Inadomi
Hiroaki Inadomi, Koshi-Shi JP
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20100255204 | SUBSTRATE HEATING APPARATUS AND METHOD AND COATING AND DEVELOPING SYSTEM - Disclosed is a substrate heating apparatus including a hot plate that heats a substrate, and a cooling plate that supports the substrate and moves between a first position (home position) and the second position above the hot plate to transfer wafers between the two positions. A heat-radiating fin structure is connected to the cooling plate to move together with the cooling plate. The fin structure is thermally connected to the cooling plate via heat pipes. A suction port is arranged so as to locate adjacent to the fin structure when the cooling plate is in the home position. The fin structure is cooled by a gas passing therethrough before flown into the suction port, whereby the cooling plate is cooled through heat transfer from the cooling plate to the fin structure through the heat pipes. | 10-07-2010 |
20110079240 | ULTRASONIC CLEANING APPARATUS, ULTRASONIC CLEANING METHOD, AND STORAGE MEDIUM STORING COMPUTER PROGRAM FOR EXECUTING ULTRASONIC CLEANING METHOD - An ultrasonic cleaning apparatus including: a cleaning tank for storing a cleaning liquid; an object-to-be-processed holder for insertion into the cleaning tank, the holder holding an object to be processed and immersing the object into the cleaning liquid; a vibrator disposed on a bottom part of the cleaning tank; and an ultrasonic oscillator configured to make the vibrator ultrasonically vibrate. In the cleaning tank, a lateral holding member configured to hold the object is disposed. The holder is configured to be laterally moved by a driving apparatus. The control device is configured to control the driving apparatus such that the holder is laterally moved after the object has been held by the lateral holding member, and the control device is configured to control the ultrasonic oscillator such that the vibrator is made to ultrasonically vibrate so that the ultrasonic vibration from the vibrator is propagated to the object. | 04-07-2011 |
Hiroaki Inadomi, Kumamoto-Ken JP
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20100326351 | APPARATUS AND METHOD FOR HEATING SUBSTRATE AND COATING AND DEVELOPING SYSTEM - A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated. | 12-30-2010 |
20100330815 | APPARATUS AND METHOD FOR HEATING SUBSTRATE AND COATING AND DEVELOPING SYSTEM - A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated. | 12-30-2010 |
Hiroaki Inadomi, Koshi City JP
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20120266925 | PROCESSING APPARATUS - Provided is a processing apparatus for performing a processing of a substrate to be processed using a high-pressure fluid to prevent the generation of particles and ensure airtightness in the processing container. A sealing member is installed to surround a carrying port of the processing chamber, the carrying port is closed by the cover, and the cover is restricted from retreating by the pressure in the processing chamber by a lock plate, thereby processing the wafer in the processing chamber using the high-pressure fluid. Since the sealing member is pressurized by the internal atmosphere of the processing chamber to be pressed toward the cover during the drying process, a gap between the cover and the processing chamber may be airtightly closed. Since the sealing member does not slide with respect to the processing chamber or the cover, the generation of particles is suppressed. | 10-25-2012 |
Hiroaki Inadomi, Kumamoto JP
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20130327363 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus is provided including: a liquid processing unit that processes a substrate with a processing liquid; a carry-in port formed in the liquid processing unit and configured to carry-in the substrate in a dry-state before the substrate is processed with the processing liquid; a carry-out port formed in the liquid processing unit and configured to carry-out the substrate in a wet-state after completing the liquid processing; a supercritical dry processing unit that performs a dry processing for the substrate using a supercritical fluid; a first substrate transport unit that transports the substrate in a dry-state before the substrate is processed with the processing liquid to the carry-out port of the liquid processing unit; and a second substrate transport unit that transports the substrate in a wet-state after completing the liquid processing from the carry-out port of the liquid processing unit to the supercritical dry processing unit. | 12-12-2013 |
