Patent application number | Description | Published |
20080214010 | SEMICONDUCTOR DEVICE FABRICATION METHOD AND PATTERN FORMATION MOLD - According to the present invention, there is provided a semiconductor device fabrication method comprising, bringing a mold having a predetermined pattern into contact with at least a portion of an imprinting material formed on a substrate to be processed, and forming the pattern on the substrate to be processed by sequentially transferring the pattern for each shot, wherein one of a dicing region and a monitor pattern formation region of the substrate to be processed is coated with the imprinting material. | 09-04-2008 |
20090045539 | PATTERN FORMING METHOD AND PATTERN FORMING APPARATUS - According to an aspect of the present invention, there is provided a pattern forming apparatus in which a mold having a pattern is brought into contact with an imprinting material on a substrate to transfer the pattern, the apparatus including: a holding part configured to hold the mold; a moving part configured to move the holding part so that the mold is brought into contact with the imprinting material on the substrate and that the mold is removed therefrom; and a control part configured to control so that at least one of conditions of removing the mold can be changed based on conditions of the pattern formed in the mold, the conditions including a rate and an angle of removing the mold. | 02-19-2009 |
20090095711 | MICROFABRICATION APPARATUS AND DEVICE MANUFACTURING METHOD - A microfabrication apparatus for pressing an original plate including a pattern down on a substrate to transfer the pattern on the substrate includes a first measurement unit for measuring relative positional displacement between the substrate and the plate above the substrate, a position correction unit for correcting relative position between the substrate and the plate such that the pattern is to be transferred on a first predetermined position of the substrate based on the relative positional displacement measured by the first measurement unit, a pressing unit for pressing the plate above the substrate down on the substrate to transfer the pattern on the substrate in a state that the relative positional displacement between the substrate and the plate is corrected by the position correction unit, and a second measurement unit for measuring relative positional relationship between the pattern transferred on the substrate and a pattern previously formed on the substrate. | 04-16-2009 |
20090267267 | IMPRINT METHOD - An imprint method includes contacting a template on a substrate, the template including a pattern to be transferred on the substrate, separating the template from the substrate, and removing particle adhered on the template before contacting the template on the substrate, the removing the particle including pressing the template on an adhesive member and separating the pressed template from the adhesive member, wherein adhesiveness of the adhesive member to the template is higher than adhesiveness of the adhesive member to the substrate. | 10-29-2009 |
20090267268 | IMPRINT SYSTEM AND IMPRINT METHOD - An imprint system has a design data storing section which stores template information and remaining film thickness set value information, a vaporization-to-be-compensated storing section which stores a plurality of distributions of applied amounts for compensating vaporization, an arithmetic section which calculates a distribution of an applied amount for filling a pattern based upon said template information, calculates a distribution of an applied amount for forming a remaining film thickness based upon said remaining film thickness set value information, calculates a pattern density of the template from said template information, extracts a distribution of an applied amount for compensating vaporization, corresponding to this pattern density, from said vaporization-to-be-compensated storing section, and adds up this extracted distribution of an applied amount for compensating vaporization, said distribution of an applied amount for filling a pattern, and said distribution of an applied amount for forming a remaining film thickness, to calculate a distribution of an applied amount of the imprint member, and an application section which applies the imprint member on the substrate based upon said distribution of an applied amount of the imprint member. | 10-29-2009 |
20090315223 | TEMPLATE AND PATTERN FORMING METHOD - A template includes a substrate, an element pattern formed on a surface of the substrate, and a light absorbing portion formed on or inside the substrate. | 12-24-2009 |
20100021848 | METHOD FOR FORMING PATTERN AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to an aspect of the present invention, there is provided a method for forming a pattern including: applying a photosensitive resin onto a film on a wafer substrate; partly exposing the photosensitive resin to light and developing the photosensitive resin to form a first pattern having an opening portion; applying a photo-curable material onto the film exposed by the opening portion of the first pattern; bringing one face of an optically-transmissive template having a second pattern formed on the one face into contact with the photo-curable material, the second pattern including projections and reentrants; irradiating the photo-curable material with light; and separating the template from the photo-curable material. | 01-28-2010 |
