Patent application number | Description | Published |
20110137424 | Shoulder Prosthesis Assembly having Glenoid Rim Replacement Structure - A prosthesis assembly for use with a scapula is disclosed. The prosthesis assembly includes a glenoid bearing support and a bearing. The glenoid bearing support includes a glenoid vault-occupying portion configured to occupy at least a portion of a glenoid vault of the scapula, the glenoid-vault occupying portion having a first coupling component. The glenoid bearing support further includes a glenoid rim replacement portion attached to the glenoid vault-occupying portion. The bearing defines a bearing surface and has a second coupling component configured to cooperate with the first coupling component to couple the bearing to the glenoid vault-occupying portion. The glenoid vault-occupying portion defines a bearing-side end portion and an opposite-side end portion. The glenoid rim replacement portion projects outwardly from the bearing-side end portion of the glenoid vault-occupying portion. The glenoid bearing support defines a bone graft receptacle. | 06-09-2011 |
20130150974 | GLENOID VAULT FIXATION - A joint prosthesis system, specifically a shoulder prosthesis, for shoulder replacement, revision and repair. The implants provide fixation into the best bone available to a surgeon. The implants are used in a superior-inferior and anterior-posterior construct forming a type of cross or X-shape. The implants allow for interchangeability of the articulating component as well as rotational orientation. The systems will allow for augments to accommodate bone loss. The implants may allow for additional security using screws or anchors inserted into the scapula. | 06-13-2013 |
20130150975 | Shoulder Arthroplasty - A joint prosthesis system, specifically a shoulder prosthesis, for shoulder replacement, revision and repair. The implants provide fixation into the best bone available to a surgeon. The implants are used in a superior-inferior and anterior-posterior construct forming a type of cross or X-shape. The implants allow for interchangeability of the articulating component as well as rotational orientation. The systems will allow for augments to accommodate bone loss. The implants may allow for additional security using screws or anchors inserted into the scapula. | 06-13-2013 |
Patent application number | Description | Published |
20080281185 | REMOTE MONITORING SYSTEM AND METHOD - A remote control system for a modulatable device is provided. The remote control system comprises a receiver system coupled to the modulatable device and configured to obtain an output characteristic of the modulatable device, the receiver system being located remotely with respect to the modulatable device. The system further comprises a command signal setting system coupled to the receiver system and configured to use the output characteristic to generate a drive command signal and a bias system coupled to the command signal setting system and configured to receive the drive command signal and set a bias point of the modulatable device based on the drive command signal. The bias system is located locally with respect to the modulatable device. The command signal setting system and the bias system are coupled via a first optical conduit. | 11-13-2008 |
20090096088 | SEALED WAFER PACKAGING OF MICROELECTROMECHANICAL SYSTEMS - Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants. | 04-16-2009 |
20090103160 | APPARATUS AND METHOD OF FORMING HIGH PERFORMANCE INTEGRATED RF OPTICAL MODULE - An integrated electro-optical module apparatus includes in one embodiment an optical modulator configured to modulate an input optical signal coupled thereto; and a control circuit assembly configured to provide electrical control signals to the optical modulator to modulate the input optical signal; wherein the control circuit assembly is attached to the optical modulator in a stacked arrangement. | 04-23-2009 |
20090309241 | ULTRA THIN DIE ELECTRONIC PACKAGE - A method for forming an ultra thin die electronic package is provided. The method includes disposing a first polymer film on a first substrate. The method also includes applying a first adhesive layer to the first polymer film on the first substrate. The method further includes disposing at least one die on the first adhesive layer on the first substrate. The method also includes disposing a second polymer film on at least one additional substrate. The method further includes applying a second adhesive layer to the second polymer film on the at least one additional substrate. The method further includes attaching the first substrate and the at least one additional substrate via the first adhesive layer and the second adhesive layer such that the at least one die is interspersed between. The method also includes forming multiple vias on at least one of a top side, and at least one of a bottom side of the first and the at least one additional substrate, wherein the multiple vias are attached to the die. The method further includes forming an electrical interconnection between the first substrate, the at least one additional substrate and a die pad of the at least one die. | 12-17-2009 |