20140145390 | HIGH-PRESSURE CONTAINER, SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR MANUFACTURING HIGH-PRESSURE CONTAINER - In the present disclosure, the high-pressure chamber includes a chamber main body including a flat rectangular parallelepiped block of a metal which is formed with a flat cavity that serves as a substrate processing space in which a processing using a high-pressure fluid is performed on a substrate, and the substrate processing space being formed by machining the block from one of faces of the block other than the widest face towards another face opposing thereto. In a case where the cavity is constituted as a through hole, the though hole is provided with a cover configured to open or close the cavity on one side of the through hole, and a second block configured to air-tightly seal the cavity on the other side. | 05-29-2014 |
Naoki Inadomi, Mie JP
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20150077202 | SPRING LOAD ADJUSTMENT STRUCTURE OF CONTACT DEVICE AND SPRING LOAD ADJUSTMENT METHOD OF CONTACT DEVICE - A contact device includes: fixed terminals; a movable contact maker; a pressing spring; an adjustment plate that comes into contact with an upper face of the movable contact maker; a holding; a movable shaft; and an electromagnet block. The holding portion is divided into first and second holding portions that are separated from each other. The first and second holding portions are electrically connected to each other via only the adjustment plate, due to the adjustment plate being sandwiched by a first side plate of the first holding portion and a second side plate of the second holding portion. The adjustment plate is moved in extending and contracting directions of the pressing spring, and the adjustment plate and each of the first and second side plates are subjected to resistance welding at a position at which pressing force of the pressing spring is a predetermined value. | 03-19-2015 |
Shunsuke Inadomi, Fukuoka JP
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20140371051 | Dry-sprayable unshaped refractory material - The present invention addresses a technical problem of realizing a sprayable refractory material capable of, even when used in a dry-spraying installation process, ensuring mixability between a silica sol and a refractory composition to promote a hardening reaction, thereby achieving excellent durability. Provided is a dry-sprayable unshaped refractory material which comprises a refractory composition, and a silica sol containing a silica solid component in a concentration of 20 mass % to 50 mass %. The silica sol is added in such a manner that the silica solid component contained in an entirety of the silica sol reaches an amount of 3 mass % to 30 mass % with respect to and in addition to an entirety of the refractory composition assumed as 100 mass %, and the refractory composition contains a Mg- or Ca-containing compound having a particle size of 10 μm or less, wherein a ratio of a content of the Mg- or Ca-containing compound having a particle size of 10 μm or less in the refractory composition to a content of the silica solid component in the entirety of the silica sol is 0.02 or more. | 12-18-2014 |
Yasuhiko Inadomi, Saitama JP
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20120291465 | COOLING SYSTEM FOR ELECTRONIC EQUIPMENT - A cooling system for electronic equipment includes an evaporator cooling the electronic equipment, a blower making air heated by the electronic equipment flow into the evaporator, and a condenser condensing a refrigerant to be supplied to the evaporator and also includes a refrigerant liquid pipe guiding a liquefied refrigerant from the condenser to a lower part of the evaporator, a refrigerant gas pipe guiding the refrigerant which evaporates by cooling the electronic equipment from an upper part of the evaporator to the condenser, a refrigerant flow rate control valve controlling a flow rate of the refrigerant flowing into the evaporator, a temperature sensor detecting a temperature of air obtained after passing through the evaporator, and a controller for control valve controlling the control valve on the basis of a detection value of the temperature sensor. | 11-22-2012 |
20130291575 | COOLING SYSTEM AND METHOD FOR OPERATING SAME - An air conditioning system for appropriately controlling the air conditioning capacity by preventing occurrence of cavitation of a refrigerant pump and a method of operating the system are provided. | 11-07-2013 |
Yasuhiko Inadomi, Tokyo JP
