Patent application number | Description | Published |
20140217430 | OPTOELECTRONIC SEMICONDUCTOR UNIT AND MODULE COMPRISING A PLURALITY OF SUCH UNITS - A semiconductor unit ( | 08-07-2014 |
20140231855 | METHOD FOR PRODUCING A LIGHT-EMITTING DIODE AND LIGHT-EMITTING DIODE - A method of producing a light-emitting diode includes providing at least one light-emitting diode chip, providing a suspension comprising a solvent and particles of at least one luminescent material, arranging the at least one light-emitting diode chip in the suspension, electrophoretically depositing the particles on an outer face of the at least one light-emitting diode chip, and completing the light-emitting diode. | 08-21-2014 |
20140313728 | Arrangement comprising a light emitting diode - An arrangement for generating light comprising a light emitting diode, comprising a conversion element, is proposed, wherein the conversion element is arranged above the light emitting diode and is provided for at least partly changing the wavelength of the electromagnetic radiation emitted by the light emitting diode, wherein the conversion element is designed in such a way that the light impinging on the conversion element from outside in a first color range is reflected, wherein the conversion element is surrounded by an edge region, wherein the edge region is designed in such a way that light impinging on the edge region in a second color range is reflected, wherein the second color range at least partly has a color range complementary to the first color range. | 10-23-2014 |
20150022762 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND MODULE WITH A PLURALITY OF SUCH COMPONENTS - The invention relates to a semi-conductor component, comprising a semi-conductor chip ( | 01-22-2015 |
20150122785 | PROCESS OF PRODUCING A COMPONENT AND APPARATUS THAT PRODUCES A COMPONENT - A process of producing a component includes providing a substrate having an electrically conductive surface in the form of an electrically conductive layer; subdividing the layer with the aid of a laser process into a first electrically autonomous region and a second electrically autonomous region, wherein an electrically insulating region is formed in the electrically conductive layer to electrically separate the electrically autonomous regions; forming an electrical potential difference between the first electrically autonomous region and the second electrically autonomous region; and applying an electrically charged substance or an electrically charged substance mixture onto the first electrically autonomous region and/or the second electrically autonomous region, wherein the electrically autonomous region and/or an amount of the applied electrically charged substance or of the electrically charged substance mixture are adjusted by the electrical potential difference. | 05-07-2015 |
20150155446 | METHOD OF MANUFACTURING OPTOELECTRONIC COMPONENTS AND DEVICE FOR MANUFACTURING OPTOELECTRONIC COMPONENTS - A method of manufacturing optoelectronic components includes spraying a fluorescent layer of an optoelectronic component onto a substrate, the substance or the substance mixture of the fluorescent layer including an electric charge when sprayed on, and wherein the electrically charged substance or the at least partially electrically charged substance mixture includes a larger electric potential when the fluorescent layer is sprayed on than at least one area of the substrate; and locally adjusting the thickness of the fluorescent layer of the sprayed-on fluorescent substance when spraying on the fluorescent layer onto the substrate by an electric potential gradient. | 06-04-2015 |
20150200339 | Optoelectronic Semiconductor Component, Conversion-Medium Lamina and Method for Producing a Conversion-Medium Lamina - In at least one embodiment, the semiconductor component includes an optoelectronic semiconductors chip. Furthermore, the semiconductor component includes a conversion-medium lamina, which is fitted to a main radiation side of the semiconductor chip and is designed for converting a primary radiation into a secondary radiation. The conversion-medium lamina includes a matrix material and conversion-medium particles embedded therein. Furthermore, the conversion-medium lamina includes a conversion layer. The conversion-medium particles are situated in the at least one conversion layer. The conversion-medium particles, alone or together with diffusion-medium particles optionally present, make up a proportion by volume of at least 50% of the conversion layer. Furthermore, the conversion-medium lamina includes a binder layer containing the conversion-medium particles with a proportion by volume of at most 2.5%. | 07-16-2015 |
20150252963 | Lighting Device for Generating a Light Emission and Method for Generating a Light Emission - A lighting device, in various embodiments, for generating a light emission, has a light source designed to generate light with a first dominant wavelength, a first converter designed to absorb the light generated by the light source and to emit light with a second dominant wavelength, which is longer than the first dominant wavelength, and a second converter designed to absorb a portion of the light emitted by the first converter and to emit light such that the light emission has a third dominant wavelength, which is longer than the second dominant wavelength. | 09-10-2015 |
20150255683 | Method for Fixing a Matrix-Free Electrophoretically Deposited Layer on a Semiconductor Chip for the Production of a Radiation-Emitting Semiconductor Component, and Radiation-Emitting Semiconductor Component - A method can be used for fixing a matrix-free electrophoretically deposited layer on a semiconductor chip. A semiconductor wafer has a carrier substrate-and at least one semiconductor chip. The at least one semiconductor chip has an active zone for generating electromagnetic radiation. At least one contact area is formed on a surface of the at least one semiconductor chip facing away from the carrier substrate. A material is electrophoretically deposited on the surface of the at least one semiconductor chip facing away from the carrier substrate in order to form the electrophoretically deposited layer. Deposition of the material on the at least one contact area is prevented. An inorganic matrix material is applied to at least one section of a surface of the semiconductor wafer facing away from the carrier substrate in order to fix the material on the at least one semiconductor chip. | 09-10-2015 |
20150255688 | Converter Material, Method for Producing a Converter Material, and Optoelectronic Component - A converter material includes a porous inorganic matrix material having a multiplicity of pores. A multiplicity of inorganic nanoparticles are applied on the surface of the matrix material. The nanoparticles are suitable for converting electromagnetic radiation in a first wavelength range into electromagnetic radiation in a second wavelength range. A method for producing such a converter material and an optoelectronic component that includes such a converter material are furthermore specified. | 09-10-2015 |