Patent application number | Description | Published |
20090314825 | METHOD FOR SOLDERING WITH A MULTISTEP TEMPERATURE PROFILE - In soldering processes according to prior art, there is often an insufficient tie-up to a substrate of a component. A method in which no voids occur during the soldering processes is provided. A temperature pattern is proposed according to the method in which the temperature is lowered successively during the soldering operation. | 12-24-2009 |
20110017809 | Method for Soldering with a Multistep Temperature Profile - A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at a temperature plateau with a temperature that is lower than a temperature of the previous plateau. | 01-27-2011 |
20110079635 | REMOVAL OF BRAZED METAL SHEETS - A process including local heating of a brazing point in order to remove an integrally brazed component from a structural part is provided. The brazing point joins a metal sheet in the interior of a cavity to a structural part. The process makes the removal of the metal sheet from the cavity much easier compared to the existing mechanical removal. A plasma source or an induction source may be used for heating the filler metal. | 04-07-2011 |
20120308843 | METHOD OF MANUFACTURING A HOT-GAS COMPONENT WITH A COOLING CHANNEL AND A HOT-GAS COMPONENT THEREOF - A method of manufacturing a hot-gas component with cooling channels and a hot gas component manufactured by the method is provided. Pre-sintered preform materials are used for the manufacturing of a hot-gas component with a cooling channel. The method initially involves providing a carrier substrate for the hot-gas component and then providing a sheet of pre-sintered preform material. The sheet is then arranged on the carrier substrate so as to form the cooling channel. The sheet and the carrier substrate are then brazed to manufacture the hot-gas component with the cooling channel. | 12-06-2012 |
20130001277 | method for brazing a surface of a metallic substrate - A method for brazing a surface of a metallic substrate having a generally passive metal oxide layer includes activating the surface of the metallic substrate by machining the metallic substrate with a hard metal tool, grit blasting powdered particles of an activating material on the surface, and wetting the grit blasted surface of the metallic substrate with a filler material at a brazing temperature, wherein the activating material is reactive with the metal oxide layer at the brazing temperature. | 01-03-2013 |
20140230245 | METHOD FOR REPAIRING SURFACE DAMAGE TO A TURBOMACHINE COMPONENT - A method for repairing surface damage to a turbomachine component that has a base material which has titanium with the base material having TiAl6V4 and/or pure titanium is provided. The method includes the following steps: mixing a solder that has a titanium-containing alloy and a powder which is distributed in the solder and which has the base material; applying the solder onto turbomachine component areas where the surface damage is located; introducing a quantity of heat into the solder and into the turbomachine component such that the alloy liquefies and the areas are thus wetted; and cooling the solder such that the alloy solidifies. | 08-21-2014 |
20140272464 | METHOD FOR APPLYING A WEAR-RESISTANT LAYER TO A TURBOMACHINE COMPONENT - A method for applying a wear protection layer to a continuous flow machine component which has a base material comprising titanium is provided. The method includes the following steps: mixing a solder which comprises an alloy comprising titanium and particles which are distributed in the alloy and have a reaction agent; applying the solder to predetermined points of the continuous flow machine component; introducing a heat volume into the solder and the continuous flow machine component so that the alloy becomes liquid and the reaction agent changes through diffusion processes with the solder and undergoes a chemical reaction with the alloy, forming a hard aggregate; and cooling the solder so that the alloy becomes solid. | 09-18-2014 |
20140339206 | REMELTING METHOD AND SUBSEQUENT REFILLING AND COMPONENT - A method for re-melting and refilling a defect ( | 11-20-2014 |