Patent application number | Description | Published |
20150062829 | ELECTRONIC DEVICE MODULE AND MANUFACTURING METHOD THEREOF - There are provided an electronic device module capable of increasing a degree of integration by mounting electronic components on both surfaces of a board, and a manufacturing method thereof. The electronic device module includes a board having mounting electrodes formed on both surfaces thereof, a plurality of electronic devices mounted on the mounting electrodes, a molded portion sealing the electronic devices, at least one connection wire having one end bonded to one surface of the board and the other end exposed to the outside of the molded portion, and an external connection terminal coupled to the other end of the connection wire. | 03-05-2015 |
20150131231 | ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF - There are provided an electronic component module allowing for a circuit wiring to be disposed outside of a molded part by a plating process, and a manufacturing method thereof, the electronic component module including a substrate; at least one electronic component mounted on the substrate; a molded part sealing the electronic component; a plurality of conductive connectors having one ends bonded to the substrate or one surface of the electronic component and formed in the molded part to penetrate through the molded part; and at least one plane pattern formed on an outer surface of the molded part and electrically connected to at least one of the conductive connectors. | 05-14-2015 |
20150131235 | ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF - There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step. | 05-14-2015 |
20150163913 | NESTED MODULE PACKAGE, AND METHOD FOR MANUFACTURING SAME - Disclosed herein is a superimposed module package, including: a printed circuit board; a first module electrically connected on the printed circuit board; and a second module superimposed between the printed circuit board and the first module to electrically connect the first module to the printed circuit board. According to the preferred embodiments of the present invention, the superimposed module package can secure the diversity of the product line-up by applying various combinations of the power module, the control module, the light emitting module, the storage module, and the like, to each module. | 06-11-2015 |
20150223361 | ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF - There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive. | 08-06-2015 |
20150228625 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - There are provided a semiconductor package and a method of manufacturing the same. According to an exemplary embodiment of the present disclosure, a semiconductor package includes: a semiconductor device formed in a multilayer; a plurality of wires electrically connected to both sides of a plurality of semiconductor devices; a first mold via electrically connected to the plurality of wires which are formed at one side of the plurality of semiconductor devices; a second mold via electrically connected to the plurality of wires which are formed at the other side of the plurality of semiconductor device; and a first molding part enclosing the plurality of semiconductor device and formed to expose upper surface parts of the first mold via and the second mold via. | 08-13-2015 |
20150289392 | ELECTRONIC DEVICE MODULE AND MANUFACTURING METHOD THEREOF - An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors. | 10-08-2015 |
20160007463 | ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME - An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor. | 01-07-2016 |