Hui, TW
David Hui, Taipei TW
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20080258674 | Quickly charging power supply apparatus - A power supply apparatus includes a power source; and at least a capacitor module formed by connecting a plurality of capacitors in series, having an input connector connected to a municipal power source supply or connected to a cigarette-lighter receptacle of a car for inputting direct current for quickly charging the capacitors of the capacitor module, and having an output connector connectable to a portable electric device including cellular phone and other portable devices each having rechargeable battery provided therein for quickly charging the portable electric device for keeping its continuous operation. | 10-23-2008 |
20090064775 | VEHICLE PROTECTION DEVICE DIRECTLY FORMED ON INFLATION VALVE - A vehicle protection device includes a wiper externally mounted on the wheel rim as fastened by an inflation valve fixed in the wheel rim, and a sensor holder engaged with the inflation valve and positioned inside the wheel rim for holding a tire pressure sensor within the wheel rim and within a tire; whereby the sensor will sense the tire pressure for safely monitoring the tire pressure; and the wiper will scrape the rain water (or snow) outwardly from the wheel for enhancing driving safety. | 03-12-2009 |
20110229284 | Anti-wearing nut and bolt - An anti-wearing nut or bolt including a plurality of polygonal sides circumferentially formed on a head portion of the nut or bolt and; each polygonal side including: two inclined sub-sides respectively inclined outwardly convergently from opposite apexes of each polygonal side, each inclined sub-side extrapolatively defining a small biasing acute angle between each inclined sub-side and a corresponding socket side, and an intermediate sub-side transversely intersecting the two inclined sub-sides; whereby upon a clockwise or counter-clockwise rotation of the socket, one inclined sub-side of the nut or bolt will be planarly engaged with each socket side, without being linearly bitten or dogged, to thereby prevent wearing or damage of the apexes of the nut or bolt. | 09-22-2011 |
20130032009 | Quickly coupling socket - A socket includes a plurality of protrusions circumferentially disposed around a circular top opening in a top portion of the socket, whereby upon insertion of a driving (or coupling) shaft of a spanner with square head portion into the square hole in the socket, the square head portion of the driving shaft will be respectively biased or thrusted by the protrusions and then smoothly guided or slid through a sloping surface tapered downwardly radially from the circular opening into the square hole for quickly coupling the driving shaft of the spanner with the square hole in the socket. | 02-07-2013 |
20140097753 | LED Lighting system for self-dissipation of heat - A LED lighting system includes: a power unit for providing a power supply source for the lighting system, a LED circuit connected to the power unit for illuminating the light emitting diodes of the LED circuit, a heat control unit connected between the power unit and the LED circuit for controlling heat as produced, and a heat dissipating device thermally connected to the heat control unit for outwardly dissipating the heat produced by the lighting system for preventing light attenuation or damage of the light emitting diodes. | 04-10-2014 |
20140251091 | Multiple-in-one Socket - A multiple-in-one socket includes a socket body having a first gradational cavity recessed in a first end of the socket body, and a second gradational cavity recessed in a second end of the socket body opposite to the first gradational cavity; each gradational cavity including a plurality of polygonal holes gradationally contracted in sizes inwardly from an outermost hole towards an innermost hole; whereby a plurality of polygonal holes having plurality of hole sizes may be conveniently chosen for fastening a bolt or nut by correspondingly matching the bolt (or nut) size with the polygonal-hole size. | 09-11-2014 |
Keuing Hui, Hsinchu TW
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20140033159 | Method of Optimizing Design for Manufacturing (DFM) - The present disclosure describes a method of optimizing a design for manufacture (DFM) simulation. The method includes receiving an integrated circuit (IC) design data having a feature, receiving a process data having a parameter or a plurality of parameters, performing the DFM simulation, and optimizing the DFM simulation. The performing the DFM simulation includes generating a simulation output data using the IC design data and the process data. The optimizing the DFM simulation includes generating a performance index of the parameter or the plurality of parameters by the DFM simulation. The optimizing the DFM simulation includes adjusting the parameter or the plurality of parameters at outer loop, middle loop, and the inner loop. The optimizing the DFM simulation also includes locating a nadir of the performance index of the parameter or the plurality of parameters over a range of the parameter or the plurality of parameters. | 01-30-2014 |
Keung Hui, Hsinchu City TW
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20150081081 | SEMICONDUCTOR FABRICATION COMPONENT RETUNING - Among other things, one or more systems and techniques for retuning a semiconductor fabrication component are provided. The semiconductor fabrication component, such as an advanced process control (APC) component, is configured to evaluate or adjust various fabrication parameters associated with semiconductor fabrication processing. Processing data associated with the semiconductor fabrication component is evaluated to formulate performance indices used to evaluate performance of parameters used by the semiconductor fabrication component. One or more fabrication process change simulations are performed to generate a component operating behavior data structure indicating how different values for the parameters result in improved or degraded performance by the semiconductor fabrication component. In this way, the component operating behavior data structure is evaluated to identify tuning values for the parameters that are used to retune the semiconductor fabrication component. | 03-19-2015 |
