Patent application number | Description | Published |
20130294473 | MELTING APPARATUS FOR MELT DECONTAMINATION OF RADIOACTIVE METAL WASTE - Disclosed herein is a melting apparatus for melt-decontaminating radioactive metal waste. The melting apparatus includes a melting furnace, a high frequency generator, a ladle, a bogie, a cooling unit and a dust collector. The melting furnace includes a crucible into which the metal waste is input, and an induction coil which is wound around the crucible to melt the metal waste. The induction coil has a hollow hole in which cooling fluid flows. The high frequency generator applies high-frequency current to the induction coil. The ladle supplies molten metal, from which slag has been removed in the crucible, into molds. The bogie is disposed adjacent to the ladle and is provided with the molds, each of which forms an ingot using the molten metal supplied thereinto. The cooling unit cools the cooling fluid and circulates it along the induction coil. The dust collector filters out dust and purifies gas. | 11-07-2013 |
20130296629 | METHOD OF TREATING RADIOACTIVE METAL WASTE USING MELT DECONTAMINATION - Disclosed herein is a method of treating radioactive metal waste using melt decontamination, wherein radioactive metal waste, which is generated from nuclear fuel processing facilities or nuclear fuel production facilities, and which cannot be easily treated by surface decontamination because it has a complicated geometric shape, and the surface contamination of which cannot be measured, can be treated by melt decontamination. The method is advantageous in that radioactive metal waste, which cannot be treated by conventional surface decontamination, can be treated, so that radioactive metal waste can be recycled, thereby obtaining economic profits, and further in that a large storage space necessary for cutting and then storing radioactive metal waste is not required, and in that excessive manpower and cost are not required. | 11-07-2013 |
Patent application number | Description | Published |
20090047488 | COUNTERFEIT PREVENTION PAPER AND MANUFACTURING METHOD THEREOF - The present invention relates to a counterfeit prevention paper and manufacturing method thereof, and more particularly to currency, securities, official document and several certificates, etc. | 02-19-2009 |
20130095497 | MICROORGANISM FOR QUANTIFYING HOMOCYSTEINE, AND USE THEREOF - Provided are a microorganism for use in quantification of homocysteine and methionine and a method of quantifying homocysteine and methionine in a sample by using the microorganism. | 04-18-2013 |
20140022209 | METHOD FOR DETECTING BIOMOLECULES USING A CAPACITIVE TOUCH SCREEN - There is provided a method of detecting biomolecules using a capacitive touch screen receiving a touch with a conductor as an input signal to perform an output on a display screen, and more particularly to a method of detecting target biomolecules by applying biomolecules having electrical conductivity to a touch panel and detecting a change in capacitance of a surface of a touch panel generated according to the concentration of the biomolecules. | 01-23-2014 |
20140171334 | GENE ANALYSIS METHOD USING SDL-PCR - The present invention relates to a method for analyzing genes using SDL-PCR (separation of displaced ligation probe-based PCR), and more particularly to a method for analyzing genes using SDL-PCR, in which probes comprising a nucleotide sequence complementary to the gene of interest are ligated with each other by ligase, and another probe capable of hybridizing to the probes is hybridized and extended, thereby preparing a template probe, and the template probe for the gene of interest is amplified using universal primers. | 06-19-2014 |
Patent application number | Description | Published |
20130059656 | METHOD, APPARATUS, AND RECORDING MEDIUM FOR PLAYING GAME WITH SERVER TRANSFERRING IN ONLINE GAME ENVIRONMENT - Disclosed are a method, an apparatus, and a recording medium for playing a game with server transferring in an online game environment. The method includes: receiving identification information for login from a first client; transmitting online game environment information to the first client; performing an advance operation of the server transferring for a server transferring of a second client with an outside server; receiving data for playing the game transmitted from the outside server or the second client; transmitting a resulting data of game play, in which the received data is applied to the online game environment, to the outside server or the second client, which has transmitted the data for playing the game; and storing a result of an interaction generated between the first client and the second client in a game history of the first client. | 03-07-2013 |
20130118782 | RADIANT HEAT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced. | 05-16-2013 |
20130188359 | RADIANT HEAT CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT - Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation. | 07-25-2013 |
20130206459 | RADIANT HEAT CIRCUIT BOARD, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT UNIT - Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation. | 08-15-2013 |
20140153221 | PRINTED CIRCUIT BOARD, AND LIGHTING DEVICE AND BACKLIGHT UNIT INCLUDING THE SAME - Provided is a printed circuit board including: a support substrate including a first area in which a light emitting device is mounted, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a through hole passing through the bending part; a connection wiring connected to the light emitting device and disposed on the bending part; and a wiring connected to the connection wiring. | 06-05-2014 |