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20110127027 | COOLING METHOD AND COOLING SYSTEM OF ELECTRONIC DEVICE - A cooling method of an electronic device, the cooling method naturally circulating a cooling medium between an evaporator, which gasifies the cooling medium and cools heat-discharging air from the electronic device by heat exchange with the heat-discharging air, and a cooling tower or a condenser, which is disposed at a higher position than the evaporator and liquefies the gasified cooling medium, and subjecting a flow rate of the cooling-medium liquid supplied to the evaporator to valve control so that a temperature of the air obtained after the heat exchange and the cooling by the evaporator becomes a temperature suitable for an operating environment of the electronic device, wherein the improvement comprises that | 06-02-2011 |
Yasuhiko Inadomi, Saitama-Shi JP
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20110271695 | COOLING METHOD AND COOLING SYSTEM FOR ELECTRONIC DEVICE - A cooling method for an electronic device, comprising: | 11-10-2011 |
20110308262 | REFRIGERANT CIRCULATION APPARATUS - A refrigerant circulation apparatus includes: an evaporator which evaporates a refrigerant; a blowing device which blows air to the evaporator; a condenser configured to condense the refrigerant evaporated by the evaporator; a blower failure detecting device which detects failure of the blowing device; a heat medium flow rate control valve which controls a flow rate of a heat medium supplied to the condenser, the heat medium for cooling the refrigerant; a condenser refrigerant liquid temperature sensor which detects a temperature of the refrigerant which is supplied to the evaporator from the condenser; and condenser side refrigerant temperature control device which lowers a setting temperature of a condenser side externally inputted temperature and controls the heat medium flow rate control valve so that a measured value of the condenser refrigerant liquid temperature sensor becomes equal to the lowered setting temperature, when receiving a failure signal from the blower failure detecting device. | 12-22-2011 |
20110314853 | COOLING SYSTEM - A cooling system comprising an intake air temperature sensor which measures an intake air temperature to an evaporator by a blower; a return air temperature sensor which measures a return air temperature which is cooled in the evaporator; and a blower frequency switching device which switches a frequency of the blower, wherein the blower frequency switching device controls the frequency of the blower to a frequency of the blower corresponding to a difference between an intake air temperature which is measured by an intake air temperature sensor and a return air temperature which is measured by a return air temperature sensor. | 12-29-2011 |
20130091880 | COOLING SYSTEM AND COOLING METHOD - Cooling system and cooling method that enable preventing breakdown of coolant pump is provided. The cooling system, includes: evaporator for evaporating coolant by heat exchange with indoor air as an object of air conditioning; condenser for cooling and condensing coolant evaporated by evaporator; coolant liquid storage section that communicates with condenser and stores coolant liquid flowing in from condenser; coolant pump that communicates with coolant liquid storage section and pressure-transmits coolant liquid toward evaporator, the coolant liquid flowing in from coolant liquid storage section; coolant liquid detection units for individually detecting whether or not liquid level of coolant liquid stored in coolant liquid storage section is higher than or equal to respective plural heights including first height and second height higher than first height in coolant liquid storage section; and control unit that changes motor rotation speed of coolant pump, corresponding to detection result input from coolant liquid detection units. | 04-18-2013 |
20130091881 | COOLING SYSTEM AND METHOD FOR CONTROLLING COOLING SYSTEM - A cooling system includes an evaporator for evaporating a refrigerant to cool an object to be cooled; a refrigerant-supply-flow-rate regulator for regulating a flow rate of the refrigerant to be supplied to the evaporator; a condenser for condensing the refrigerant by cooling the refrigerant by use of a chilled fluid; and a chilled-fluid-flow-rate regulator for regulating a flow rate of the chilled fluid to be supplied to the condenser, the refrigerant condensed by the condenser being to be pressurized to be supplied to the evaporator. The chilled-fluid-flow-rate regulator regulates a flow rate of the fluid, to be supplied to the evaporator, for a temperature of the refrigerant condensed to come to a predetermined target refrigerant-liquid temperature, and the refrigerant-supply-flow-rate regulator regulates a flow rate of the refrigerant, to be supplied to the evaporator, for a temperature of the object cooled to come to a predetermined target cooling temperature. | 04-18-2013 |
20140000300 | COOLING SYSTEM AND COOLING METHOD | 01-02-2014 |