20110068792 | SYSTEM AND METHOD FOR MAGNETIC RESONANCE COIL ACTUATION - An apparatus includes a plurality of magnetic resonance (MR) coil elements and a plurality of voltage-actuated switches coupled to the plurality of MR coil elements, each voltage-actuated switch configured to selectively activate a respective MR coil element. The apparatus also includes a voltage source configured to supply a voltage to the plurality of voltage-actuated switches, a control unit coupled to the voltage source, and a plurality of transmission lines coupled to the plurality of voltage-actuated switches and to the control unit and configured to provide an actuation signal from the voltage source to the plurality of voltage-actuated switches. The plurality of transmission lines being free of discrete resistive elements and having a substantially uniform resistivity such that an interaction between the plurality of transmission lines and the plurality of MR coil elements is minimized and thermal dissipation is distributed over a length of each of the plurality of transmission lines. | 03-24-2011 |
20120249261 | SYSTEMS AND METHODS FOR ENHANCING RELIABILITY OF MEMS DEVICES - A micro-electromechanical system (MEMS) device that in one embodiment includes at least two MEMS switches coupled to each other in a back-to-back configuration. The first and second suspended elements corresponding to first and second MEMS switches are electrically coupled. Further, first and second contacts corresponding to the first and second MEMS switches are configured such that a differential voltage between the second suspended element and the second contact is approximately equal to a differential voltage between the first suspended element and the first contact. The MEMS device includes at least one actuator coupled to one or more of the first and second suspended elements to actuate one or more of the first and the second suspended elements. In one example, the MEMS device includes one or more passive elements coupled to one or more of the first and second MEMS switches. | 10-04-2012 |
20120326730 | SENSOR ASSEMBLY AND MICROWAVE EMITTER FOR USE IN A SENSOR ASSEMBLY - A microwave probe for use in a microwave sensor assembly includes an emitter body and an emitter coupled to the emitter body. The emitter includes a first portion, a second portion, and a connecting portion coupling the first portion to the second portion. The first portion and the second portion generate an electromagnetic field when at least one microwave signal is received, and a loading is induced to the emitter when an object is positioned within the electromagnetic field. | 12-27-2012 |
20140183340 | OPTICALLY CONTROLLED MEMS SWITCH AND METHOD OF USING THE SAME - The present embodiments are directed towards the optical control of switching an electrical assembly. For example, in an embodiment, an electrical package is provided. The electrical package generally includes a micro electromechanical systems (MEMS) device configured to interface with an electrical assembly, the MEMS device being operable to vary the electrical assembly between a first electrical state and a second electrical state, a MEMS device driver in communication with the MEMS device and being operable to produce high voltage switching logic from an electrical signal, and an optical detector in communication with the MEMS device driver and configured to produce the electrical signal from an optical signal produced by a light source in response to an applied current-based electrical control signal. | 07-03-2014 |
Patent application number | Description | Published |
20110267027 | SYSTEMS, METHODS, AND APPARATUS FOR DETECTING LIGHTNING STRIKES - Certain embodiments of the invention may include systems, methods, and apparatus for providing detecting lightning strikes. According to an example embodiment of the invention, a method for determining a lightning strike event, classification, and location is provided. The method includes receiving lightning electrical current in least one down conductor, generating voltage and polarity signals based at least in part on the received lightning electrical current, storing the generated voltage and polarity signals, and determining the lightning strike event, classification, and location based at least in part on the stored voltage and polarity signals. | 11-03-2011 |
20120176135 | OPTICALLY CONTROLLED MEMS SWITCH AND METHOD OF USING THE SAME - The present embodiments are directed towards the optical control of switching an electrical assembly. For example, in an embodiment, an electrical package is provided. The electrical package generally includes a micro electromechanical systems (MEMS) device configured to interface with an electrical assembly, the MEMS device being operable to vary the electrical assembly between a first electrical state and a second electrical state, a MEMS device driver in communication with the MEMS device and being operable to produce high voltage switching logic from an electrical signal, and an optical detector in communication with the MEMS device driver and configured to produce the electrical signal from an optical signal produced by a light source in response to an applied current-based electrical control signal. | 07-12-2012 |
20140184217 | MULTI-NUCLEAR RECEIVING COILS FOR MAGNETIC RESONANCE IMAGING (MRI) - A system includes a multi-nuclear magnetic resonance (MR) receiving coil, wherein the receiving coil includes a frequency tuning component configured operate the receiving coil at either a first frequency or a second frequency. The receiving coil also includes an impedance matching component configured to maintain a substantially constant impedance of the receiving coil when the receiving coil is operated at either the first frequency or the second frequency. Furthermore, the receiving coil is configured to measure a first nucleus when operated at the first frequency, and wherein the receiving coil is configured to measure a second nucleus when operated at the second frequency. | 07-03-2014 |