I-Wen
I-Wen Chang, Taoyuan Shien TW
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20150301564 | LAPTOP COMPUTER - A laptop computer includes a base, a touch screen, a first hinge structure and a second hinge structure. The first hinge structure is pivotally connected with a side of the base. The second hinge structure is pivotally connected with the first hinge structure. The second hinge structure includes a locking part. The locking part detachably fastens to the touch screen. When the locking part fastens to the touch screen and the angle between the touch screen and the base is within 0 degree and a predetermined angle, the second hinge structure rotates relative to the first hinge structure. When the locking part fastens to the touch screen and the angle between the touch screen and the base is larger than the predetermined angle, the first hinge structure and the second hinge structure rotate synchronously relative to the base. | 10-22-2015 |
I-Wen Chen, Xitun Dist. TW
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20110262729 | FUNCTIONALIZATION OF NANOSCALE FIBERS AND FUNCTIONALIZED NANOSCALE FIBER FILMS - This disclosure provides articles that include functionalized nanoscale fibers and methods for functionalizing nanoscale fibers. The functionalized nanoscale fibers may be made by oxidizing a network of nanoscale fibers, grafting one or more molecules or polymers to the oxidized nanoscale fibers, and cross-linking at least a portion of the molecules or polymers grafted to the oxidized nanoscale fibers. The functionalized nanoscale fibers may be used to make articles. | 10-27-2011 |
I-Wen Lee, Tao-Yuan TW
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20100101937 | METHOD OF FABRICATING TRANSPARENT CONDUCTIVE FILM - A method of fabricating transparent conductive film including the following steps is provided. First, a reactive chamber having at least a target and at least a heating device is provided. Subsequentially, a plasma is generated in the reactive chamber, wherein the plasma is located above the target. Next, the plasma is heated by the heating device from a standby temperature to a working temperature. Simultaneously, a hard plastic substrate is passed above the plasma at a specific speed, wherein the particles of the target are bombarded by the plasma so as to form transparent conductive film on the hard plastic substrate. | 04-29-2010 |
20120009392 | Strengthened substrate structure - The substrate according to the invention includes at least one surface coated with an organic buffer layer and the organic buffer layer is provided with a coating layer on a surface thereof opposite to its surface attached to the substrate. The provision of the organic buffer layer diminishes the effect of the coating layer on the strength of the substrate, thereby maintaining the strength of the substrate. | 01-12-2012 |
I-Wen Lee, Chung Li City TW
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20110056244 | METHOD OF STRENGTHENING GLASS PLATE - A method of strengthening glass plate is provided. A plasma treating process is performed on a glass plate so that a surface pore variation of the glass plate after the plasma treating process is reduced relative to the surface pore variation of the glass plate before the plasma treating process, wherein the surface pore variation is a variation degree of surface pores in different unit areas of the glass plate. In the mean time, a melted network crosslinking structure is formed on the surface of the glass plate. Based on the above-mentioned mechanisms, the glass plate is strengthened. The plasma treating process is conducive to strengthen the glass plate whether the plasma treating process is performed before or after the conventional chemical strengthening process. | 03-10-2011 |
20110234507 | INTEGRATED TOUCH PANEL AND MANUFACTURING METHOD THEREOF - The present invention provides an integrated touch panel comprising a transparent substrate, one of an icon or artwork layer, a first layer of optical film, and a first sensing layer. The icon layer or artwork layer is coated on the periphery of one side face of the transparent substrate, and the inner periphery of the icon layer or artwork layer is not perpendicular to the adjacent line of the transparent substrate. The first layer of optical film is stacked on icon layer or artwork layer and the areas on the transparent substrate uncovered with icon layer. The first sensing layer is stacked on the first layer of optical film by sputtering. The interchangeability is included in the patent claim of the present invention. As icon layer or artwork layer is not perpendicular to the transparent substrate, the subsequent cladding of the structures may be completed by sputtering or other methods. | 09-29-2011 |
I-Wen Lee, Industrial Park TW
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20100215931 | ITO layer structure - A ITO layer structure, which is composed of the ITO as the outermost layer and the first anti-reflected layer on the specific side of the transparent substrate, furthermore, the second anti-reflected layer is formed on the opposite side of substrate, can improve the total transmittance. | 08-26-2010 |
I-Wen Lin, Tainan City TW
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20120291677 | REINFORCED PLASTIC PALLET - A reinforced plastic pallet includes a modular platform having top and bottom major walls which respectively have left and right stacked and held segments confronting each other. The stacked and held segments respectively have depression and supported regions. A spacer extends downwardly from each of the supported regions to have a base region confronting the corresponding depression region. A hollow strut extends upwardly from the base region through the corresponding depression region, and has an open end joining with the corresponding depression region. With the hollow struts, the structural strength of the spacers can be increased so as to prevent deformation thereof when the plastic pallet is subjected to a heavy load. | 11-22-2012 |
I-Wen Liu, Taipei City TW
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20090061128 | SILICONE BAKEWARE - A silicone bakeware provided with an upper rim has at least one support wire ring wrapped up in outer surfaces of the silicone bakeware, and plural shuttles fitted and spaced apart on the at least one support wire ring. The shuttles made of a compatible material to silicone rubber are provided with plural tooth-shaped grooves in an outer surface. The at least one support wire ring is in advance placed in groove of a female mold and kept therein at a distance from the inner wall surface of the groove and located in the center of the groove without biasing. In the process of forming the silicone bakeware in a mold by injection molding, the at least one support wire ring is wrapped up in a balanced condition with the silicone rubber material and held by the shuttles to augment its stress, preventing it from disfiguring. | 03-05-2009 |
I-Wen Wu, Hsinchu City TW
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20150194425 | SEMICONDUCTOR DEVICE AND FORMATION THEREOF - A semiconductor device and method of formation are provided herein. A semiconductor device includes a first active region adjacent a first side of a shallow trench isolation (STI) region. The first active region including a first proximal fin having a first proximal fin height adjacent the STI region, and a first distal fin having a first distal fin height adjacent the first proximal fin, the first proximal fin height less than the first distal fin height. The STI region includes oxide, the oxide having an oxide volume, where the oxide volume is inversely proportional to the first proximal fin height. A method of formation includes forming a first proximal fin with a first proximal fin height less than a first distal fin height of a first distal fin, such that the first proximal fin is situated between the first distal fin and an STI region. | 07-09-2015 |
20150194516 | SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF - A semiconductor arrangement and method of forming the same are described. A semiconductor arrangement includes a third metal connect in contact with a first metal connect in a first active region and a second metal connect in a second active region, and over a shallow trench isolation region located between the first active region and a second active region. A method of forming the semiconductor arrangement includes forming a first opening over the first metal connect, the STI region, and the second metal connect, and forming the third metal connect in the first opening. Forming the third metal connect over the first metal connect and the second metal connect mitigates RC coupling. | 07-09-2015 |