Patent application number | Description | Published |
20090294171 | CASE ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE WITH SAME - The present invention provides a case assembly structure of an electronic device. The case assembly structure includes a first case, a second case and a heat-dissipating element. The first case has an engaging hole and a first opening. The second case has an engaging element engaged with the engaging hole of the first case and a second opening aligned with the first opening of the first case. The heat-dissipating element includes a fastening hole aligned with the first opening of the first case and the second opening of the second case. The first case, the second case and the heat-dissipating element are combined together by penetrating a fastening element through the first opening, the second opening and the fastening hole. | 12-03-2009 |
20090327768 | POWER SUPPLY APPARATUS AND MODULAR POWER CONNECTION INTERFACE THEREOF - A power supply apparatus includes a power converting circuit and a modular power connection interface. By the power converting circuit, an input voltage is converted into several output voltages required for powering corresponding electronic devices. The modular power connection interface includes an output member and a connecting member. The output member includes a plurality of pins and a daughter board. The pins are arranged on at least one surface of the daughter board and electrically connected to the power converting circuit so as to transmit the output voltages. The connecting member has a first connecting part and multiple second connecting parts. The first connecting part is electrically connected with the pins of the output member, and the second connecting parts are electrically connected with corresponding electronic devices, so that the output voltages are transmitted from the power converting circuit to the electronic devices through the modular power connection interface. | 12-31-2009 |
20100003844 | ELECTRICAL CONNECTOR HAVING LATCHING MECHANISM - An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body includes a receiving part. The receiving part is arranged at a front edge of the isolation body and has a first engaging element. The latching mechanism has a second engaging element engaged with the first engaging element, so that the latching mechanism is fixed onto the isolation body. | 01-07-2010 |
20100014223 | REMOVABLE ELECTRONIC DEVICE WITH HANDLE STRUCTURE - The present invention is related to a removable electronic device with handle structure suitable for an electronic apparatus, including a housing having an accommodating trough, a handle structure, an elastic engaging device, and an engaging component corresponding to the elastic engaging device, wherein the handle structure is pivotally mounted on and received in the accommodating trough through an engagement between the elastic engaging device and the engaging component. | 01-21-2010 |
20110155422 | WIRE INSULATING TERMINAL AND CIRCUIT BOARD MODULE EMPLOYING SAME - There is disclosed a wire insulating terminal which includes a wire insulating terminal member having an inner insulating wall and an outer insulating wall, and at least one conducting wire having a bared wire end. The inner insulating wall forms a perforation channel with a first opening and a second opening which are respectively disposed on the two opposite ends of the perforation channel to accommodate the at least one conducting wire with the bared wire end partially protruding out from the second opening. The outer insulating wall includes a first connecting member and a second connecting member which are configured to be corresponsive to and engageable with each other. | 06-30-2011 |
20130279117 | Heat Dissipating Structure - A heat dissipating structure includes a heat dissipating element, a first insulating element, a second insulating element, an electronic element and at least one fixing element. The first insulating element is disposed on one side of the heat dissipating element, while the second insulating element is disposed on another side of the heat dissipating element. The electronic element is disposed on the first insulating element. The fixing element fixes the electronic element on the heat dissipating element. | 10-24-2013 |
20140254104 | HEAT DISSIPATING MODULE - A heat dissipating module comprises at least one substrate and a heat dissipating layer. The substrate has a first surface and a second surface. The heat dissipating layer is disposed on the second surface. At least one heat generating device is electrically connected to the first surface, and the heat dissipating module is disposed on a main board uprightly. The heat dissipating module is advantageous for shortening the manufacturing time, raising the efficiency of automated production, decreasing the assembling cost and further achieving high heat dissipating efficiency. | 09-11-2014 |
20150181765 | HEAT DISSIPATING MODULE AND ASSEMBLING METHOD THEREOF - A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away. | 06-25-2015 |