20100022036 | METHOD FOR FORMING PATTERN, AND TEMPLATE - According to an aspect of the present invention, there is provided a template including: a template substrate; patterns for forming device patterns on a wafer substrate; and a charging monitoring pattern, a size of the charging monitoring pattern being equal to a largest pattern in the patterns for forming the device patterns. | 01-28-2010 |
20100078860 | IMPRINT METHOD - An imprint method includes applying a light curable resin on a substrate to be processed, the substrate including first and second regions on which the light curable resin is applied, contacting an imprint mold with the light curable resin, curing the light curable resin by irradiating the light curable resin with light passing through the imprint mold, generating gas by performing a predetermined process to the light curable resin applied on a region of the substrate, the region including at least the first region, wherein an amount of gas generated from the light curable resin applied on the first region is larger than an amount of gas generated from the light curable resin of the second region, and forming a pattern by separating the imprint mold from the light curable resin after the gas being generated. | 04-01-2010 |
20100124601 | PATTERN FORMATION METHOD AND COMPUTER PROGRAM PRODUCT - A pattern forming method includes calculating amount of curable resin to be formed on a substrate, forming curable resin having the calculated amount on the substrate, filling a pattern of the template with the curable resin on the substrate by contacting the template with the curable resin on the substrate, curing the curable resin with the template being contacted with the curable resin, forming a pattern in the cured curable resin, which includes separating the template from the cured curable resin, and forming a pattern on the substrate based on the pattern formed in the curable resin, wherein the calculating the amount of curable resin to be formed on the substrate is performed based on a relationship between density or shape of a pattern to be formed on the template and filling time for filling the pattern to be formed on the template with the curable resin. | 05-20-2010 |
20100237045 | PATTERN FORMING METHOD - A pattern forming method includes determining an amount of curable resin to be formed on a substrate, the curable resin having volatility, the amount of the curable resin being determined by a calculation considering volatile loss of the curable resin, the calculation being performed for each of a plurality of regions of the substrate, forming the curable resin having the determined amount on the substrate, the forming the curable resin being performed for each of the plurality of regions of the substrate, contacting the curable resin formed on the substrate with a template, the template including a pattern to be filled with the curable resin by the contacting, and curing the curable resin under a condition where the curable resin is in contact with the template. | 09-23-2010 |
20100244326 | IMPRINT PATTERN FORMING METHOD - An imprint pattern forming method includes contacting a template with a pattern in a front surface with an imprint material formed in a substrate to fill the imprint material into the pattern, curing the imprint material filled in the pattern to form an imprint material pattern, and after forming the imprint material pattern, separating the template from the imprint material pattern while applying pressure to the back surface of the template. | 09-30-2010 |
20100264113 | TEMPLATE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF FORMING PATTERN - There is provided a template in which a gap region of a substrate to be processed can be covered with an imprint resist, a method of manufacturing the same, and a method of forming a pattern. | 10-21-2010 |
20110065254 | Semiconductor device fabrication method and pattern formation mold - According to the present invention, there is provided a semiconductor device fabrication method comprising, bringing a mold having a predetermined pattern into contact with at least a portion of an imprinting material formed on a substrate to be processed, and forming the pattern on the substrate to be processed by sequentially transferring the pattern for each shot, wherein one of a dicing region and a monitor pattern formation region of the substrate to be processed is coated with the imprinting material. | 03-17-2011 |
20110066273 | Imprint system and imprint method - An imprint system has a design data storing section which stores template information and remaining film thickness set value information, a vaporization-to-be-compensated storing section which stores a plurality of distributions of applied amounts for compensating vaporization, an arithmetic section which calculates a distribution of an applied amount for filling a pattern based upon said template information, calculates a distribution of an applied amount for forming a remaining film thickness based upon said remaining film thickness set value information, calculates a pattern density of the template from said template information, extracts a distribution of an applied amount for compensating vaporization, corresponding to this pattern density, from said vaporization-to-be-compensated storing section, and adds up this extracted distribution of an applied amount for compensating vaporization, said distribution of an applied amount for filling a pattern, and said distribution of an applied amount for forming a remaining film thickness, to calculate a distribution of an applied amount of the imprint member, and an application section which applies the imprint member on the substrate based upon said distribution of an applied amount of the imprint member. | 03-17-2011 |
