiation to result in increased interlayer adhesion strength between the two components as compared with the interlayer adhesion strength before treatment with the actinic radiation or between the components having a tie layer of the same composition except without the added photoinitiator or crosslinking enhancer. Without the photoinitiator, optionally crosslinking enhancer, and radiation the interlayer adhesion of the components is preferably less than 55 N/m. At least one of the components (first component or layer) preferably comprises a halopolymer, more preferably vinylidene chloride polymer, most preferably at least a majority of a vinyl idene chloride polymer. In another embodiment, at least one component exhibits interlayer adhesion strength similar to vinylidene chloride polymers. The structure optionally is or comprises such structures as a multilayer film, bag, or package, a lined or composite pipe, or other structure having more than one component. The tie layer is advantageously irradiated with an amount of UV light effective to increase the adhesion strength between the first and second components. | 11-06-2008 |
20130087198 | Electronic Device Module Comprising Heterogeneous Polyolefin Copolymer and Optionally Silane - An electronic device module comprising:
| 04-11-2013 |
20130087199 | Electronic Device Module Comprising Long Chain Branched (LCB), Block or Interconnected Copolymers of Ethylene and Optionally Silane - An electronic device module is disclosed comprising:
| 04-11-2013 |
20130112270 | ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER - An electronic device module comprises:
| 05-09-2013 |
20130118583 | ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER - An electronic device module comprising:
| 05-16-2013 |
20130167926 | Electronic Device Module Comprising Ethylene-Alpha Olefin Tapered Block Copolymers and Optional Vinyl Silane - An electronic device module such as a solar cell is described. The electronic device module is made using a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising a tapered block copolymer comprising an A block, and a B block. | 07-04-2013 |
20130206224 | Electronic Device Module Comprising Film of Homogeneous Polyolefin Copolymer and Adhesive Property Enhancing Graft Polymer - An electronic device module comprising:
| 08-15-2013 |
20130233383 | Electronic Device Module Comprising Film of Homogeneous Polyolefin Copolymer and Grafted Silane - An electronic device module comprising:
| 09-12-2013 |
20130269776 | SILANE-CONTAINING THERMOPLASTIC POLYOLEFIN COPOLYMER RESINS, FILMS, PROCESSES FOR THEIR PREPARATION AND PHOTOVOLTAIC MODULE LAMINATE STRUCTURE COMPRISING SUCH RESINS AND FILMS - Disclosure are films based on alkoxysilane-containing polyolefin resins with reduced melt strength, photovoltaic cell laminate structures and methods for their preparation. In the disclosed alkoxysilane-containing polyolefin resin films according to the invention, reduced melt strength is provided by, among other things, using optimized silane:initiator ratios and is shown to reduce detrimental film shrinkage and provide improved photovoltaic laminate structures. | 10-17-2013 |
20140096825 | MULTILAYERED POLYOLEFIN-BASED FILMS HAVING INTEGRATED BACKSHEET AND ENCAPSULATION PERFORMANCE COMPRISING A LAYER COMPRISING CRYSTALLINE BLOCK COPOLYMER COMPOSITE OR BLOCK COPOLYMER COMPOSITE - A multilayer film structure comprising a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B comprises a crystalline block composite resin or a block composite resin and bottom Layer C comprises a polyolefin having at least one melting point greater than 125° C. | 04-10-2014 |
20140174509 | MULTILAYERED POLYOLEFIN-BASED FILMS HAVING A LAYER COMPRISING A CRYSTALLINE BLOCK COPOLYMER COMPOSITE OR A BLOCK COPOLYMER COMPOSITE RESIN - Disclosed are multilayer film structures comprising a layer (B) that comprises a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), comprising i) an ethylene polymer (EP) comprising at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that comprises a polyolefin having at least one melting peak greater than 1255 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably comprises (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules comprising an electronic device such as a PV cell. Also disclosed is a lamination process to construct a laminated PV module comprising such multilayer film structures. | 06-26-2014 |
20150013753 | SILANE-CONTAINING ETHYLENE INTERPOLYMER FORMULATION INCLUDING FILMS AND ELECTRONIC DEVICE MODULE COMPRISING SAME - Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5×1015 ohm-cm as measured at 60 C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation (“PID”). | 01-15-2015 |