Keung Hui, Hsin-Chu TW
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20100093259 | Chemical Mechanical Polish Process Control for Improvement in Within-Wafer Thickness Uniformity - A method of performing chemical mechanical polish (CMP) processes on a wafer includes providing the wafer; determining a thickness profile of a feature on a surface of the wafer; and, after the step of determining the thickness profile, performing a high-rate CMP process on the feature using a polish recipe to substantially achieve a within-wafer thickness uniformity of the feature. The polish recipe is determined based on the thickness profile. | 04-15-2010 |
20120009692 | System and Method of Dosage Profile Control - A system and method for controlling a dosage profile is disclosed. An embodiment comprises separating a wafer into components of a grid array and assigning each of the grid components a desired dosage profile based upon a test to compensate for topology differences between different regions of the wafer. The desired dosages are decomposed into directional dosage components and the directional dosage components are translated into scanning velocities of the ion beam for an ion implanter. The velocities may be fed into an ion implanter to control the wafer-to-beam velocities and, thereby, control the implantation. | 01-12-2012 |
20120016509 | Semiconductor Processing Dispatch Control - An embodiment is a method for semiconductor processing control. The method comprises identifying a key process stage from a plurality of process stages based on a parameter of processed wafers, forecasting a trend for a wafer processed by the key process stage and some of the plurality of process stages based on the parameter, and dispatching the wafer to one of a first plurality of tools in a tuning process stage. The one of the first plurality of tools is determined based on the trend. | 01-19-2012 |
20120164918 | Chemical Mechanical Polish Process Control for Improvement in Within-Wafer Thickness Uniformity - A method of performing chemical mechanical polish (CMP) processes on a wafer includes providing the wafer; determining a thickness profile of a feature on a surface of the wafer; and, after the step of determining the thickness profile, performing a high-rate CMP process on the feature using a polish recipe to substantially achieve a within-wafer thickness uniformity of the feature. The polish recipe is determined based on the thickness profile. | 06-28-2012 |
20130013097 | Semiconductor Processing Dispatch Control - An embodiment is a method for semiconductor processing control. The method comprises identifying a key process stage from a plurality of process stages based on a parameter of processed wafers, forecasting a trend for a wafer processed by the key process stage and some of the plurality of process stages based on the parameter, and dispatching the wafer to one of a first plurality of tools in a tuning process stage. The one of the first plurality of tools is determined based on the trend. | 01-10-2013 |
20130068162 | System and Method of Dosage Profile Control - A system and method for controlling a dosage profile is disclosed. An embodiment comprises separating a wafer into components of a grid array and assigning each of the grid components a desired dosage profile based upon a test to compensate for topology differences between different regions of the wafer. The desired dosages are decomposed into directional dosage components and the directional dosage components are translated into scanning velocities of the ion beam for an ion implanter. The velocities may be fed into an ion implanter to control the wafer-to-beam velocities and, thereby, control the implantation. | 03-21-2013 |
20140303765 | Semiconductor Processing Dispatch Control - An embodiment is a method for semiconductor processing control. The method comprises identifying a key process stage from a plurality of process stages based on a parameter of processed wafers, forecasting a trend for a wafer processed by the key process stage and some of the plurality of process stages based on the parameter, and dispatching the wafer to one of a first plurality of tools in a tuning process stage. The one of the first plurality of tools is determined based on the trend. | 10-09-2014 |
Keung Hui, Hsinchu TW
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20110174991 | SCANNING METHOD AND SYSTEM USING 2-D ION IIMPLANTER - An ion implanter system has a movable wafer support for holding a semiconductor wafer and a beam source that generates a beam for implanting ions in the semiconductor wafer while the wafer is moving. A plurality of path segments are identified, through which the wafer support is to move to expose the semiconductor wafer to the ion beam. A first position and a second position are identified for each respective one of the plurality of path segments, such that, when the wafer is in each first position and each second position, a perimeter of the beam projected in a plane of the wafer is tangent to a perimeter of the wafer. The ion implanter is configured to automatically move the wafer along each of the plurality of path segments, starting at the respective first position on each respective path segment and stopping at the respective second position on the same segment, so as to expose the wafer to the beam for implanting ions in the wafer. | 07-21-2011 |
