Patent application number | Description | Published |
20090023281 | SOLDER BUMP FORMING METHOD - A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film. | 01-22-2009 |
20130284499 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes: a wiring substrate body including a first surface and a second surface; a first electrode pad including a first recess therein and foamed on the first surface of the wiring substrate body; a second electrode pad including a second recess therein and formed on the first surface of the wiring substrate body; a first solder resist layer on the first surface of the wiring substrate body to cover the first and second electrode pads, the first solder resist layer including a first opening and a second opening whose opening area is larger than that of the first opening; and a first metal layer electrically connected to the first electrode pad and made of a material whose ionization tendency is smaller than that of a material of the first electrode pad. A depth of the first recess is larger than that of the second recess. | 10-31-2013 |
20140138134 | WIRING SUBSTRATE - A wiring substrate includes: a connection pad having a first surface; a protective insulation layer formed on the first surface of the connection pad and having an opening portion therein, wherein a portion of the first surface of the connection pad is exposed from the opening portion; a metal layer having a lower surface facing the first surface of the connection pad and an upper surface opposite to the lower surface and formed on the first surface of the connection pad which is exposed from the opening portion, the metal layer including a raised portion that extends upward from the upper surface of the metal layer in a peripheral portion thereof; and a bump electrode formed on the upper surface of the metal layer. | 05-22-2014 |
20150029689 | BUMP STRUCTURE, WIRING SUBSTRATE, SEMICONDUCTOR APPARATUS AND BUMP STRUCTURE MANUFACTURING METHOD - A bump structure provided on an electrode pad includes a solder member, and a metal layer having a cylindrical portion covering a side surface of the solder member, the metal layer being made of a metal which is higher in melting point than the solder member. An upper part of the cylindrical portion of the metal layer is opened wide. | 01-29-2015 |