Patent application number | Description | Published |
20080244891 | Cutting Tools and Roughened Articles Using Surface Roughening Methods - The disclosure relates to surface roughening methods in which a cutting tool having a radial cutting blade with first and second cutting edges is fed along a longitudinal axis of an article while rotating the cutting tool about the axis. The first cutting edge forms a first machined pattern of peaks and valleys on a surface of the article, and the second cutting edge removes at least a portion of the peaks to form roughened fracture surfaces in a second machined pattern defining an arrangement of grooves, corresponding to the valleys, separated by lands, corresponding to the roughened fracture surfaces. The disclosure also provides cutting tools useful in practicing the surface roughening methods. The disclosure further describes cylindrical articles having interior or exterior surfaces roughened using the methods. The methods, cutting tools and articles have applications including fabrication of cylinder blocks for internal combustion engines. | 10-09-2008 |
20080245226 | Cutting Tools and Roughened Articles Using Surface Roughening Methods - The disclosure relates to surface roughening methods in which a cutting tool having a radial cutting blade with first and second cutting edges is fed along a longitudinal axis of an article while rotating the cutting tool about the axis. The first cutting edge forms a first machined pattern of peaks and valleys on a surface of the article, and the second cutting edge removes at least a portion of the peaks to form roughened fracture surfaces in a second machined pattern defining an arrangement of grooves, corresponding to the valleys, separated by lands, corresponding to the roughened fracture surfaces. The cross section of the grooves is substantially asymmetrical, and each groove may further include a notch. The disclosure also provides cutting tools useful in practicing the surface roughening methods. The disclosure further describes cylindrical articles having interior or exterior surfaces roughened using the methods. The methods, cutting tools and articles have applications including fabrication of cylinder blocks for internal combustion engines. | 10-09-2008 |
20080245227 | Cutting Tools and Roughened Articles Using Surface Roughening Methods - The disclosure relates to surface roughening methods in which a cutting tool having a radial cutting blade with first and second cutting edges is fed along a longitudinal axis of an article while rotating the cutting tool about the axis. The first cutting edge forms a first machined pattern of peaks and valleys on a surface of the article, and the second cutting edge removes at least a portion of the peaks to form roughened fracture surfaces in a second machined pattern defining an arrangement of grooves, corresponding to the valleys, separated by lands, corresponding to the roughened fracture surfaces. The first and second walls may include concave regions within the grooves. The disclosure also provides cutting tools useful in practicing the methods, and cylindrical articles having interior or exterior surfaces roughened using the methods. The methods may have applications to fabrication of cylinder blocks for internal combustion engines. | 10-09-2008 |
Patent application number | Description | Published |
20090211786 | PROCESS FOR PRODUCING POLYIMIDE FILM WITH COPPER WIRING - Is disclosed a process for producing a copper-wiring polyimide film from a carrier-accompanied copper foil laminated polyimide film by a subtractive method or a semi-additive method. Washing the polyimide surface exposed by etching the copper foil with a etching solution capable of removing mainly at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals used for a surface treatment of the copper foil restrains an anomalous deposition of plating substances when the copper wiring is plated with tin. | 08-27-2009 |
20090266589 | PROCESS FOR PRODUCING METAL WIRING BOARD - Is disclosed a process for producing a metal wiring substrate comprising a heat resistant resin substrate and a metal wiring which is laminated on the substrate and in which a surface laminated with the substrate is surface-treated with at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals (hereafter, the metal used for the surface-treatment is referred to as a surface-treatment metal). This process comprises the steps of forming the metal wiring on the resin substrate, and washing at least a surface of the resin substrate with an etching solution capable of removing the surface-treatment metal to increase adhesion of the surface of the resin substrate. The produced metal wiring substrate has excellent adhesion with adhesives for affixing anisotropic conductive films and IC chips to films. | 10-29-2009 |
20100203324 | LAMINATE OF HEAT RESISTANT FILM AND METAL FOIL, AND METHOD FOR PRODUCTION THEREOF - A laminate of the present invention is a laminate having a metal foil on one side or both sides of a heat resistant film in which the metal foil is laminated on the heat resistant film via a cured layer of a terminal-modified oligomer obtained by reacting simultaneously or successively a tetracarboxylic dianhydride and a diamine in a molar ratio of n:(n+1) (n is a number of 2 to 6) and a carboxylic acid compound having an unsaturated group, which is formed by heating and reacting the terminal-modified oligomer. The laminate of a heat resistant film and a metal foil may be easily produced. Moreover, the laminate may have excellent adhesive properties and excellent heat resistance, and withstand a soldering process or a high temperature process for mounting a chip on a substrate. | 08-12-2010 |