20120129431 | APPARATUS AND METHOD FOR TARGET THICKNESS AND SURFACE PROFILE UNIFORMITY CONTROL OF MULTI-HEAD CHEMICAL MECHANICAL POLISHING PROCESS - An apparatus and method for providing target thickness and surface profile uniformity control of a multi-head chemical mechanical polishing (CMP) process is disclosed. An exemplary method includes providing at least two wafers; determining a surface profile of each of the at least two wafers; determining an operation mode for a chemical mechanical polishing (CMP) process based on the surface profiles of the at least two wafers; determining a CMP polishing recipe for each of the at least two wafers based on the operation mode; and performing the CMP process on the at least two wafers based on the determined CMP polishing recipes. | 05-24-2012 |
Ko Wen Hui, Taipei TW
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20090140425 | Chip Package - The present provides the improved structure of a chip package, comprising an electrical contact surface of at least a chip configured with a under fill layer, the first solder mask layer, the first metal layer, dielectric material layer, the second metal layer, the second solder mask layer, and metal ball layer, characterized in the electrical contact surfaces among the first metal layer, the second metal layer, and the chip accomplish the electrical connection by employing the contacts of the surfaces of the conducting layers | 06-04-2009 |
Ko Wen Hui, Chong-Ho City TW
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20090141006 | TOUCH SCREEN SYSTEM WITH LIGHT REFLECTION - The present invention discloses a touch screen system comprising LED infrared transceivers installed at appropriate positions on left and right sides of the screen respectively, and a transmitter end of the transceiver transmits LED infrared waves and spreads spherical waves all over the surface of the screen. If the surface of the screen receives an intrusion from a touch control element, the spherical waves will be interfered, interrupted and reflected, and the wave frequency of the reflection will be detected by the receiver end of the transceiver. After the receiver end has received a reflection signal, the position coordinates of the touch control element can be analyzed through the operation of a core logical unit. A display module is provided for showing the movement path of the touch control element in images or lines, so as to provide a touch screen with low manufacturing cost and long life expectancy. | 06-04-2009 |
Lap-Shun Hui, New Taipei TW
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20150026232 | MEDICATIONS DIRECTING SYSTEM AND METHOD WITH CLOUD SERVER - A monitoring system includes a cloud server, a first terminal, a second terminal, and a third terminal. The first, second and third terminal are connected to the cloud server. The cloud server includes an updating module and a storing module. The first terminal includes an obtaining module. The second terminal includes an analyzing module. The third terminal includes a downloading module. The obtaining module is used obtain a Body Mass Index to the cloud server, and the analyzing module is used to receive an updated dosage of reagents according to the Body Mass Index to the cloud server. The updating module is used to update an original dosage of reagents in the storing module according the updated dosage of reagents, and the downloading module is used to download the updated dosage of reagents, for allowing the third terminal to dispense pills. The disclosure further provides a monitoring method. | 01-22-2015 |
20150028048 | AUTOMATIC PILL GRASPING APPARATUS - An automatic pill grasping apparatus includes an enclosure, a control chip, a pill grasping mechanism, and a pill storage mechanism. The enclosure includes a base. The pill grasping mechanism includes a grasping arm, a nozzle, and a driving mechanism. The nozzle being is engaged with the grasping arm, and the driving mechanism is attached to the base. The pill storage mechanism includes a plurality of pill storage cases for storing pills and an actuating mechanism attached to the base. The control chip is configured to control the actuating mechanism to rotate the plurality of pill storage cases in a first plane substantially parallel to the base and control the driving mechanism to rotate the grasping arm in a second plane perpendicular to the first plane, for rotating the nozzle to stretch into the one of the plurality of pill storage cases to pick a pill. | 01-29-2015 |
20150028050 | AUTOMATIC PILL GRASPING APPARATUS AND METHOD - A pill grasping method comprises rotating a grasping arm with a nozzle to a predetermined initial position driven by a driving mechanism, rotating a number of pill storage cases to position one of the pill storage cases with a set number of pills to a predetermined grasping pill position driven by an actuating mechanism, rotating the grasping arm to enter into the corresponding pill storage case, starting a pump to generate a vacuum in the nozzle for sucking a pill, and determining if an actual pressure value in a pipe connecting the nozzle to the pump is less than a predetermined pressure value. The grasping arm is rotated to the predetermined initial position when the actual pressure value is less than the predetermined pressure value. | 01-29-2015 |
Ouyang Hui, Chubei City TW
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20110086502 | METHOD FOR FABRICATING A GATE STRUCTURE - An method of fabricating the gate structure comprises: sequentially depositing and patterning a dummy oxide layer and a dummy gate electrode layer on a substrate; surrounding the dummy oxide layer and the dummy gate electrode layer with a nitrogen-containing dielectric layer and an interlayer dielectric layer; removing the dummy gate electrode layer; removing the dummy oxide layer by exposing a surface of the dummy oxide layer to a vapor mixture comprising NH3 and a fluorine-containing compound at a first temperature; heating the substrate to a second temperature to form an opening in the nitrogen-containing dielectric layer; depositing a gate dielectric; and depositing a gate electrode. | 04-14-2011 |
