Patent application number | Description | Published |
20080242787 | Eucryptite ceramic filler and insulating composite material containing the same - The present invention relates a eucryptite ceramic filler and an insulating composite material containing the eucryptite ceramic filler. In particular, the invention provides a eucryptite ceramic filler of formula (I): | 10-02-2008 |
20090106977 | Manufacturing method of printed circuit board - A manufacturing method of a printed circuit board is disclosed. The method may include: forming a circuit pattern on a surface of an insulation layer, made primarily from a thermoplastic resin, such that the circuit pattern protrudes from the surface of the insulation layer, and burying the circuit pattern in the insulation layer by pressing the circuit pattern. | 04-30-2009 |
20090141481 | Array light source using led and backlight unit including the same - Disclosed are an array light source using a light-emitting diode and a backlight unit including the same. In accordance with an embodiment of the present invention, the array light source can include a plurality of light-emitting diodes (LED); and a wiring board on which wires for transferring signals to each of the LEDs are formed. Here, the wiring board can include a plurality of sublayers, and the wires can be divided into at least two wiring groups and separately formed on different sublayers of the wring board per wiring group. | 06-04-2009 |
20090168449 | Light emitting diode unit - Disclosed is a light emitting diode unit, more particularly, a light emitting diode unit including a thermoplastic substrate, a light emitting diode, mounted on one surface of the thermoplastic substrate and a heat sink, directly adhered to the other surface of the thermoplastic substrate. With the present invention, the manufacturing cost and the manufacturing time of the light emitting diode unit can be reduced by allowing the heat sink, discharging the heat generated by the light emitting diode, to be directly adhered to the substrate on which the light emitting diode is mounted. Also, the heat discharging ability of the light emitting diode unit by using the heat sink directly adhered to the thermoplastic substrate. | 07-02-2009 |
20090189177 | Light emitting diode package and manufacturing method thereof - Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin. | 07-30-2009 |
20090262520 | Backlight unit using a thermoplastic resin board - A backlight unit is disclosed. The backlight unit may include a thermoplastic resin board in which cavities may be formed, a light emitting diode (LED) component which may be mounted on a bottom surface of the cavity, and a molding resin which may be filled in the cavity and which may secure the light emitting diode component. The thermoplastic resin board may include a light-reflective filler, to improve reflection efficiency, dispersed within the thermoplastic resin board. According to certain embodiments of the invention, a simple process can be utilized to reduce the thickness of the backlight unit, making it applicable to compact devices. | 10-22-2009 |
20090288863 | GLASS COMPOSITION WITH LOW COEFFICIENT OF THERMAL EXPANSION, GLASS FIBER, INSULATING LAYER OF PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD - The present invention relates to a glass composition having a low thermal expansion coefficient, a glass fiber, an insulating layer of printed circuit board and a printed circuit board. A glass fiber, an insulating layer of printed circuit board and a printed circuit board may be obtained by employing a glass composition including 40 to 60 parts by weight of silicon oxide, 20 to 40 parts by weight of aluminum oxide and 5 to 20 parts by weight of lithium oxide. | 11-26-2009 |
20100271749 | DIELECTRIC BODY AND METHOD FOR PRODUCTION THEREOF - A dielectric body and a method of producing the dielectric body are disclosed. In accordance with an embodiment of the present invention, the dielectric body using a polymer matrix and being expressed in the following Reaction Scheme 1 includes two or more kinds of ceramic fillers having different x values in the following Reaction Scheme 1. In this way, a dielectric body having a stable dielectric constant as well as a high dielectric constant against the change in temperature can be manufactured. | 10-28-2010 |
20140017486 | CERAMIC LAMINATE SHEET WITH FLEXIBILITY AND PREPARATION METHOD THEREOF - Disclosed is a ceramic laminate sheet comprising a ceramic sheet having a plurality of cracks and a polymer resin layer disposed on one side or both sides of the ceramic sheet, wherein the plurality of cracks pass through the ceramic sheet from one side to the other side thereof, the cracks divide the ceramic sheet into a plurality of pieces, grooves for formation of the cracks are not provided in one side and the other side of the ceramic sheet. | 01-16-2014 |
20150017395 | CUT-OUT LAMINATED SHEET AND PREPARATION METHOD THEREOF - A cut-out laminated sheet can be prepared by laminating a protection sheet on a base sheet, followed by a simple two-step shearing process. The cut-out laminated sheet thus prepared features a protruding section that helps improving productivity by making the removal of the protection sheet easy; and thus, can be effectively used in a wide range of industrial applications such as a brittle sheet and a flexible sheet. | 01-15-2015 |