20120241005 | AROMATIC POLYIMIDE FILM, LAMINATE, AND SOLAR CELL - A CIS solar cell having flexibility and high conversion efficiency may be produced, using, as a substrate, a polyimide film which is prepared from an aromatic tetracarboxylic acid component comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride as the main component and an aromatic diamine component comprising p-phenylenediamine as the main component, and has a maximum dimensional change in the temperature-increasing step of from 25° C. to 500° C. within a range of from +0.6% to +0.9%, excluding +0.6%, based on the dimension at 25° C. before heat treatment. | 09-27-2012 |
20130011651 | POLYIMIDE FILM, AND PROCESS FOR PRODUCING POLYIMIDE FILM - The present invention relates to a polyimide film which is obtained by the reaction of a tetracarboxylic acid component and a diamine component and has an orientation anisotropy, in which the variations in the orientation angle in the width direction are within ±10°. | 01-10-2013 |
Patent application number | Description | Published |
20090202390 | AUTOMATIC ANALYZER - An automatic analyzer includes a storage unit for storing operation information, information about usage histories of expendable supplies provided for the analysis, and an analysis-ID control unit giving an ID to the analysis, the analysis ID being used as information for identifying the analysis to derive a calibration curve. Data stored in the storage unit is organized along the same time axis both in the order of samples subjected to the analysis and inspection, and in the order of analysis items, so that the data is output in a total data display area. The data is organized from the viewpoint of an analysis process of an analysis item of each sample. By use of information used to identify an influence range based on a kind of an abnormal state, which is stored beforehand, a judgment is made as to whether or not it is necessary to perform reinspection. | 08-13-2009 |
20120258525 | DEVICE FOR BACTERIA CLASSIFICATION AND PRETREATMENT DEVICE FOR BACTERIA TEST - When automatically classified results are different from judgment of a laboratory technician, the laboratory technician has to reselect the bacterial colonies one-by-one to be a pickup colony through watching the displayed image. To get rid of the inconvenience, provided is a pretreatment device for a bacteria test comprising: a specification unit by which an operator instructs to specify the number of bacterial colonies and the increased/decreased number of the bacterial colonies to be displayed; and a display unit for displaying classification results obtained following the operator's instruction. The pretreatment device for a bacteria test facilitates the automatically classified results to be brought close to the judgment of the laboratory technician, resulting in the saving of the time required for checking the appropriate bacterial colonies for the pickup colony. | 10-11-2012 |
20150087017 | DEVICE FOR BACTERIA CLASSIFICATION AND PRETREATMENT DEVICE FOR BACTERIA TEST - When automatically classified results are different from judgment of a laboratory technician, the laboratory technician has to reselect the bacterial colonies one-by-one to be a pickup colony through watching the displayed image. To get rid of the inconvenience, provided is a pretreatment device for a bacteria test comprising: a specification unit by which an operator instructs to specify the number of bacterial colonies and the increased/decreased number of the bacterial colonies to be displayed; and a display unit for displaying classification results obtained following the operator's instruction. The pretreatment device for a bacteria test facilitates the automatically classified results to be brought close to the judgment of the laboratory technician, resulting in the saving of the time required for checking the appropriate bacterial colonies for the pickup colony. | 03-26-2015 |
Patent application number | Description | Published |
20130337586 | POLISHING METHOD - A method of polishing a substrate includes: performing a first polishing process of bringing the substrate into sliding contact with a polishing pad on a first polishing table to polish a metal film; performing a second polishing process of bringing the substrate into sliding contact with a polishing pad on a second polishing table to polish the metal film until a conductive film is exposed; performing a third polishing process of bringing the substrate into sliding contact with a polishing pad on a third polishing table to polish at least the conductive film; and performing a fourth polishing process of bringing the substrate into sliding contact with a polishing pad on a fourth polishing table to polish at least a dielectric film. | 12-19-2013 |
20140017824 | POLISHING METHOD - A method of polishing a substrate having a film is provided. The method includes: performing polishing of the substrate in a polishing section; transporting the polished substrate to a wet-type film thickness measuring device prior to cleaning and drying of the substrate; measuring a thickness of the film by the wet-type film thickness measuring device; comparing the thickness with a predetermined target value; and if the thickness has not reached the predetermined target value, performing re-polishing of the substrate in the polishing section prior to cleaning and drying of the substrate. | 01-16-2014 |
