Patent application number | Description | Published |
20140339958 | PIEZOELECTRIC VIBRATING DEVICE - Provided is a piezoelectric vibrating device including a case provided with a certain space therein, a piezoelectric vibrating member provided in the case and vibrating according to an applied voltage, a weight member provided in the case and connected to a part of the piezoelectric vibrating member in a vibration direction of the piezoelectric vibrating member, and a limitation member for limiting movement of the weight member. | 11-20-2014 |
20140347773 | CIRCUIT PROTECTION DEVICE - Provided is a circuit protection device including a plurality of sheets selectively formed with at least one coil pattern, at least one withdrawal electrode, at least one hole filled with a conductive material, and at least one capacitor electrode and at least two inductors and at least two capacitors, in which the at least one coil pattern forms one inductor and a capacitor is formed between the capacitor electrode and the coil pattern. | 11-27-2014 |
20150122575 | SOUND AMPLIFICATION BOX AND SOUND AMPLIFICATION DEVICE INCLUDING THE SAME - Provided are a sound amplification box and a sound amplification device. The sound amplification box includes a body including a predetermined resonance space therein and having a surface contacting an electronic device, a resonance hole formed in at least one surface of the body, and a vibration transmission part in a predetermined region of the surface contacting the electronic device. | 05-07-2015 |
20150126112 | COMPLEX DEVICE AND ELECTRONIC DEVICE HAVING THE SAME - Provided are a complex device including a piezoelectric device, a wire patch cell (WPC) antenna disposed on one surface of the piezoelectric device, the WPC antenna being connected to two antenna patterns that are vertically spaced apart from each other, and a near field communication (NFC) antenna disposed outside the WPC antenna and an electronic device having the same. | 05-07-2015 |
20150214916 | STACKED CHIP DEVICE - The present disclosure relates to a stacked chip device including a first stack unit comprising a plurality of electrode patterns respectively disposed for a unit device region and common electrode patterns formed to be connected to cross the unit device regions, a second stack unit disposed on a top portion of the first stack unit and comprising a plurality of first conductor patterns, and a third stack unit disposed on a bottom portion of the first stack unit and comprising a plurality of second conductor patterns, wherein the first and second conductor patterns are formed on a plurality of sheets, the first and second conductor patterns formed on one sheet are formed across a plurality of unit device regions, and the first and second conductor patterns are connected vertically through vias formed penetrating through at least some of the sheets. | 07-30-2015 |
20150280682 | CIRCUIT PROTECTION DEVICE - A circuit protection device includes a plurality of sheets stacked in a vertical direction, each of which may include at least two conductive patterns formed separately from each other in a horizontal direction, and at least two common mode noise filters disposed in the horizontal direction, each of which includes at least two conductive patterns connected in the vertical direction. | 10-01-2015 |
20150285754 | SENSOR - Provided is a sensor including an insulating layer, at least two heater patterns separated in one direction in the insulating layer and electrically connected to each other, at least two sensing electrode patterns insulated form the heater patterns, separated in the one direction in the insulating layer, and electrically connected to each other, and a sensing material, at least a part of which is buried in the insulating layer to contact the sensing electrode patterns. | 10-08-2015 |
20150285772 | SENSOR DEVICE - Disclosed is a sensor device including a plurality of substrates vertically stacked, a plurality of heaters formed on at least one selected substrate and separated from each other in a horizontal direction, a plurality of sensing electrodes formed at least one selected substrate on a top portion of the substrate on which the plurality of heaters are formed and separated in the horizontal direction, and a plurality of materials configured to respectively contact the plurality of sensing electrodes and formed separately from each other. | 10-08-2015 |