20110237086 | TEMPLATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE TEMPLATE - According to one embodiment, there is provided a template which includes a first region and a second region. The first region is provided with a first pattern of a plurality of recessed portions formed on a main surface of the template, and has a first thickness. The second region is provided with a second pattern of a plurality of recessed portions formed on the main surface of the template, and has a second thickness different from the first thickness. The second pattern is different from the first pattern in at least one of interval and dimension of the recessed portions. | 09-29-2011 |
20120164346 | METHOD AND DEVICE FOR FORMING PATTERN - According to a method for forming a pattern in one embodiment, a first pattern is formed on a substrate, and an upper part of the first pattern is irradiated with ultraviolet rays, to enhance a liquid-repellent property to an inversion resin material. Furthermore, according to the method for forming the pattern, the inversion resin material is applied to the substrate after the irradiation of the ultraviolet rays, the first pattern is removed after the inversion resin material has been applied to form a second pattern containing the inversion resin material, and the substrate is processed using the second pattern as a mask. | 06-28-2012 |
20120214272 | METHOD OF MANUFACTURING ORGANIC THIN FILM SOLAR CELL - Certain embodiments provide a method of manufacturing an organic thin film solar cell comprising forming, on a first electrode, a first transport layer having an uneven pattern and a photoelectric conversion layer provided on a surface of the uneven pattern, forming a second transport layer on a second electrode, and bringing the uneven pattern having the photoelectric conversion layer is formed thereon into contact with the second transport layer to mold the second transport layer. | 08-23-2012 |
20120228804 | NEAR-FIELD EXPOSURE MASK, RESIST PATTERN FORMING METHOD, DEVICE MANUFACTURING METHOD, NEAR-FIELD EXPOSURE METHOD, PATTERN FORMING METHOD, NEAR-FIELD OPTICAL LITHOGRAPHY MEMBER, AND NEAR-FIELD NANOIMPRINT METHOD - A near-field exposure mask according to an embodiment includes: a silicon substrate; and a near-field light generating unit that is formed on the silicon substrate, the near-field light generating unit being a layer containing at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C, or a film stack formed with layers made of some of those materials. | 09-13-2012 |
20120295435 | PATTERN TRANSFER METHOD - In one embodiment, a pattern transfer method includes forming a photoreactive resin on a substrate to be processed. The method further includes pressing a mold against the photoreactive resin, the mold including a transparent substrate having a concave-convex pattern, and a light-blocking film provided on a part of surfaces of the concave-convex pattern. The method further includes irradiating the photoreactive resin with light through the mold in a state in which the mold is pressed against the photoreactive resin. The method further includes baking the photoreactive resin in a state in which the mold is pressed against the photoreactive resin after irradiating the photoreactive resin with the light. The method further includes releasing the mold from the photoreactive resin after baking the photoreactive resin. The method further includes rinsing the photoreactive resin with a rinsing solution after releasing the mold. | 11-22-2012 |
20130260290 | NEAR-FIELD EXPOSURE MASK AND PATTERN FORMING METHOD - A near-field exposure mask according to an embodiment includes: a substrate; a concave-convex structure having convexities and concavities and formed on one surface of the substrate; a near-field light generating film arranged at least on a tip portion of each of the convexities, the near-field light generating film being a layer containing at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C, or a film stack formed with layers made of some of those materials; and a resin filled in each of the concavities. | 10-03-2013 |
20140300018 | PATTERN FORMING METHOD AND PATTERN FORMING APPARATUS - According to an aspect of the present invention, there is provided a pattern forming apparatus in which a mold having a pattern is brought into contact with an imprinting material on a substrate to transfer the pattern, the apparatus including: a holding part configured to hold the mold; a moving part configured to move the holding part so that the mold is brought into contact with the imprinting material on the substrate and that the mold is removed therefrom; and a control part configured to control so that at least one of conditions of removing the mold can be changed based on conditions of the pattern formed in the mold, the conditions including a rate and an angle of removing the mold. | 10-09-2014 |