20110143510 | METHOD OF CONTROLLING GATE THICKNESS IN FORMING FINFET DEVICES - A method of forming a FinFET device is provided. In one embodiment, a fin is formed on a substrate. A gate structure is formed over the fin, the gate structure having a dielectric layer and a conformal first polysilicon layer formed above the dielectric layer. An etch stop layer is formed above the first polysilicon layer and thereafter a second polysilicon layer is formed above the etch stop layer. The second polysilicon layer and the etch stop layer are removed. A metal layer is formed above the first polysilicon layer. The first polysilicon layer is reacted with the metal layer to silicide the first polysilicon layer. Any un-reacted metal layer is thereafter removed and source and drain regions are formed on opposite sides of the fin. | 06-16-2011 |
20120018817 | METHOD FOR FABRICATING A GATE STRUCTURE - An method of fabricating the gate structure comprises: sequentially depositing and patterning a dummy oxide layer and a dummy gate electrode layer on a substrate; surrounding the dummy oxide layer and the dummy gate electrode layer with a nitrogen-containing dielectric layer and an interlayer dielectric layer; removing the dummy gate electrode layer; removing the dummy oxide layer by exposing a surface of the dummy oxide layer to a vapor mixture comprising NH3 and a fluorine-containing compound at a first temperature; heating the substrate to a second temperature to form an opening in the nitrogen-containing dielectric layer; depositing a gate dielectric; and depositing a gate electrode. | 01-26-2012 |
Shiu Wing Hui, Taichung TW
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20130062417 | MEMORY CARD SUPPORTING NEAR FIELD COMMUNICATION THROUGH SINGLE WIRE PROTOCOL - A memory card supporting near field communication through single wire protocol includes a power management unit, an interface control unit, a data storage unit, a power protection unit and an intelligent unit. The power protection unit is interposed between the power management unit and a near field voltage source of the near field communication unit to prevent short-circuit induced by direct connection there between. Moreover, direct connection between the power management unit and the intelligent unit can also be prevented, which can protect against bursts of excessive voltages or currents that may damage the data in the intelligent unit. Additionally, the power protection unit can prevent power leakage from the power management unit and the near field voltage source, which solves the problem of improperly driving near field communication or insufficient power supply to the interface control unit or intelligent unit. | 03-14-2013 |
Yang-Jian Hui, Taichung City TW
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20140028167 | EXPANDABLE AND COLLAPSIBLE CABINET - An expandable and collapsible cabinet contains a body being an elongated plate and including plural board portions and a plurality of bending portions; each bending portion integrally connecting with and between two abutting board portions, and between the each bending portion and each board portion is defined a grooved area to provide a collapsible space; a bottom cover; a top cover; when the body is folded into a rectangular frame by folding four grooved areas 90 degrees, the bottom cover and the top cover are covered on a bottom end and a top end of the body. | 01-30-2014 |
Yeh Hsin Hui, Hsinchu City TW
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20090045478 | CMOS image sensor package structure - The present invention provides a complementary metal oxide semiconductor (CMOS) sensor package structure that includes a carrier substrate having a top surface and a bottom surface; a metal layer placed on the top surface of the carrier substrate and exposed a portion of the top surface of the metal layer; the plurality of CMOS chips having an active surface thereon formed on a portion of the top surface of the metal layer, and being exposed a portion of the active surface; a plurality of connecting elements formed on the bottom surface of the plurality of CMOS chips and a portion of the top surface of the metal layer; a molding material covers a portion of the top surface of the carrier substrate, a plurality of the connecting elements and the bottom surface of each of the plurality of CMOS chips and a plurality of the conductive elements formed on the top of the plurality of connecting elements on the metal layer. | 02-19-2009 |
Zhiqiang Hui, Hsin-Tien TW
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20110099305 | Universal Serial Bus Host Control Methods and Universal Serial Bus Host Controllers - A USB host control method is provided for a USB host controller. The USB host controller includes a USB device and a buffer, the USB device includes one or more endpoints. The USB host control method includes the steps of: storing first output data to be sent to a first endpoint into one or more buffer units used for the first endpoint; sending the first output data to the first endpoint; and when a first predetermined response from the first endpoint is received, configuring fake releasing labels and information tags corresponding to the first endpoint in the one or more buffer units, and not releasing the one or more buffer units. | 04-28-2011 |
Zhiqiang Hui, Taipei TW
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20110093640 | Universal Serial Bus Host Controller and Control Method Thereof - A USB host controller is provided. The USB host controller is capable of communicating with multiple USB apparatuses having endpoints and sends a request to a first endpoint. The USB host controller includes a first storage and a first control unit. The first control unit stores endpoint information from the first endpoint into the first storage when the first endpoint issues an unready transaction packet in response to the request. The unready transaction packet indicates that the first endpoint is not ready. | 04-21-2011 |