20140030826 | POLISHING METHOD - A method of polishing a wafer having a Ru film and a Ta film or TaN film beneath the Ru film is provided. This polishing method includes: polishing the Ru film by bringing the wafer into sliding contact with a polishing pad; measuring a thickness of the Ru film by a film thickness sensor while polishing the Ru film; calculating a derivative value of an output value of the film thickness sensor; detecting a predetermined point of change in the derivative value; and determining a removal point of the Ru film from a point of time when the point of change is detected. | 01-30-2014 |
20150017880 | FILM-THICKNESS MEASURING APPARATUS, FILM-THICKNESS MEASURING METHOD, AND POLISHING APPARATUS HAVING THE FILM-THICKNESS MEASURING APPARATUS - A film-thickness measuring apparatus and a film-thickness measuring method capable of improving an accuracy of the film-thickness measurement are disclosed. The film-thickness measuring apparatus includes a substrate stage configured to support a substrate horizontally, a rinsing water supply structure configured to supply rinsing water onto an entire surface of the substrate on the substrate stage, a film-thickness measuring head configured to transmit light to a measurement area of the surface of the substrate on the substrate stage, produce a spectrum of reflected light from the measurement area, and determine a film thickness of the substrate from the spectrum, and a fluid supply structure configured to form a flow of a gas on a path of the light and supply the flow of the gas onto the measurement area. | 01-15-2015 |
Patent application number | Description | Published |
20100019235 | ORGANIC ELECTROLUMINESCENCE ELEMENT AND PRODUCTION METHOD THEREOF - A method of producing an organic EL element that allows easier patterning of the organic EL layer and reduction of the damage of the electrode layer caused by the organic EL layer and is superior in emission characteristics. Also provided is an organic electroluminescence element, including a substrate, a first electrode layer, a wettability variable layer, an organic EL layer, and a second electrode layer sequentially laminated. The wettability variable layer changes its wettability under the action of a photocatalyst caused by energy irradiation, is inactive to the energy, and has on the surface, a wettability variable pattern having an organopolysiloxane-containing lyophilic region and a liquid repellent region containing a fluorine-containing organopolysiloxane. | 01-28-2010 |
20100096622 | ORGANIC ELECTROLUMINESCENCE ELEMENT - An organic EL element which has no layer that prevents penetration of holes and electrons to the counter electrode. The organic EL element includes: an anode, a hole injecting and transporting layer formed on the anode, a light emitting layer formed on the hole injecting and transporting layer, an electron injecting and transporting layer formed on the light emitting layer, and a cathode formed on the electron injecting and transporting layer. Ip | 04-22-2010 |
20100224856 | ELECTROLUMINESCENT DEVICE - Provided is an electroluminescent device which has a luminescent layer including quantum dots and which are excellent in life characteristics. An electroluminescent device ( | 09-09-2010 |
20100237323 | ELECTROLUMINESCENT DEVICE - An electroluminescent device comprising a pair of electrodes, and an electroluminescent layer containing at least a luminescent layer, situated between the electrodes. The luminescent layer has a matrix material containing at least one organic compound, and quantum dots whose surfaces are protected by a protective material and that are dispersed in the matrix material. The protective material contains a first protective material. The absolute value of the ionization potential Ip(h), the absolute value of the electron affinity Ea(h), and the band gap Eg(h) of the first protective material, the absolute value of the ionization potential Ip(m), the absolute value of the electron affinity Ea(m), and the band gap Eg(m) of the organic compound, and the band gap Eg(q) of the quantum dots fulfill all of the conditions (A) to (C): (A) Ip(h)Ea(m)−0.1 eV, and (C) Eg(q)09-23-2010 | |
20100258789 | ELECTROLUMINESCENT DEVICE - The present invention provides an EL device that contains a quantum-dots-containing layer in which quantum dots hardly coagulate even under high-temperature conditions, e.g., at a temperature of 90° C. or more, that has a good performance even if heat treatment was carried at a high temperature in its production process, that can retain its emission characteristics for a prolonged period of time, and that has high durability. | 10-14-2010 |
20120181914 | HEAT-CONDUCTIVE SEALING MEMBER AND ELECTROLUMINESCENT ELEMENT - Provided is a heat-conductive sealing member which has high moisture barrier properties, has heat dissipation properties, and is capable of encapsulating an element by a simple method. The heat-conductive sealing member has a metal base material, an insulating layer that is formed on the metal base material, has heat conductivity and contains at least polyimide, and a tacky adhesive layer that is formed on the insulating layer and has heat resistance. | 07-19-2012 |