20140198530 | CIRCUIT BOARD AND FLAT PANEL DISPLAY INCLUDING THE SAME - Provided are a circuit board for irradiating light to a light guide plate and a flat panel display having a structure for efficiently fixing the circuit board and the light guide plate, the circuit board, including: a support substrate comprising a first area and a second area, the second area being bent from the first area; a plurality of light emitting device mounting parts disposed in the first area; and a protective member connecting part of an outer side of the plurality of light emitting device mounting parts. | 07-17-2014 |
20140231122 | EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME - An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board. | 08-21-2014 |
20140290986 | EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME - An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board. | 10-02-2014 |
20140311777 | BENT PRINTED CIRCUIT BOARD FOR BACKLIGHT UNIT - Provided is a bent printed circuit board for a backlight unit, including: a metal plate including a first part, a second part extending from the first part, and a bending part formed between the first part and the second part; an insulating layer on the metal plate; and through holes passing through at least one of the metal plate and the insulating layer and placed on the bending part. | 10-23-2014 |
20140376265 | CIRCUIT BOARD AND LIGHTING DEVICE HAVING THE CIRCIUT BOARD - Provided is a circuit board including: a support substrate; a plurality of light emitting devices mounted on the support substrate; and a device protection portion surrounding one of the light emitting devices, or three or more surfaces of the plurality of light emitting devices. | 12-25-2014 |
20150029753 | LIGHTING DEVICE AND DISPLAY DEVICE HAVING THE LIGHTING DEVICE - Provided is a lighting device, including: a circuit board in which light emitting elements are mounted to one surface of a supporting substrate; a substrate housing disposed to be spaced apart from another surface opposite to the one surface of the supporting substrate; and a distance regulating portion formed between the circuit board and the substrate housing to adjust a spaced distance between the circuit board and the substrate housing according to movement of the circuit board, wherein the distance regulating portion functions to fix the circuit board to the substrate housing via a fixing element formed in the circuit board and the substrate housing. | 01-29-2015 |
20150092446 | CIRCUIT BOARD AND LIGHTING DEVICE HAVING THE CIRCUIT BOARD - Provided is a circuit board including: a support substrate including a first region and a second region extending to be bent from the first region; light emitting devices mounted to the first region of the support substrate; and a bending portion bent between the first region and the second region, wherein the bending portion comprises: an interconnection line arrangement portion that crosses an interconnection line; and an interconnection line protection portion disposed on the periphery of the interconnection line, wherein the interconnection line protection portion protrudes more than the interconnection line arrangement portion. | 04-02-2015 |
Patent application number | Description | Published |
20080295928 | Method for Manufacturing High Strength Steel Strips with Superior Formability and Excellent Coatability - A method for manufacturing a steel sheet used for structural members, elements, etc. of automobiles including a front side member, pillar, and the like, and more particularly, a method for manufacturing a steel sheet having a high strength and formability as well as hot-dip galvanizing properties is disclosed. In the method, after an aluminum killed steel slab, which comprises, by weight %,: C: 0.05% to 0.25%; Si: 0.1% to 1.5%; S: 0.02% or less; N: 0.01% or less; Al: 0.02% to 2.0%; Mn: 1.0% to 2.5%; P: 0.001% to 0.1%; Sb: 0.005% to 0.10%; the balance of Fe and other unavoidable impurities, is subjected to a homogenization treatment at a temperature range of 1050° C. to 1300° C., the aluminum killed steel slab is subjected to a hot rolling under a finishing hot rolling temperature of 850° C. to 950° C. and a coiling temperature of 400° C. to 700° C., followed by a cold rolling under a cold rolling reduction ration of 30% to 80%, and annealing the cold rolled steel sheet. | 12-04-2008 |
20090202382 | HIGH MANGANESE STEEL STRIPS WITH EXCELLENT COATABILITY AND SUPERIOR SURFACE PROPERTY, COATED STEEL STRIPS USING STEEL STRIPS AND METHOD FOR MANUFACTURING THE STEEL STRIPS - A high-ductility, high-strength and high Mn steel strip used for steel strips of automobiles requiring superior formability and high strength, a plated steel strip produced by using the same, and a manufacturing method thereof are disclosed. The high Mn steel strip comprises, by weight %, 0.2˜1.5% of C, 10˜25% of Mn, 0.01˜3.0% of Al, 0.005˜2.0% of Si, 0.03% or less of P, 0.03% or less of S, 0.040% or less of N, and the balance of Fe and other unavoidable impurities. The high-ductility, high-strength and high Mn steel strip, and the plated steel strip produced by using the same have superior surface properties and plating characteristics. | 08-13-2009 |